参数资料
型号: MIC37101-3.3BM TR
厂商: Micrel Inc
文件页数: 13/15页
文件大小: 0K
描述: IC REG LDO 3.3V 1A 8-SOIC
标准包装: 2,500
稳压器拓扑结构: 正,固定式
输出电压: 3.3V
输入电压: 最高 6V
电压 - 压降(标准): 0.28V @ 1A
稳压器数量: 1
电流 - 输出: 1A(最小)
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 8-SOIC(0.154",3.90mm 宽)
供应商设备封装: 8-SOIC
包装: 带卷 (TR)
其它名称: MIC37101-3.3BMTR
MIC37101-3.3BMTR-ND
Micrel, Inc.
Figure 4 shows copper area versus power dissipation
with each trace corresponding to a different temperature
rise above ambient.
From these curves, the minimum area of copper
necessary for the part to operate safely can be
determined. The maximum allowable temperature rise
must be calculated to determine operation along which
curve.
? T = T J(max) – T A(max)
T J(max) = 125°C
T A(max) = maximum ambient operating temp-
erature.
For example, the maximum ambient temperature is
50°C, the ? T is determined as follows:
MIC37100/37101/37102
Quick Method
Determine the power dissipation requirements for the
design along with the maximum ambient temperature at
which the device will be operated. Refer to Figure 5,
which shows safe operating curves for three different
ambient temperatures: 25°C, 50°C and 85°C. From
these curves, the minimum amount of copper can be
determined by knowing the maximum power dissipation
required. If the maximum ambient temperature is 50°C
and the power dissipation is as above, 836mW, the
curve in Figure 5 shows that the required area of copper
is 160mm 2 .
The θ JA of this package is ideally 63°C/W, but it will vary
depending upon the availability of copper ground plane
to which it is attached.
J
? T = 125°C – 50°C
? T = 75°C
Using Figure 4, the minimum amount of required copper
can be determined based on the required power
dissipation. Power dissipation in a linear regulator is
calculated as follows:
P D = (V IN – V OUT ) I OUT + V IN × I GND
If we use a 2.5V output device and a 3.3V input at an
output current of 1A, then our power dissipation is as
900
800
700
600
500
400
300
200
100
T = 125°C
T A = 85°C
50°C 25°C
follows:
0
0
0.25 0.50 0.75 1.00 1.25 1.50
P D = (3.3V – 2.5V) × 1A + 3.3V × 11mA
P D = 800mW + 36mW
P D = 836mW
From Figure 4, the minimum amount of copper required
to operate this application at a ? T of 75°C is 160mm 2 .
POWER DISSIPATION (W)
Figure 5. Copper Area vs. Power-SOIC
Power Dissipation
September 2007
13
M9999-090607
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