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| 型号： | MIC2595R-2YM |
| 厂商： | Micrel Inc |
| 文件页数： | 25/29页 |
| 文件大小： | 4205K |
| 描述： | IC CTRLR HOT SWAP NEG HV 14-SOIC |
| 标准包装： | 54 |
| 类型： | 热交换控制器 |
| 应用： | 通用 |
| 内部开关： | 无 |
| 电源电压： | -19 V ~ -80 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 14-SOIC（0.154"，3.90mm 宽） |
| 供应商设备封装： | 14-SOIC |
| 包装： | 管件 |
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Micrel
MIC2589/MIC2595
December 2005
25
M9999-120505
(408) 955-1690
PCB Layout Considerations
4-Wire Kelvin Sensing
Because of the low value typically required for the
sense resistor, special care must be used to measure
accurately the voltage drop across it. Specifically, the
measurement technique across each R
SENSE
must
employ 4-wire Kelvin sensing. This is simply a means
of making sure that any voltage drops in the power
traces connecting to the resistors are not picked up by
the signal conductors measuring the voltages across
the sense resistors.
Figure 9 illustrates how to implement 4-wire Kelvin
sensing. As the figure shows, all the high current in
the circuit (from V
EE
through R
SENSE
, and then to the
source of the output MOSFET) flows directly through
the power PCB traces and R
SENSE
. The voltage drop
resulting across R
SENSE
is sampled in such a way that
the high currents through the power traces will not
introduce any parasitic voltage drops in the sense
leads. It is recommended to connect the hot swap
controllers sense leads directly to the sense resistors
metalized contact pads.
Other Layout Considerations
Figure 10 is a suggested PCB layout diagram for the
MIC2589/MIC2595. Many hot swap applications will
require load currents of several amperes. Therefore,
the power (V
EE
and Return) trace widths (W) need to
be wide enough to allow the current to flow while the
rise in temperature for a given copper plate (e.g., 1oz.
or 2oz.) is kept to a maximum of 10癈 to 25癈. The
return (or power ground) trace should be the same
width as the positive voltage power traces (input/load)
and isolated from any ground and signal planes so
that the controllers power is common mode. Also,
these traces should be as short as possible in order to
minimize the IR drops between the input and the load.
Finally, the use of plated-through vias will be
necessary to make circuit connections to the power,
ground and signal planes of multi-layer PCBs.
R
SENSE
Power Trace
From V
EE
PCB Track Width:
0.03" per Ampere
using 1oz Cu
Power Trace
To MOSFET Source
Signal Trace
to MIC2589/MIC2595 V
EE
Pin
Signal Trace
to MIC2589/MIC2595 SENSE Pin
Note: Each SENSE lead trace shall be
balanced for best performance with equal
length/equal aspect ratio.
R
SENSE
metalized
contact pads
Figure 9. 4-Wire Kelvin Sense Connections for
R
SENSE
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MIC2595R-2YM TR | 功能描述:热插拔功率分布 Negative Voltage Hot-Swap Controller - Lead Free RoHS:否 制造商:Texas Instruments 产品:Controllers & Switches 电流限制: 电源电压-最大:7 V 电源电压-最小:- 0.3 V 工作温度范围: 功率耗散: 安装风格:SMD/SMT 封装 / 箱体:MSOP-8 封装:Tube |
| MIC2595R-2YM-TR | 功能描述:Hot Swap Controller, Sequencer 1 Channel -48V 14-SOIC 制造商:microchip technology 系列:- 包装:剪切带（CT） 零件状态:停产 类型:热交换控制器，序列发生器 通道数:1 内部开关:无 应用:-48V 特性:自动重试 可编程特性:限流，故障超时，UVLO 电压 - 电源:-80 V ~ -19 V 电流 - 输出（最大值）:- 工作温度:-40°C ~ 85°C 电流 - 电源:4mA 安装类型:表面贴装 封装/外壳:14-SOIC（0.154"，3.90mm 宽） 供应商器件封装:14-SOIC 功能引脚:CFILTER，CNLD，DRAIN，PGTIMER，OFF，ON，/PWRGD1，/PWRGD2，/PWRGD3 标准包装:1 |
| MIC2596-1BTS | 功能描述:IC SWITCH HOT SWAP DUAL 20-TSSOP RoHS:否 类别:集成电路 (IC) >> PMIC - 热交换 系列:- 产品培训模块:Obsolescence Mitigation Program 标准包装:100 系列:- 类型:热插拔开关 应用:通用 内部开关:是 电流限制:可调 电源电压:9 V ~ 13.2 V 工作温度:-40°C ~ 150°C 安装类型:表面贴装 封装/外壳:10-WFDFN 裸露焊盘 供应商设备封装:10-TDFN-EP（3x3） 包装:管件 |
| MIC2596-1BTS TR | 功能描述:IC SWITCH HOT SWAP DUAL 20-TSSOP RoHS:否 类别:集成电路 (IC) >> PMIC - 热交换 系列:- 产品培训模块:Obsolescence Mitigation Program 标准包装:100 系列:- 类型:热插拔开关 应用:通用 内部开关:是 电流限制:可调 电源电压:9 V ~ 13.2 V 工作温度:-40°C ~ 150°C 安装类型:表面贴装 封装/外壳:10-WFDFN 裸露焊盘 供应商设备封装:10-TDFN-EP（3x3） 包装:管件 |
| MIC2596-1BTSE | 功能描述:IC SWITCH HOT SWAP DUAL 20-TSSOP RoHS:否 类别:集成电路 (IC) >> PMIC - 热交换 系列:- 产品培训模块:Obsolescence Mitigation Program 标准包装:100 系列:- 类型:热插拔开关 应用:通用 内部开关:是 电流限制:可调 电源电压:9 V ~ 13.2 V 工作温度:-40°C ~ 150°C 安装类型:表面贴装 封装/外壳:10-WFDFN 裸露焊盘 供应商设备封装:10-TDFN-EP（3x3） 包装:管件 |
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