- 您现在的位置：买卖IC网 > PDF目录19717 > MIC39101-2.5BM TR (Micrel Inc)IC REG LDO 2.5V 1A 8-SOIC PDF资料下载
参数资料
| 型号： | MIC39101-2.5BM TR |
| 厂商： | Micrel Inc |
| 文件页数： | 10/12页 |
| 文件大小： | 0K |
| 描述： | IC REG LDO 2.5V 1A 8-SOIC |
| 标准包装： | 2,500 |
| 稳压器拓扑结构： | 正，固定式 |
| 输出电压： | 2.5V |
| 输入电压： | 最高 16V |
| 电压 - 压降（标准）： | 0.41V @ 1A |
| 稳压器数量： | 1 |
| 电流 - 输出： | 1A（最小） |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-SOIC（0.154"，3.90mm 宽） |
| 供应商设备封装： | 8-SOIC |
| 包装： | 带卷 (TR) |
| 其它名称： | MIC39101-2.5BMTR MIC39101-2.5BMTR-ND |
MIC39100/39101/39102
Micrel
EN ADJ
V OUT = 1.240V ? 1 +
?
AdjustableRegulatorDesign
MIC39102
V IN IN OUT
ENABLE
SHUTDOWN
GND
?
?
R1
R2
R1 ?
R2 ?
V OUT
C OUT
Using the power SOIC-8 reduces the θ JC dramatically and
allows the user to reduce θ CA . The total thermal resistance,
θ JA (junction-to-ambient thermal resistance) is the limiting
factor in calculating the maximum power dissipation capabil-
ity of the device. Typically, the power SOIC-8 has a θ JC of
20°C/W, this is signi?cantly lower than the standard SOIC-8
which is typically 75°C/W. θ CA is reduced because pins 5
through 8 can now be soldered directly to a ground plane
which signi?cantly reduces the case-to-sink thermal resistance
and sink to ambient thermal resistance.
R1 = R2 ? OUT ? 1 ?
Figure2.AdjustableRegulatorwithResistors
The MIC39102 allows programming the output voltage any-
where between 1.24V and the 16V maximum operating rating
of the family. Two resistors are used. Resistors can be quite
large, up to 1MΩ, because of the very high input impedance
and low bias current of the sense comparator: The resistor
values are calculated by:
? V ?
? 1.240 ?
Low-dropout linear regulators from Micrel are rated to a
maximum junction temperature of 125°C. It is important not to
exceed this maximum junction temperature during operation
of the device. To prevent this maximum junction temperature
from being exceeded, the appropriate ground plane heat sink
must be used.
SOIC-8
Where V O is the desired output voltage. Figure 2 shows
component de?nition. Applications with widely varying load
currents may scale the resistors to draw the minimum load
current required for proper operation (see above).
Power SOIC-8 Thermal Characteristics
JC
JA
CA
GROUND PLANE
HEAT SINK AREA
One of the secrets of the MIC39101/2’s performance is its
power SO-8 package featuring half the thermal resistance of
a standard SO-8 package. Lower thermal resistance means
more output current or higher input voltage for a given pack-
age size.
Lower thermal resistance is achieved by joining the four
ground leads with the die attach paddle to create a single-
piece electrical and thermal conductor. This concept has
been used by MOSFET manufacturers for years, proving
very reliable and cost effective for the user.
Thermal resistance consists of two main elements, θ JC (junc-
tion-to-case thermal resistance) and θ CA (case-to-ambient
thermal resistance). See Figure 3. θ JC is the resistance from
the die to the leads of the package. θ CA is the resistance
from the leads to the ambient air and it includes θ CS (case-
to-sink thermal resistance) and θ SA (sink-to-ambient thermal
resistance).
900
AMBIENT
PRINTED CIRCUIT BOARD
Figure 3. Thermal Resistance
Figure 4 shows copper area versus power dissipation with
each trace corresponding to a different temperature rise
above ambient.
From these curves, the minimum area of copper necessary for
the part to operate safely can be determined. The maximum
allowable temperature rise must be calculated to determine
operation along which curve.
