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| 型号： | MCZ33879EKR2 |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 6/23页 |
| 文件大小： | 0K |
| 描述： | IC SWITCH HI/LO SIDE 16B 32-SOIC |
| 标准包装： | 1,000 |
| 类型： | 高端/低端驱动器 |
| 输入类型： | SPI |
| 输出数： | 8 |
| 导通状态电阻： | 750 毫欧 |
| 电流 - 峰值输出： | 1.2A |
| 电源电压： | 5.5 V ~ 26.5 V |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 32-BSOP（0.295"，7.50mm 宽）裸露焊盘 |
| 供应商设备封装： | 32-SOIC 裸露焊盘 |
| 包装： | 带卷 (TR) |
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 3. 33879 Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Ratings
Symbol
Value
Unit
ELECTRICAL RATINGS
VDD Supply Voltage (1)
V DD
- 0.3 to 7.0
V DC
CS , DI, DO, SCLK, IN5, IN6, and EN
Voltage (1)
VPWR Supply
–
V PWR
- 0.3 to 7.0
V DC
V DC
33879
33879A
-16 to 40
-16 to 45
Output Clamp
Energy (2)
E CLAMP
50
mJ
ESD Voltage
V
THERMAL RATINGS
Operating Temperature
Ambient
Junction
Case
Human Body Model 33879
Machine Model 33879
Human Body Model 33879A
Machine Model 33879A
V ESD1
V ESD2
V ESD1
V ESD2
T A
T J
T C
± 450
±100
±2000
±200
- 40 to 125
- 40 to 150
- 40 to 125
? C
Storage Temperature
T STG
- 55 to 150
? C
Power Dissipation
P D
1.7
W
Thermal Resistance
? C/W
Junction to Ambient
Between the Die and the Exposed Die Pad
R ? JA
R ? JC
71
1.2
Peak Package Reflow Temperature During Reflow (5) , (6)
T PPRT
°C
Notes
1. Exceeding these limits may cause malfunction or permanent damage to the device.
2. Maximum output clamp energy capability at 150 ? C junction temperature using single non-repetitive pulse method with I = 350 mA.
3. ESD1 testing is performed in accordance with the Human Body Model (C ZAP = 100 pF, R ZAP = 1500 ? ), ESD2 testing is performed in
accordance with the Machine Model (C ZAP = 200 pF, R ZAP = 0 ? ).
4.
5.
6.
Maximum power dissipation at T A = 25 ? C with no heatsink used.
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes
and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.
33879
Analog Integrated Circuit Device Data ?
6
Freescale Semiconductor
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