参数资料
型号: MIC2169BMM TR
厂商: Micrel Inc
文件页数: 13/15页
文件大小: 0K
描述: IC REG CTRLR BUCK PWM VM 10-MSOP
标准包装: 2,500
PWM 型: 电压模式
输出数: 1
频率 - 最大: 550kHz
占空比: 92%
电源电压: 3 V ~ 14.5 V
降压:
升压:
回扫:
反相:
倍增器:
除法器:
Cuk:
隔离:
工作温度: -40°C ~ 85°C
封装/外壳: 10-TFSOP,10-MSOP(0.118",3.00mm 宽)
包装: 带卷 (TR)
其它名称: MIC2169BMMTR
MIC2169BMMTR-ND
MIC2169
Design Example
Layout and Checklist:
1. Connect the current limiting (R2) resistor directly
to the drain of top MOSFET Q3.
2. Use a 5 Ω resistor from the input supply to the VIN
pin on the MIC2169. Also, place a 1 μ F ceramic
capacitor from this pin to GND, preferably not thru
a via.
3. The feedback resistors R3 and R4/R5/R6 should
be placed close to the FB pin. The top side of R3
should connect directly to the output node. Run
this trace away from the switch node (junction of
Q3, Q2, and L1). The bottom side of R3 should
connect to the GND pin on the MIC2169.
4. The compensation resistor and capacitors should
be placed right next to the COMP pin and the other
side should connect directly to the GND pin on the
MIC2169 rather than going to the plane.
5. Add a 1.4 Ω resistor and a 1000pF capacitor from
the switch node to ground pin. See page 7, Current
Limiting section for more detail.
6. Add place holders for gate resistors on the top and
bottom MOSFET gate drives. If necessary, gate
resistors of 10 Ω or less should be used.
J1
Micrel
7. Low gate charge MOSFETs should be used to
maximize ef ? ciency, such as Si4800, Si4804BDY,
IRF7821, IRF8910, FDS6680A and FDS6912A,
etc.
8. Compensation component GND, feedback resistor
ground, chip ground should all run together and
connect to the output capacitor ground. See demo
board layout, top layer.
9. The 10 μ F ceramic capacitor should be placed
between the drain of the top MOSFET and the
source of the bottom MOSFET.
10. The 10 μ F ceramic capacitor should be placed right
on the VDD pin without any vias.
11. The source of the bottom MOSFET should connect
directly to the input capacitor GND with a thick
trace. The output capacitor and the input capacitor
should connect directly to the GND plane.
12. Place a 0.01 μ F to 0.1 μ F ceramic capacitor in parallel
with the CS resistor to ? lter any switching noise.
+Vin 5-12V
1
Cin=AVX TPSD686M020R0070
+VIN
C2
+
C3
68uF
+
C1
68uF/20V
20V
10uF/16V
R9
10
R2
470 ohm
C4
10uF/6V
D1
C16
0.1uF
SD103BWS
C13
1uF/16V
BST
10
C5
0.1uF/25V
4
Q3
IRF7821
L1
Cout=AVX TPSD337M006R0045
CDRH127 / LD-1R0-MC
1.0uH
J4
U1
HSD
VSW
9
8
R11
RES
R10
4R02 Ohm
2
1
C6
330uF/6.3V
+
C7
330uF
+
C8
Open
+
R3
10K
R14
Open
1
Vout
C14
MIC2169
R12
47
D2
C12
DIN
Q1
4
COMP/EN
LSD
7
R13
RES
4
Q2
IRF7821
C15
100pF
C11
Open
0.1uF/25V
J2
2N7002E
1
SHDN
1
R7
100K
R1
0 Ohm
C9
Open
C10
0.1uF
R8
4.02K
FB
5
R4
3.16k
C
3.3V
R5 R6
4.64K 11.3K
B A
2.5V 1.5V
J3
1
JP2
HEADER 3X2
GND
J5
1
GND
MIC2169BMM Evaluation Board Schematic
March 2009
13
M9999-032409
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