900
T = 125 ° C
800
700
? T J A =
800
700
J
T A = 85 ° C
50 ° C
25 ° C
600
500
400
300
200
100
600
500
400
300
200
100
0
0
0.25 0.50 0.75 1.00 1.25 1.50
0
0
0.25 0.50 0.75 1.00 1.25 1.50
POWER DISSIPATION (W)
Figure 4. Copper Area vs. Power-SOIC
Power Dissipation
POWER DISSIPATION (W)
Figure 5. Copper Area vs. Power-SOIC
Power Dissipation
M9999-082505
10
August 2005
相关PDF资料 |
PDF描述 |
|---|---|
| EBM15DCWT | CONN EDGECARD 30POS DIP .156 SLD |
| ISPLSI 2096E-135LQ128 | IC PLD ISP 96I/O 7.5NS 128PQFP |
| M4A3-192/96-7VNI | IC CPLD ISP 4A 192MC 144TQFP |
| M4A3-192/96-6VNC | IC CPLD ISP 4A 192MC 144TQFP |
| HSC44DRTH | CONN EDGECARD 88POS DIP .100 SLD |
相关代理商/技术参数 |
参数描述 |
|---|---|
| MIC39101-3.0BM | 功能描述:IC REG LDO 3V 1A 8-SOIC RoHS:否 类别:集成电路 (IC) >> PMIC - 稳压器 - 线性 系列:- 标准包装:3,000 系列:- 稳压器拓扑结构:正，固定式 输出电压:3.8V 输入电压:最高 16V 电压 - 压降（标准）:0.3V @ 80mA 稳压器数量:1 电流 - 输出:80mA 电流 - 限制（最小）:- 工作温度:-40°C ~ 125°C 安装类型:表面贴装 封装/外壳:SC-74A，SOT-753 供应商设备封装:SOT-23-5 包装:带卷 (TR) 其它名称:MIC5203-3.8BM5TRMIC5203-3.8BM5TR-ND |
| MIC39101-3.0BM TR | 功能描述:IC REG LDO 3V 1A 8-SOIC RoHS:否 类别:集成电路 (IC) >> PMIC - 稳压器 - 线性 系列:- 标准包装:3,000 系列:- 稳压器拓扑结构:正，固定式 输出电压:3.8V 输入电压:最高 16V 电压 - 压降（标准）:0.3V @ 80mA 稳压器数量:1 电流 - 输出:80mA 电流 - 限制（最小）:- 工作温度:-40°C ~ 125°C 安装类型:表面贴装 封装/外壳:SC-74A，SOT-753 供应商设备封装:SOT-23-5 包装:带卷 (TR) 其它名称:MIC5203-3.8BM5TRMIC5203-3.8BM5TR-ND |
| MIC39101-3.3BM | 功能描述:IC REG LDO 3.3V 1A 8-SOIC RoHS:否 类别:集成电路 (IC) >> PMIC - 稳压器 - 线性 系列:- 标准包装:3,000 系列:- 稳压器拓扑结构:正，固定式 输出电压:3.8V 输入电压:最高 16V 电压 - 压降（标准）:0.3V @ 80mA 稳压器数量:1 电流 - 输出:80mA 电流 - 限制（最小）:- 工作温度:-40°C ~ 125°C 安装类型:表面贴装 封装/外壳:SC-74A，SOT-753 供应商设备封装:SOT-23-5 包装:带卷 (TR) 其它名称:MIC5203-3.8BM5TRMIC5203-3.8BM5TR-ND |
| MIC39101-3.3BM TR | 功能描述:IC REG LDO 3.3V 1A 8-SOIC RoHS:否 类别:集成电路 (IC) >> PMIC - 稳压器 - 线性 系列:- 标准包装:3,000 系列:- 稳压器拓扑结构:正，固定式 输出电压:3.8V 输入电压:最高 16V 电压 - 压降（标准）:0.3V @ 80mA 稳压器数量:1 电流 - 输出:80mA 电流 - 限制（最小）:- 工作温度:-40°C ~ 125°C 安装类型:表面贴装 封装/外壳:SC-74A，SOT-753 供应商设备封装:SOT-23-5 包装:带卷 (TR) 其它名称:MIC5203-3.8BM5TRMIC5203-3.8BM5TR-ND |
| MIC39101-3.3YM | 功能描述:低压差稳压器 - LDO 1.0A 1.0% Fixed Voltage LDO in Power SOIC8 Pkg(Lead Free) RoHS:否 制造商:Texas Instruments 最大输入电压:36 V 输出电压:1.4 V to 20.5 V 回动电压（最大值）:307 mV 输出电流:1 A 负载调节:0.3 % 输出端数量: 输出类型:Fixed 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-20 |
发布紧急采购，3分钟左右您将得到回复。