参数资料
型号: MECT-135-01-M-D-RA1
厂商: Samtec Inc
文件页数: 1/1页
文件大小: 0K
描述: CONN RECEPT XFP 70POS SMD R/A
标准包装: 1
系列: MECT
卡类型: 非指定 - 双边
类型: 母头
位置数: 70
卡厚度: 0.039"(1.00mm)
行数: 2
间距: 0.031"(0.80mm)
特点: 板导轨
安装类型: 表面贴装,直角
端子: 焊接
触点材料: 磷青铜
触点表面涂层:
颜色:
包装: 管件
材料 - 绝缘体: 液晶聚合物(LCP)
工作温度: -55°C ~ 125°C
读数:
F-214
MECT–110 –01–M –D –RA1
MECT–135 –01–M –D –RA1
MECT–115 –01–M –D –RA1
(0,80 mm) .0315"
MECT SERIES
SFP & SFP + TRANSCEIVER INTERFACES
SPECIFICATIONS
For complete speci?cations and
recommended PCB layouts see
www.samtec.com?MECT
Insulator Material:
Black LCP
Contact Material:
Phosphor Bronze
Plating:
Sn or Au over
100μ" (2,54 μm) Ni
Operating Temp Range:
-55°C to +125°C
Current Rating:
2 A per pin
(6 pins powered)
Voltage Rating:
265 VAC
Mates with:
SFP, SFP + , XFP or
XENPAK transceivers
2x10 position for
Small Form Factor
Pluggable (SFP & SFP + )
Fiber Optic Transceivers
Alignment
Pin
RoHS Compliant:
Yes
Processing:
Lead–Free Solderable:
Yes
SMT Lead Coplanarity:
(0,10 mm) .004" max (10-35)
RECOGNITIONS
2x10, 2x15 and
2x35 position for
XENPAK and XFP
Transceivers
Choice of
three standard
pin counts
For complete scope
of recognitions see
www.samtec.com/quality
MECT
1
POSITIONS
PER ROW
CARD
THICKNESS
PLATING
OPTION
D
RA1
OTHER
OPTION
10, 15, 35
–01
= (1 mm) .039"
thick board
–M
= 15μ" (0,38 μm) Gold on contact,
–TR
= Tape & Reel
Packaging
Matte Tin on tail
No. of Positions x (0,80) .0315 + (3,00) .118
APPLICATION
MECT
(7,40)
.291
01
02
(0,80)
SFPC
Press Fit, Solder Tail
or PCI Press Fit Cage
.0315
No. of Positions x (0,80) .0315 + (1,40) .055
(1,20)
.047
Transceiver or Patch Cable
(5,20)
.205 (2,65)
.104
(3,25)
.128
.035 x .055 DIA
(0,90)   (1,40)
(1,40)
.055
DIA
(0,95)
.037
(9,10)
(1,05)
.041
.358
Note: Some sizes, styles and
options are non-standard,
non-returnable.
WWW.SAMTEC.COM
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