参数资料
型号: MIC2583R-MBQS TR
厂商: Micrel Inc
文件页数: 21/25页
文件大小: 826K
描述: IC CTRLR HOT SWAP 200MV 16-QSOP
标准包装: 2,500
类型: 热交换控制器
应用: 通用
内部开关:
电源电压: 2.3 V ~ 13.2 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 16-SSOP(0.154",3.90mm 宽)
供应商设备封装: 16-QSOP
包装: 带卷 (TR)
其它名称: MIC2583R-MBQSTR
MIC2583R-MBQSTR-ND
Micrel, Inc.
MIC2582/MIC2583
 
 
April 2009 
21
M9999-043009-C
 
Thus:
Assume T
A
 = 55?/SPAN>C maximum, 1 square inch of copper at 
the drain leads, no airflow.
Recalling from our previous approximation hint, the part
has an R
ON
 of (0.0335/2) = 17m& at 25癈.
Assume it has been carrying just about 2.5A for some
time.
When performing this calculation, be sure to use the
highest anticipated ambient temperature (T
A(MAX)
) in
which the MOSFET will be operating as the starting
temperature, and find the operating junction temperature
increase (T
J
) from that point. Then, as shown next, the
final junction temperature is found by adding T
A(MAX)
 and
T
J
. Since this is not a closed-form equation, getting a
close approximation may take one or two iterations, and
the calculation tends to converge quickly.
Then the starting (steady-state) T
J
 is:
     T
J
 E T
A(MAX)
+ T
J
 
      E T
A(MAX)
+ [R
ON
 + T
A(MAX)
 T
A
)(0.005/篊)(R
ON
)]
         
x I
2
 x R
?JA)
 
T
J
 E 55篊 + [17m& + (55篊-25篊)(0.005)(17m&)]
          x (2.5A)
2
 x (50篊/W)
T
J
 E (55篊 + (0.122W)(50篊/W)
         E 61.1篊
Iterate the calculation once to see if this value is within a
few percent of the expected final value. For this iteration
we will start with T
J
 equal to the already calculated value 
of 61.1癈:
T
J
 E T
A
 + [17m& + (61.1篊-25篊)(0.005)(17m&)]
  x (2.5A)
2
 x (50篊/W)
T
J
  E (55篊 + (0.125W)(50篊/W) E 61.27篊
So our original approximation of 61.1篊 was very close
to the correct value. We will use T
J
 = 61篊.
Finally, add the temperature increase due to the
maximum power dissipation calculated from a single
event, (11.25W)(50篊/W)(0.08) = 45篊 to the steady-
state T
J
  to get T
J(TRANSIENT   MAX.)
= 106篊. This is an
acceptable maximum junction temperature for this part.
 
 
 
 
Figure 10. Transient Thermal Impedance
 
 
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