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参数资料
| 型号： | MCZ33996EKR2 |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 20/24页 |
| 文件大小： | 0K |
| 描述： | IC SWITCH LOSIDE 16-OUTPT 32SOIC |
| 标准包装： | 1,000 |
| 类型： | 低端 |
| 输出数： | 16 |
| Rds（开）： | 550 毫欧 |
| 内部开关： | 是 |
| 电流限制： | 1.2A |
| 输入电压： | 5 V ~ 27 V |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 32-BSOP（0.295"，7.50mm 宽）裸露焊盘 |
| 供应商设备封装： | 32-SOIC 裸露焊盘 |
| 包装： | 带卷 (TR) |
ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 2.0)
ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 2.0)
Introduction
This thermal addendum is provided as a supplement to the MC33996 technical
datasheet. The addendum provides thermal performance information that may be
critical in the design and development of system applications. All electrical,
application, and packaging information is provided in the datasheet.
Packaging and Thermal Considerations
The MC33996 is offered in a 32 pin SOICW exposed pad, single die package.
There is a single heat source (P), a single junction temperature (T J ), and thermal
resistance (R θ JA ).
33996EK
32-PIN
SOICW-EP
T J
=
R θ JA
.
P
EK (PB-FREE) SUFFIX
98ARL10543D
The stated values are solely for a thermal performance comparison of one
package to another in a standardized environment. This methodology is not meant
to and will not predict the performance of a package in an application-specific
environment. Stated values were obtained by measurement and simulation
according to the standards listed below.
Standards
Table 7. Thermal Performance Comparisons
32-PIN SOICW-EP
Note For package dimensions, refer to
the 33996 data sheet.
R θ JA
Thermal Resistance
[ ° C/W]
29
*All Measurements
are in Millimeters
1.0
R θ JB
9.0
1.0
R θ JA (1) , (4)
R θ JC (5)
69
2.0
0.2
0.2
Notes:
1. Per JEDEC JESD51-2 at natural convection, still air
condition.
2. 2s2p thermal test board per JEDEC JESD51-5 and
JESD51-7.
3. Per JEDEC JESD51-8, with the board temperature on the
center trace near the center lead.
4. Single layer thermal test board per JEDEC JESD51-3 and
JESD51-5.
5. Thermal resistance between the die junction and the
exposed pad surface; cold plate attached to the package
bottom side, remaining surfaces insulated.
32 Pin SOICW-EP
0.65 Pitch
11.0 mm x 7.5mm Body
4.6 mm x 5.7 mm Exposed Pad
Figure 14. Surface Mount for SOICW Exposed Pad
33996
Analog Integrated Circuit Device Data
20
Freescale Semiconductor
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相关代理商/技术参数 |
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| MCZ33998EGR2 | 功能描述:开关变换器、稳压器与控制器 2.6/5.0V SWITCHING POWER RoHS:否 制造商:Texas Instruments 输出电压:1.2 V to 10 V 输出电流:300 mA 输出功率: 输入电压:3 V to 17 V 开关频率:1 MHz 工作温度范围: 安装风格:SMD/SMT 封装 / 箱体:WSON-8 封装:Reel |
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