参数资料
| 型号： | MIC2174-1YMM TR |
| 厂商： | Micrel Inc |
| 文件页数： | 21/27页 |
| 文件大小： | 0K |
| 描述： | IC REG CTRLR BUCK PWM 10-MSOP |
| 产品培训模块： | MIC2124 Synchronous Current Mode DC-DC Buck Controller |
| 标准包装： | 2,500 |
| 系列： | Hyper Speed Control™ |
| PWM 型： | 混合物 |
| 输出数： | 1 |
| 频率 - 最大： | 375kHz |
| 占空比： | 87% |
| 电源电压： | 3 V ~ 40 V |
| 降压： | 是 |
| 升压： | 无 |
| 回扫： | 无 |
| 反相： | 无 |
| 倍增器： | 无 |
| 除法器： | 无 |
| Cuk： | 无 |
| 隔离： | 无 |
| 工作温度： | -40°C ~ 125°C |
| 封装/外壳： | 10-TFSOP，10-MSOP（0.118"，3.00mm 宽） |
| 包装： | 带卷 (TR) |
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Micrel, Inc.
PCB Layout Guidelines
Warning!!! To minimize EMI and output noise, follow
these layout recommendations.
PCB Layout is critical to achieve reliable, stable and
efficient performance. A ground plane is required to
control EMI and minimize the inductance in power,
signal and return paths.
Inductor
? Keep the inductor connection to the switch node
(LX) short.
? Do not route any digital lines underneath or close to
the inductor.
? Keep the switch node (LX) away from the feedback
(FB) pin.
MIC2174/MIC2174C
The following guidelines should be followed to insure
proper operation of the MIC2174/MIC2174C converter.
?
The LX pin should be connected directly to the drain
of the low-side MOSFET to accurate sense the
IC
?
?
?
?
The 2.2μF ceramic capacitor, which connects to the
V IN terminal, must be located right at the IC. The V IN
terminal is very noise sensitive and placement of the
capacitor is very critical. Use wide traces to connect
to the IN and PGND pins.
Place the IC and MOSFETs close to the point of
load (POL).
Use fat traces to route the input and output power
lines.
Signal and power grounds should be kept separate
and connected at only one location.
voltage across the low-side MOSFET.
? To minimize noise, place a ground plane underneath
the inductor.
Output Capacitor
? Use a wide trace to connect the output capacitor
ground terminal to the input capacitor ground
terminal.
? Phase margin will change as the output capacitor
value and ESR changes. Contact the factory if the
output capacitor is different from what is shown in
the BOM.
? The feedback trace should be separate from the
power trace and connected as close as possible to
Input Capacitor
? Place the HSD input capacitor next.
? Place the HSD input capacitors on the same side of
the board and as close to the MOSFETs as
possible.
? Keep both the HSD and PGND connections short.
? Place several vias to the ground plane close to the
HSD input capacitor ground terminal.
? Use either X7R or X5R dielectric input capacitors.
Do not use Y5V or Z5U type capacitors.
? Do not replace the ceramic input capacitor with any
other type of capacitor. Any type of capacitor can be
placed in parallel with the input capacitor.
the output capacitor. Sensing a long high current
load trace can degrade the DC load regulation.
Schottky Diode (Optional)
? Place the Schottky diode on the same side of the
board as the MOSFETs and HSD input capacitor.
? The connection from the Schottky diode’s Anode to
the input capacitors ground terminal must be as
short as possible.
? The diode’s cathode connection to the switch node
(LX) must be keep as short as possible.
RC Snubber
? Place the RC snubber on the same side of the board
and as close to the MOSFETs as possible.
?
?
If a Tantalum input capacitor is placed in parallel
with the input capacitor, it must be recommended for
switching regulator applications and the operating
voltage must be derated by 50%.
In “Hot-Plug” applications, a Tantalum or Electrolytic
bypass capacitor must be used to limit the over-
voltage spike seen on the input supply with power is
suddenly applied.
MOSFETs
? Low-side MOSFET gate drive trace (DL pin to
MOSFET gate pin) must be short and routed over a
ground plane. The ground plane should be the
connection between the MOSFET source and PGND.
? Chose a low-side MOSFET with a high C GS /C GD ratio
and a low internal gate resistance to minimize the
effect of dv/dt inducted turn-on.
?
An additional Tantalum or Electrolytic bypass input
capacitor of 22μF or higher is required at the input
power connection.
?
?
Do not put a resistor between the LSD output and
the gate.
Use a 4.5V V GS rated MOSFET. Its higher gate
threshold voltage is more immune to glitches than a
2.5V or 3.3V rated MOSFET. MOSFETs that are
rated for operation at less than 4.5V V GS should not
be used.
September 2010
21
M9999-091310-C
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MIC2174C | 制造商:MICREL 制造商全称:Micrel Semiconductor 功能描述:Synchronous Buck Controller Featuring Adaptive On-Time Control 40V Input, 300kHz |
| MIC2174C-1YMM | 功能描述:DC/DC 开关控制器 Low Cost 40V Synchronous Buck Controller RoHS:否 制造商:Texas Instruments 输入电压:6 V to 100 V 开关频率: 输出电压:1.215 V to 80 V 输出电流:3.5 A 输出端数量:1 最大工作温度:+ 125 C 安装风格: 封装 / 箱体:CPAK |
| MIC2174C-1YMM TR | 功能描述:DC/DC 开关控制器 Low Cost 40V Synchronous Buck Controller RoHS:否 制造商:Texas Instruments 输入电压:6 V to 100 V 开关频率: 输出电压:1.215 V to 80 V 输出电流:3.5 A 输出端数量:1 最大工作温度:+ 125 C 安装风格: 封装 / 箱体:CPAK |
| MIC2176-1 | 制造商:MICREL 制造商全称:Micrel Semiconductor 功能描述:Wide Input Voltage, Synchronous Buck Controllers Featuring Adaptive On-Time Control |
| MIC2176-1YMM | 功能描述:DC/DC 开关控制器 76V Synchronous Buck Controller RoHS:否 制造商:Texas Instruments 输入电压:6 V to 100 V 开关频率: 输出电压:1.215 V to 80 V 输出电流:3.5 A 输出端数量:1 最大工作温度:+ 125 C 安装风格: 封装 / 箱体:CPAK |
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