- 您现在的位置：买卖IC网 > PDF目录16943 > MIC2009YM6 (Micrel Inc)IC DISTRIBUTION SW ADJ SOT23-6 PDF资料下载
参数资料
| 型号： | MIC2009YM6 |
| 厂商： | Micrel Inc |
| 文件页数： | 28/30页 |
| 文件大小： | 0K |
| 描述： | IC DISTRIBUTION SW ADJ SOT23-6 |
| 标准包装： | 1 |
| 类型： | 高端开关 |
| 输出数： | 1 |
| Rds（开）： | 100 毫欧 |
| 内部开关： | 是 |
| 电流限制： | 可调 |
| 输入电压： | 2.5 V ~ 5.5 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | SOT-23-6 |
| 供应商设备封装： | SOT-23-6 |
| 包装： | 散装 |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页当前第28页第29页第30页
Micrel, Inc.
Power Dissipation
Power dissipation depends on several factors such as
the load, PCB layout, ambient temperature, and supply
voltage. Calculation of power dissipation can be
accomplished by the following equation:
MIC20xx Family
In Figure 12, die temperature is plotted against I OUT
assuming a constant case temperature of 85°C. The
plots also assume a worst case R ON of 140m ? at a die
temperature of 135°C. Under these conditions it is clear
that an SOT-23 packaged device will be on the verge of
thermal shutdown, typically 140°C die temperature,
P D = R DS ( ON ) × ( I OUT )
2
when operating at a load current of 1.25A. For this
reason we recommend using MLF ? packaged switches
for any design intending to supply continuous currents
of 1A or more.
To relate this to junction temperature, the following
equation can be used:
Die Temperature vs.
T J = P D × R θ ( J ? A ) + T A
Output Current (T CASE =85°C)
160
140
where:
T J = junction temperature
T A = ambient temperature
R θ (J-A) is the thermal resistance of the package
120
100
80
60
40
SOT-23
MLF
20
In normal operation the switch’s R ON is low enough that
no significant I 2 R heating occurs. Device heating is
most often caused by a short circuit, or very-heavy
load, when a significant portion of the input supply
voltage appears across the switch’s power MOSFET.
Under these conditions the heat generated will exceed
the package and PCB’s ability to cool the device and
thermal limiting will be invoked.
0
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
OUTPUT CURRENT (A)
Figure 12. Die Temperature vs. I OUT
August 2011
28
M9999-080211-D
相关PDF资料 |
PDF描述 |
|---|---|
| MIC2009BM6 TR | IC DISTRIBUTION SW ADJ SOT23-6 |
| AD8061AR-EBZ | BOARD EVAL FOR AD8061AR |
| AD8013AR-14-EBZ | BOARD EVAL FOR AD8013AR-14 |
| 822841-000 | BOOT MOLDED |
| EBC30DRXI | CONN EDGECARD 60POS DIP .100 SLD |
相关代理商/技术参数 |
参数描述 |
|---|---|
| MIC2009YM6 TR | 功能描述:电源开关 IC - USB Programmable Current Limit Single High-Side Switch w/Flag - Lead Free RoHS:否 制造商:Micrel 电源电压-最小:2.7 V 电源电压-最大:5.5 V 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:SOIC-8 封装:Tube |
| MIC2009YM6TR | 制造商:Micrel 功能描述:USB Power Switch Single 0.2A to 2A |
| MIC2009YM6-TR | 制造商:MICREL 制造商全称:Micrel Semiconductor 功能描述:Fixed and Adjustable Current Limiting Power Distribution Switches |
| MIC2009YM6TX | 功能描述:IC DISTRIBUTION SW ADJ SOT23-6 RoHS:是 类别:集成电路 (IC) >> PMIC - 电源分配开关 系列:- 特色产品:XRP252 Switches 标准包装:1 系列:- 类型:高端开关 输出数:2 Rds（开）:140 毫欧 内部开关:是 电流限制:1.15A 输入电压:1.75 V ~ 5.5 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:10-WFDFN 裸露焊盘 供应商设备封装:10-TDFN（3x3） 包装:Digi-Reel® 其它名称:1016-1691-6 |
| MIC2009YML | 制造商:Rochester Electronics LLC 功能描述: 制造商:RF Micro Devices Inc 功能描述: 制造商:Micrel Inc 功能描述: |
发布紧急采购，3分钟左右您将得到回复。