参数资料
型号: MF-LSMF300X-2
厂商: Bourns Inc.
文件页数: 1/4页
文件大小: 0K
描述: FUSE PTC RESET 3.0A 6V SMD
标准包装: 1
系列: MF-LSMF
电流 - 维持(Ih): 3A
电流 - 跳闸(It): 5A
电流 - 最大: 40A
电压 - 最大: 6V
R最小/最大: 0.015 ~ 0.048 欧姆
跳闸时间: 20s
封装/外壳: 2920(7351 公制),凹陷
包装: 标准包装
其它名称: MF-LSMF300X-2DKR
Features
■ High power ratings
■ Compliant with AEC-Q200 Rev-C- Stress
Test Quali?cation for Passive Components
in Automotive Applications
■ Low pro?le
■ Surface mount packaging for automated
assembly
■ Agency recognition:
■ Standard 7555 mm (2920 mils) footprint
■ Compatible with Pb and Pb-free solder
re?ow pro?les
■ RoHS compliant* and halogen free**
MF-LSMF Series - PTC Resettable Fuses
Electrical Characteristics
Model***
V max.
Volts
I max.
Amps
Ihold Itrip
Amperes
at 23 °C
Resistance
Ohms
at 23 °C
Max. Time
To Trip
Amperes Seconds
at 23 °C
at 23 °C
Tripped
Power
Dissipation
Watts
at 23 °C
Hold Trip
RMin.
R1Max.
Typ.
MF-LSMF185/33X
33.0
40
1.85 3.70
0.045 0.150
8.0
2.50
1.5
MF-LSMF260X
MF-LSMF300X
MF-LSMF300/24X
24.0
6.0
24.0
20
40
20
2.60
3.00
3.00
5.20
5.00
5.20
0.020
0.015
0.020
0.075
0.048
0.075
8.0
8.0
8.0
5.00
20.00
5.00
1.5
1.5
1.5
*** Features Multifuse Free Xpansion Design for MF-LSMF Series.
? ?
Environmental Characteristics
Operating Temperature......................................... -40 °C to +85 °C
Maximum Device Surface Temperature
in Tripped State .................................................... 125 °C
Passive Aging ....................................................... +85 °C, 1000 hours ............................................... ±5 % typical resistance change
Humidity Aging...................................................... +85 °C, 85 % R.H. 1000 hours ............................. ±5 % typical resistance change
Thermal Shock ..................................................... +85 °C to -40 °C, 20 times .................................... ±10 % typical resistance change
Solvent Resistance ............................................... MIL-STD-202, Method 215 ................................... No change
Vibration ............................................................... MIL-STD-883C, Method 2007.1,........................... No change
Condition A
Test Procedures And Requirements For Model MF-LSMF Series
Test Test Conditions Accept/Reject Criteria
Visual/Mech. ......................................................... Verify dimensions and materials ........................... Per MF physical description
Resistance ............................................................ In still air @ 23 °C ................................................. Rmin ≤ R ≤ R1max
Time to Trip ........................................................... At speci?ed current, Vmax, 23 °C ......................... T ≤ max. time to trip (seconds)
Hold Current ......................................................... 30 min. at Ihold ..................................................... No trip
Trip Cycle Life ....................................................... Vmax, Imax, 100 cycles ........................................ No arcing or burning
Trip Endurance ..................................................... Vmax, 48 hours..................................................... No arcing or burning
Solderability .......................................................... ANSI/J-STD-002 ................................................... 95 % min. coverage
UL File Number .................................................... E174545
http://www.ul.com/ Follow link to Certi?cations, then UL File No., enter E174545
TüV Certi?cate Number ....................................... R 50256634
http://www.tuvdotcom.com/ Follow link to “Certi?cate Search”, enter 50256634
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
**Bourns is using the de?nition that appears to be the prevalent de?nition used as the industry standard at this time. The Bourns de?nition of “halogen-free” is:
Bromine (Br) content: ≤ 900 ppm; Chlorine (Cl) content: ≤ 900 ppm; Total Br + Cl content: ≤ 1500 ppm.
Speci?cations are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their speci?c applications.
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