参数资料
型号: MIC2014-0.5YML TR
厂商: Micrel Inc
文件页数: 28/30页
文件大小: 0K
描述: IC DISTRIBUTION SW 0.5A 6-MLF
标准包装: 1
类型: 高端开关
输出数: 1
Rds(开): 100 毫欧
内部开关:
电流限制: 500mA
输入电压: 2.5 V ~ 5.5 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 6-VQFN 裸露焊盘,6-MLF?
供应商设备封装: 6-MLF?(2x2)
包装: 标准包装
产品目录页面: 1114 (CN2011-ZH PDF)
其它名称: 576-1686-6
Micrel, Inc.
Power Dissipation
Power dissipation depends on several factors such as
the load, PCB layout, ambient temperature, and supply
voltage. Calculation of power dissipation can be
accomplished by the following equation:
MIC20xx Family
In Figure 12, die temperature is plotted against I OUT
assuming a constant case temperature of 85°C. The
plots also assume a worst case R ON of 140m ? at a die
temperature of 135°C. Under these conditions it is clear
that an SOT-23 packaged device will be on the verge of
thermal shutdown, typically 140°C die temperature,
P D = R DS ( ON ) × ( I OUT )
2
when operating at a load current of 1.25A. For this
reason we recommend using MLF ? packaged switches
for any design intending to supply continuous currents
of 1A or more.
To relate this to junction temperature, the following
equation can be used:
Die Temperature vs.
T J = P D × R θ ( J ? A ) + T A
Output Current (T CASE =85°C)
160
140
where:
T J = junction temperature
T A = ambient temperature
R θ (J-A) is the thermal resistance of the package
120
100
80
60
40
SOT-23
MLF
20
In normal operation the switch’s R ON is low enough that
no significant I 2 R heating occurs. Device heating is
most often caused by a short circuit, or very-heavy
load, when a significant portion of the input supply
voltage appears across the switch’s power MOSFET.
Under these conditions the heat generated will exceed
the package and PCB’s ability to cool the device and
thermal limiting will be invoked.
0
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
OUTPUT CURRENT (A)
Figure 12. Die Temperature vs. I OUT
August 2011
28
M9999-080211-D
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