- 您现在的位置：买卖IC网 > PDF目录19799 > MIC2589R-1YM (Micrel Inc)IC CTRLR HOT SWAP NEG HV 14-SOIC PDF资料下载
参数资料
| 型号： | MIC2589R-1YM |
| 厂商： | Micrel Inc |
| 文件页数： | 20/29页 |
| 文件大小： | 4205K |
| 描述： | IC CTRLR HOT SWAP NEG HV 14-SOIC |
| 标准包装： | 54 |
| 类型： | 热交换控制器 |
| 应用： | 通用 |
| 内部开关： | 无 |
| 电源电压： | -19 V ~ -80 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 14-SOIC（0.154"，3.90mm 宽） |
| 供应商设备封装： | 14-SOIC |
| 包装： | 管件 |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页当前第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页
Micrel
MIC2589/MIC2595
December 2005
20
M9999-120505
(408) 955-1690
Application Information
Optional External Circuits for Added
Protection/Performance
In many telecom applications, it is very common for
circuit boards to encounter large-scale supply-voltage
transients in backplane environments. Because
backplanes present a complex impedance
environment, these transients can be as high as 2.5
times steady-state levels, or 120V in worst-case
situations. In addition, a sudden load dump anywhere
on the circuit card can generate a very high voltage
spike at the drain of the output MOSFET that will
appear at the DRAIN pin of the MIC2589/MIC2595. In
both cases, it is good engineering practice to include
protective measures to avoid damaging sensitive ICs
or the hot swap controller from these large-scale
transients. Two typical scenarios in which large-scale
transients occur are described below:
1. An output current load dump with no bypass
(charge bucket or bulk) capacitance to V
EE
.
For example, if L
LOAD
= 5礖, V
IN
= 56V and
t
OFF
= 0.7祍, the resulting peak short-circuit
current prior to the MOSFET turning off
would reach:
(
)
A
礖
祍
V
8
.
7
5
7
.
0
56
=
?/DIV>
If there is no other path for this current to
take when the MOSFET turns off, it will
avalanche the drain-source junction of the
MOSFET. Since the total energy
represented is small relative to the
sturdiness of modern power MOSFETs, its
unlikely that this will damage the transistor.
However, the actual avalanche voltage is
unknown; all that can be guaranteed is that
it will be greater than the
V
BD(D-S)
of the MOSFET. The drain of the
transistor is connected to the DRAIN pin of
the MIC2589/MIC2595, and the resulting
transient does have enough voltage and
energy to damage this, or any, high-voltage
hot swap controller.
2. If the loads bypass capacitance (for
example, the input filter capacitors for DC-
DC converter module(s)) is on a board from
which the board with the MIC2589/MIC2595
and the MOSFET can be unplugged, the
same type of inductive transient damage
can occur to the MIC2589/MIC2595.
For many applications, the use of additional circuit
components can be implemented for optimum system
performance and/or protection. The circuit, shown in
Figure 7, includes several components to address
some the following system (dynamic) responses
and/or functions: 1) suppression of transient voltage
spikes, 2) elimination of false tripping of the circuit
breaker due to undervoltage and overcurrent glitches,
and 3) the implementation of an external reset circuit.
It is not mandatory that these techniques be utilized,
however, the application environment will dictate
suitability. For protection against sudden on-card load
dumps at the DRAIN pin of the MIC2589/MIC2595
controller, a 68V, 1W, 5% Zener diode clamp (D2)
connected from the DRAIN to the VEE of the
controller can be implemented as shown. To protect
the controller from large-scale transients at the card
input, a 100V clamp diode (D1, SMAT70A or
equivalent) can be used. In either case, very short
lead lengths and compact layout design is strongly
recommended to prevent unwanted transients in the
protection circuitry. Power buss inductance often
produces localized (plug-in card) high-voltage
transients during a turn-off event. Managing these
repeated voltage stresses with sufficient input bulk
capacitance and/or transient suppressing diode
clamps is highly recommended for maximizing the life
of the hot swap controller(s).
相关PDF资料 |
PDF描述 |
|---|---|
| VI-B7Y-CY-F1 | CONVERTER MOD DC/DC 3.3V 33W |
| EMM44DSUN | CONN EDGECARD 88POS DIP .156 SLD |
| HIP1012ACBZA | IC CTRLRL HOT PLUG DUAL 14-SOIC |
| VI-B7Y-CX-F3 | CONVERTER MOD DC/DC 3.3V 49.5W |
| AYM22DTMS | CONN EDGECARD 44POS R/A .156 SLD |
相关代理商/技术参数 |
参数描述 |
|---|---|
| MIC2589R-1YM TR | 功能描述:热插拔功率分布 Negative Voltage Hot-swap Controller - Lead Free RoHS:否 制造商:Texas Instruments 产品:Controllers & Switches 电流限制: 电源电压-最大:7 V 电源电压-最小:- 0.3 V 工作温度范围: 功率耗散: 安装风格:SMD/SMT 封装 / 箱体:MSOP-8 封装:Tube |
| MIC2589R-1YM-TR | 功能描述:Hot Swap Controller, Sequencer 1 Channel -48V 14-SOIC 制造商:microchip technology 系列:- 包装:剪切带（CT） 零件状态:过期 类型:热交换控制器，序列发生器 通道数:1 内部开关:无 应用:-48V 特性:自动重试 可编程特性:限流，故障超时，OVP，UVLO 电压 - 电源:-80 V ~ -19 V 电流 - 输出（最大值）:- 工作温度:-40°C ~ 85°C 电流 - 电源:4mA 安装类型:表面贴装 封装/外壳:14-SOIC（0.154"，3.90mm 宽） 供应商器件封装:14-SOIC 功能引脚:CFILTER，CNLD，DRAIN，PGTIMER，OV，PWRGD1，PWRGD2，PWRGD3，UV 标准包装:1 |
| MIC2589R-2BM | 功能描述:IC CTRLR HOT SWAP NEG HV 14-SOIC RoHS:否 类别:集成电路 (IC) >> PMIC - 热交换 系列:- 产品培训模块:Obsolescence Mitigation Program 标准包装:100 系列:- 类型:热插拔开关 应用:通用 内部开关:是 电流限制:可调 电源电压:9 V ~ 13.2 V 工作温度:-40°C ~ 150°C 安装类型:表面贴装 封装/外壳:10-WFDFN 裸露焊盘 供应商设备封装:10-TDFN-EP（3x3） 包装:管件 |
| MIC2589R-2BM TR | 功能描述:IC CTRLR HOT SWAP NEG HV 14-SOIC RoHS:否 类别:集成电路 (IC) >> PMIC - 热交换 系列:- 产品培训模块:Obsolescence Mitigation Program 标准包装:100 系列:- 类型:热插拔开关 应用:通用 内部开关:是 电流限制:可调 电源电压:9 V ~ 13.2 V 工作温度:-40°C ~ 150°C 安装类型:表面贴装 封装/外壳:10-WFDFN 裸露焊盘 供应商设备封装:10-TDFN-EP（3x3） 包装:管件 |
| MIC2589R-2YM | 功能描述:热插拔功率分布 Negative Voltage Hot-swap Controller - Lead Free RoHS:否 制造商:Texas Instruments 产品:Controllers & Switches 电流限制: 电源电压-最大:7 V 电源电压-最小:- 0.3 V 工作温度范围: 功率耗散: 安装风格:SMD/SMT 封装 / 箱体:MSOP-8 封装:Tube |
发布紧急采购，3分钟左右您将得到回复。