参数资料
型号: MF-R055/90-0
厂商: Bourns Inc.
文件页数: 1/4页
文件大小: 0K
描述: FUSE PTC RESET 90V HOLD .55AIH
产品培训模块: Multifuse® Resettable fuses
ESD Protection Products
标准包装: 500
系列: MF-R/90
电流 - 维持(Ih): 550mA
电流 - 跳闸(It): 1.1A
电流 - 最大: 10A
电压 - 最大: 90V
R最小/最大: 0.450 ~ 0.900 欧姆
跳闸时间: 60s
封装/外壳: 径向 - 圆盘形
包装: 散装
Features
■ Radial leaded devices
Applications
Almost anywhere there is a load to be
122 5 5
R0
0S
■ Cured, ?ame retardant epoxy polymer
insulating material meets UL 94V-0
requirements
■ RoHS compliant*
protected with a voltage supply of up to
90 V, including:
■ Broadband cable power passing taps
■ Set-top boxes
■ Agency recognition:
MF-R/90 Series - PTC Resettable Fuses
Electrical Characteristics
Model
V max.
Volts
I max.
Amps
Ihold
Itrip
Initial
Resistance
Values
One Hour
Post-Trip
Resistance
Standard
Trip
Max. Time
to Trip
Nominal
Tripped
Power
Dissipation
Amperes
at 23 °C
Ohms
at 23 °C
Ohms
at 23 °C
Amperes
at 23 °C
Seconds
at 23 °C
Watts
at 23 °C
Hold
Trip
Min.
Max.
Max.
Typ.
MF-R055/90
MF-R055/90U
MF-R075/90
90
90
90
10
10
10
0.55
0.55
0.75
1.1
1.1
1.5
0.45
0.45
0.37
0.9
0.9
0.75
2.0
2.0
1.65
1.6
1.6
2.0
60
28
60
2.0
2.0
2.5
“U” suf?x indicates product without insulation coating.
Environmental Characteristics
Operating/Storage Temperature ...................... -40 °C to +85 °C
Maximum Device Surface Temperature
in Tripped State ............................................ 125 °C
Passive Aging .................................................. +85 °C, 1000 hours...........................................±5 % typical resistance change
Humidity Aging................................................. +85 °C, 85 % R.H. 1000 hours .........................±5 % typical resistance change
Thermal Shock ................................................ +125 °C to -55 °C, 10 times ..............................±10 % typical resistance change
Solvent Resistance .......................................... MIL-STD-202, Method 215 ...............................No change
Vibration .......................................................... MIL-STD-883C, Method 2007.1,.......................No change
Condition A
Test Procedures And Requirements For Model MF-R/90 Series
Test Test Conditions Accept/Reject Criteria
Visual/Mech. .................................................... Verify dimensions and materials .......................Per MF physical description
Resistance ....................................................... In still air @ 23 °C .............................................Rmin ≤ R ≤ Rmax
Time to Trip ...................................................... 5 times Ihold, Vmax, 23 °C ...............................T ≤ max. time to trip (seconds)
Hold Current .................................................... 30 min. at Ihold .................................................No trip
Trip Cycle Life .................................................. Vmax, Imax, 100 cycles ....................................No arcing or burning
Trip Endurance ................................................ Vmax, 48 hours.................................................No arcing or burning
UL File Number ............................................... E 174545S
CSA File Number ............................................. CA 110338
TüV File Number ............................................. R2057213
Thermal Derating Chart - Ihold / Itrip (Amps)
Model
-40 oC
-20 oC
0 oC
Ambient Operating Temperature
23 oC 40 oC 50 oC
60 oC
70 oC
85 oC
MF-R055/90
MF-R055/90U
MF-R075/90
0.85 / 1.7
0.85 / 1.7
1.15 / 2.3
0.75 / 1.5
0.75 / 1.5
1.0 / 2.0
0.65 / 1.3
0.65 / 1.3
0.9 / 1.8
0.55 / 1.1
0.55 / 1.1
0.75 / 1.5
0.45 / 0.9
0.45 / 0.9
0.61 / 1.22
0.4 / 0.8
0.4 / 0.8
0.55 / 1.1
0.35 / 0.7
0.35 / 0.7
0.48 / 0.96
0.3 / 0.6
0.3 / 0.6
0.41 / 0.82
0.22 / 0.44
0.22 / 0.44
0.30 / 0.6
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
Speci?cations are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their speci?c applications.
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