参数资料
型号: MEC1-160-02-F-D-EM2
厂商: Samtec Inc
文件页数: 1/1页
文件大小: 0K
描述: CONN EDGE CARD DL 120POS SMD
标准包装: 1
系列: MEC1
卡类型: 非指定 - 双边
类型: 母头
位置数: 120
卡厚度: 0.062"(1.57mm)
行数: 2
间距: 0.039"(1.00mm)
安装类型: 表面贴装
端子: 焊接
触点材料: 磷青铜
触点表面涂层:
触点涂层厚度: 3µin(0.08µm)
触点类型:: 环形波纹管
颜色:
包装: 管件
材料 - 绝缘体: 液晶聚合物(LCP)
工作温度: -55°C ~ 125°C
读数:
F-214
(1,00 mm) .0394"
MEC1–130 –02 –L–D –EM2
MEC1–120 –02 –L–D –RA1–SL
MEC1–120 –02 –F –D –EM2
MEC1-RA, MEC1-EM SERIES
RIGHT ANGLE/EDGE MOUNT SOCKETS
SPECIFICATIONS
For complete speci?cations and
MEC1
1
POSITIONS
PER ROW
CARD
SLOT
PLATING
OPTION
D
RA1
NP
SL
recommended PCB layouts see
www.samtec.com?MEC1-RA
.062" card
05, 08, 20, 30,
40, 50, 60, 70
.470
(8,89)
.320
–NP
Leave Blank for
ALSO
AVAILABLE
(MOQ Required)
Note: While optimized for 50 Ω
? Elevated body
Insulator Material:
Black LCP
Contact Material:
Phosphor Bronze
Plating: Au or Sn over
50μ" (1,27 μm) Ni
Current Rating:
1.6 A per pin
(2 adjacent pins powered)
Operating Temp Range:
-55°C to +125°C
Insertion Depth:
(5,84 mm) .230" to
(8,13 mm) .320"
RoHS Compliant: Yes
Processing:
Lead–Free Solderable: Yes
SMT Lead Coplanarity:
(0,10 mm) .004" max (05-40)
(0,15 mm) .006" max (50-70)
Mates with:
.350
(No. of Positions + 2) x
(1,00) .03937 + (2,54) .100
02 (0,36) .014
(1,60 mm) –02
= (1,60 mm)
.062"
thick card
(11,68) (11,94)
.460
(8,13)
(6,81)
–F
= Gold ?ash
on contact,
Matte Tin
on tail
–L
= 10μ"
(0,25 μm)
Gold on
contact,
Matte Tin
on tail
POSITIONS POLARIZED
PER ROW POSITIONS
05 3, 4 = No Polarization
08 5, 6 (8 positions only)
20 15, 16
30 21, 22 polarization
40 31, 32
50 41, 42
60 31, 32, 63 & 64
70 53, 54, 115 & 116
applications, this connector
with alternative signal/ground height
patterns may also perform well in ? Other platings
certain 75 Ω applications. Contact
Samtec for further information. Contact Samtec.
(1,00)
(No. of Positions + 2)
x (1,00) .03937
DIA
(0,64) MEC1-RA
6,81 mm Stack Height
RECOGNITIONS
For complete scope of
recognitions see
www.samtec.com/quality
01
.03937
(1,24)
.049
Note: Some sizes, styles and
options are non-standard,
non-returnable.
.268
(1,78)
.070 (2,51) (1,27)
.099 .050
(3,12) .123
APPLICATION
.025 Rated @ 3dB Insertion Loss*
Single-Ended Signaling 4.5 GHz / 9 Gbps
Differential Pair Signaling 5.5 GHz / 11 Gbps
*Performance data includes effects of a non-optimized PCB.
Complete test data available at www.samtec.com?MEC1-RA
or contact sig@samtec.com
Samtec recommends that pads
on the mating board be Gold plated.
SPECIFICATIONS
For complete speci?cations and
recommended PCB layouts see
MEC1
1
POSITIONS
PER ROW
02
PLATING
OPTION
D
EM2
NP
www.samtec.com?MEC1-EM
Insulator Material:
Black LCP
Contact Material:
Mates with:
(1,60 mm)
Phosphor Bronze
Plating:
Au or Sn over
50μ" (1,27 μm) Ni
Current Rating:
1.8 A per pin
(2 adjacent pins powered)
Operating
Temp Range:
-55°C to +125°C
Insertion Depth:
(5,84 mm) .230" to
(8,13 mm) .320"
RoHS Compliant:
Yes
Lead–Free Solderable:
.062" card
ALSO
AVAILABLE
(MOQ Required)
? Edge mount leads
for (0,80 mm) .031"
thick board
? Other platings
Contact Samtec.
(6,81)
.268
05, 08, 20, 30,
40, 50, 60, 70
(No. of Positions + 2) x
(1,00) .03937 + (12,45) .490
02
01
(No. of Positions + 2)
x (1,00) .03937
–F
= Gold ?ash on contact,
Matte Tin on tail
–L
= 10μ" (0,25 μm) Gold on contact,
Matte Tin on tail
Note: While optimized for 50 Ω applications,
this connector with alternative signal/ground
patterns may also perform well in certain
75 Ω applications. Contact Samtec for
further information.
–NP
= No Polarization
(8 positions only)
Leave Blank for
polarization
POSITIONS POLARIZED
PER ROW POSITIONS
05 3, 4
08 5, 6
20 15, 16
Yes
30
21, 22
RECOGNITIONS
(8,89)
.350
(8,13)
.320
40
50
31, 32
41, 42
(1,19) ± (0,38)
For complete scope of
recognitions see
www.samtec.com/quality
Note: Some sizes,
styles and options
are non-standard,
non-returnable.
(4,57)
.180
(3,15)
.124
(1,00)
.03937
(0,36)
.014
(4,70)
.185
(5,21)
.205
.047 .015
60
70
31, 32, 63
& 64
53, 54, 115
& 116
WWW.SAMTEC.COM
138
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