参数资料
| 型号： | MF-SM300-2 |
| 厂商： | Bourns Inc. |
| 文件页数： | 1/4页 |
| 文件大小： | 0K |
| 描述： | FUSE RESETTABLE 3.0A HOLD SMD |
| 产品培训模块： | Multifuse® Resettable fuses ESD Protection Products |
| 产品变化通告： | MF-SM(250), SMHT Series Cover Tape Nov 2010 |
| 产品目录绘图： | MF-SM Series Footprint MF-SM030,050,075,100,100^33,125,260,300 End MF-SM100,100^33,125,260,300 Side |
| 标准包装： | 1 |
| 系列： | MF-SM |
| 电流 - 维持(Ih)： | 3A |
| 电流 - 跳闸(It)： | 6A |
| 电流 - 最大： | 100A |
| 电压 - 最大： | 6V |
| R最小/最大： | 0.015 ~ 0.048 欧姆 |
| 跳闸时间： | 35s |
| 封装/外壳： | 2-SMD |
| 包装： | 标准包装 |
| 产品目录页面： | 2406 (CN2011-ZH PDF) |
| 其它名称： | MF-SM300-2DKR |
Features
■ Compliant with AEC-Q200 Rev-C- Stress
Test Quali?cation for Passive Components
in Automotive Applications
■ Surface mount devices
■ RoHS compliant* and halogen free**
■ Agency recognition:
■ Patents pending
■ Fully compatible with current
industry standards
■ Packaged per EIA 481-2 standard
MF-SM Series - PTC Resettable Fuses
Electrical Characteristics
Model
V max.
Volts
I max
Amps
Ihold Itrip
Amperes
at 23 °C
Resistance
Ohms
at 23 °C
Max. Time
To Trip
Amperes Seconds
at 23 °C
at 23 °C
Tripped
Power
Dissipation
Watts
at 23 °C
Hold Trip
R Min. R1 Max.
Max.
Typ.
MF-SM030
MF-SM050
MF-SM075
MF-SM075/60
MF-SM100
MF-SM100/33
MF-SM125
MF-SM150
MF-SM150/33
MF-SM185/33
MF-SM200
MF-SM250
MF-SM260
MF-SM300**
60
60
30
60
30
33
15
15
33
33
15
15
6
6
40
40
80
10
80
40
100
100
40
40
100
100
100
100
0.30 0.60
0.50 1.00
0.75 1.50
0.75 1.50
1.10 2.20
1.10 2.20
1.25 2.50
1.50 3.00
1.50 3.00
1.80 3.60
2.00 4.00
2.50 5.00
2.60 5.20
3.00 6.00
0.90 4.80
0.35 1.40
0.23 1.00
0.23 1.00
0.12 0.48
0.12 0.41
0.07 0.25
0.06 0.25
0.06 0.23
0.04 0.15
0.045 0.125
0.024 0.085
0.025 0.075
0.015 0.048
1.5 3.0
2.5 4.0
8.0 0.3
8.0 0.3
8.0 0.5
8.0 0.5
8.0 2.0
8.0 5.0
8.0 5.0
8.0 5.0
8.0 12.0
8.0 25.0
8.0 20.0
8.0 35.0
1.7
1.7
1.7
1.7
1.7
1.7
1.7
1.9
1.9
1.9
1.9
1.9
1.7
1.5
**UL approved, CSA & TUV approval pending.
Environmental Characteristics
Operating Temperature...............................................-40 °C to +85 °C
Maximum Device Surface Temperature
in Tripped State ..........................................................125 °C
Passive Aging .............................................................+85 °C, 1000 hours ....................................................±5 % typical resistance change
Humidity Aging............................................................+85 °C, 85 % R.H. 7 days ..........................................±5 % typical resistance change
Thermal Shock ...........................................................MIL-STD-202F, Method 107G, ...................................±10 % typical resistance change
-40 °C to +85 °C, 20 cycles ........................................-20 % typical resistance change
Vibration .....................................................................MIL-STD-883C, Method 2007.1, Condition A .............Rmin ≤ R ≤ R1max
Test Procedures And Requirements For Model MF-SM Series
Test Test Conditions Accept/Reject Criteria
Visual/Mech. ...............................................................Verify dimensions and materials .................................Per MF physical description
Resistance ..................................................................In still air @ 23 °C .......................................................Rmin ≤ R ≤ R1max
Time to Trip .................................................................At speci?ed current, Vmax, 23 °C...............................T ≤ max. time to trip (seconds)
Hold Current ...............................................................30 min. at Ihold ...........................................................No trip
Trip Cycle Life .............................................................Vmax, Imax, 100 cycles..............................................No arcing or burning
Trip Endurance ...........................................................Vmax, 48 hours ..........................................................No arcing or burning
Solderability ................................................................MIL-STD-202F, Method 208F .....................................95 % min. coverage
UL File Number ............... E174545 http://www.ul.com/ Follow link to Certi?cations, then UL File No., enter E174545
CSA File Number ............. CA110338 http://directories.csa-international.org/ Under “Certi?cation Record” and “File Number” enter 110338-0-000
TüV Certi?cate Number .. R 02057213 http://www.tuvdotcom.com/ Follow link to “other certi?cates”, enter File No. 2057213
Thermal Derating Chart - Ihold (Amps)
Model
-40 oC
-20 oC
0 oC
Ambient Operating Temperature
23 oC 40 oC 50 oC
60 oC
70 oC
85 oC
MF-SM030 0.45
MF-SM050 0.76
MF-SM075 1.11
MF-SM075/60 1.11
MF-SM100 1.66
MF-SM100/33 1.66
MF-SM125 1.89
MF-SM150 2.27
MF-SM150/33 2.27
MF-SM185/33 2.56
MF-SM200 3.02
MF-SM250 3.78
MF-SM260 3.64
MF-SM300 4.13
0.40
0.67
0.99
0.99
1.47
1.47
1.68
2.01
2.01
2.32
2.68
3.35
3.25
3.75
0.35
0.59
0.84
0.84
1.29
1.29
1.46
1.76
1.76
2.08
2.34
2.93
2.91
3.30
0.30 0.25 0.23
0.50 0.42 0.38
0.75 0.63 0.57
0.75 0.63 0.57
1.10 0.91 0.83
1.10 0.91 0.83
1.25 1.04 0.94
1.50 1.25 1.13
1.50 1.25 1.13
1.85 1.60 1.44
2.00 1.66 1.50
2.50 2.08 1.88
2.60 2.26 2.08
2.87 2.62 2.43
0.20
0.33
0.49
0.49
0.73
0.73
0.83
0.99
0.99
1.28
1.32
1.65
1.95
2.25
0.17
0.29
0.45
0.45
0.64
0.64
0.73
0.87
0.87
1.12
1.16
1.45
1.74
2.00
0.14
0.23
0.36
0.36
0.50
0.50
0.56
0.68
0.68
0.88
0.90
1.13
1.48
1.78
Itrip is approximately two times Ihold.
* RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
**Bourns follows the prevailing de?nition of “halogen free” in the industry. Bourns considers a product to be “halogen free” if (a) the Bromine (Br) content is 900 ppm or less; (b) the
Chlorine (Cl) content is 900 ppm or less; and (c) the total Bromine (Br) and Chlorine (Cl) content is 1500 ppm or less.
Speci?cations are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their speci?c applications.
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