- 您现在的位置：买卖IC网 > PDF目录19633 > MIC5239-2.5BM TR (Micrel Inc)IC REG LDO 2.5V .5A 8-SOIC PDF资料下载
参数资料
| 型号： | MIC5239-2.5BM TR |
| 厂商： | Micrel Inc |
| 文件页数： | 10/14页 |
| 文件大小： | 0K |
| 描述： | IC REG LDO 2.5V .5A 8-SOIC |
| 标准包装： | 2,500 |
| 稳压器拓扑结构： | 正，固定式 |
| 输出电压： | 2.5V |
| 输入电压： | 最高 30V |
| 电压 - 压降（标准）： | 0.35V @ 500mA |
| 稳压器数量： | 1 |
| 电流 - 输出： | 500mA |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-SOIC（0.154"，3.90mm 宽） |
| 供应商设备封装： | 8-SOIC |
| 包装： | 带卷 (TR) |
| 其它名称： | MIC5239-2.5BMTR MIC5239-2.5BMTR-ND |
Micrel
Current Limit
Figure 4 displays a method for reducing the steady state
short-circuit current. The duration that the supply
delivers current is set by the time required for the error
flag output to discharge the 4.7μF capacitor tied to the
enable pin. The off time is set by the 200k ? resistor as it
recharges the 4.7μF capacitor, enabling the regulator.
This circuit reduces the short-circuit current from 800mA
to 40mA while allowing for regulator restart once the
short is removed.
1N4148
MIC5239
V IN
5V
SHUTDOWN
ENABLE
200k
200k
MIC5239
IN OUT
EN FLG
GND
4.7μF
V ERR
V OUT
C OUT
Figure 5. Thermal Resistance
Using the power MSOP-8 reduces the θ JC dramatically
and allows the user to reduce θ CA . The total thermal
resistance, θ JA (junction-to-ambient thermal resistance)
is the limiting factor in calculating the maximum power
dissipation capability of the device. Typically, the power
MSOP-8 has a θ JC of 80°C/W, this is significantly lower
than the standard MSOP-8 which is typically 200°C/W.
Figure 4. Remote Enable with Short-Circuit
Current Foldback
Thermal Characteristics
The MIC5239 is a high input voltage device, intended to
provide 500mA of continuous output current in two very
small profile packages. The power MSOP-8 allows the
device to dissipate about 50% more power than their
standard equivalents.
Power MSOP-8 Thermal Characteristics
One of the secrets of the MIC5239’s performance is its
power MSOP-8 package featuring half the thermal
resistance of a standard MSOP-8 package. Lower
thermal resistance means more output current or higher
input voltage for a given package size.
Lower thermal resistance is achieved by joining the four
ground leads with the die attach paddle to create a
single piece electrical and thermal conductor. This
concept has been used by MOSFET manufacturers for
years, proving very reliable and cost effective for the
user.
Thermal resistance consists of two main elements, θ JC
(junction-to-case thermal resistance) and θ CA (case-to-
ambient thermal resistance). See Figure 5. θ JC is the
resistance from the die to the leads of the package. θ CA
is the resistance from the leads to the ambient air and it
includes θ CS (case-to-sink thermal resistance) and θ SA
(sink-to-ambient thermal resistance).
θ CA is reduced because pins 5 through 8 can now be
soldered directly to a ground plane which significantly
reduces the case-to-sink thermal resistance and sink to
ambient thermal resistance.
Low-dropout linear regulators from Micrel are rated to a
maximum junction temperature of 125°C. It is important
not to exceed this maximum junction temperature during
operation of the device. To prevent this maximum
junction temperature from being exceeded, the
appropriate ground plane heatsink must be used.
Figure 6. Copper Area vs. Power-MSOP
Power Dissipation ( ? T JA )
Figure 6 shows copper area versus power dissipation
with each trace corresponding to a different temperature
rise above ambient.
From these curves, the minimum area of copper
necessary for the part to operate safely can be
determined. The maximum allowable temperature rise
must be calculated to determine operation along which
curve.
December 2007
10
M9999-121007
相关PDF资料 |
PDF描述 |
|---|---|
| ATF750LVC-15JI | IC CPLD 15NS LOW VOLT 28PLCC |
| AZ13DP-8 | BATT COIN ZINC AIR 1.4V 8PK 13 |
| DRA74-101-R | INDUCTOR HI TEMP 100UH .822A SMD |
| VE-BTW-CY-F3 | CONVERTER MOD DC/DC 5.5V 50W |
| GBM06DSUS | CONN EDGECARD 12POS DIP .156 SLD |
相关代理商/技术参数 |
参数描述 |
|---|---|
| MIC5239-3.0BM | 功能描述:IC REG LDO 3V .5A 8-SOIC RoHS:否 类别:集成电路 (IC) >> PMIC - 稳压器 - 线性 系列:- 标准包装:500 系列:- 稳压器拓扑结构:正，固定式 输出电压:12V 输入电压:14.5 V ~ 35 V 电压 - 压降（标准）:- 稳压器数量:1 电流 - 输出:500mA 电流 - 限制（最小）:- 工作温度:-40°C ~ 125°C 安装类型:通孔 封装/外壳:TO-205AD，TO-39-3 金属罐 供应商设备封装:TO-39 包装:散装 其它名称:*LM78M12CH*LM78M12CH/NOPBLM78M12CH |
| MIC5239-3.0BM TR | 功能描述:IC REG LDO 3V .5A 8-SOIC RoHS:否 类别:集成电路 (IC) >> PMIC - 稳压器 - 线性 系列:- 标准包装:500 系列:- 稳压器拓扑结构:正，固定式 输出电压:12V 输入电压:14.5 V ~ 35 V 电压 - 压降（标准）:- 稳压器数量:1 电流 - 输出:500mA 电流 - 限制（最小）:- 工作温度:-40°C ~ 125°C 安装类型:通孔 封装/外壳:TO-205AD，TO-39-3 金属罐 供应商设备封装:TO-39 包装:散装 其它名称:*LM78M12CH*LM78M12CH/NOPBLM78M12CH |
| MIC5239-3.0BMM | 功能描述:IC REG LDO 3V .5A 8-MSOP RoHS:否 类别:集成电路 (IC) >> PMIC - 稳压器 - 线性 系列:- 标准包装:500 系列:- 稳压器拓扑结构:正，固定式 输出电压:12V 输入电压:14.5 V ~ 35 V 电压 - 压降（标准）:- 稳压器数量:1 电流 - 输出:500mA 电流 - 限制（最小）:- 工作温度:-40°C ~ 125°C 安装类型:通孔 封装/外壳:TO-205AD，TO-39-3 金属罐 供应商设备封装:TO-39 包装:散装 其它名称:*LM78M12CH*LM78M12CH/NOPBLM78M12CH |
| MIC5239-3.0BMM TR | 功能描述:IC REG LDO 3V .5A 8-MSOP RoHS:否 类别:集成电路 (IC) >> PMIC - 稳压器 - 线性 系列:- 标准包装:500 系列:- 稳压器拓扑结构:正，固定式 输出电压:12V 输入电压:14.5 V ~ 35 V 电压 - 压降（标准）:- 稳压器数量:1 电流 - 输出:500mA 电流 - 限制（最小）:- 工作温度:-40°C ~ 125°C 安装类型:通孔 封装/外壳:TO-205AD，TO-39-3 金属罐 供应商设备封装:TO-39 包装:散装 其它名称:*LM78M12CH*LM78M12CH/NOPBLM78M12CH |
| MIC5239-3.0BS | 功能描述:IC REG LDO 3V .5A SOT-223 RoHS:否 类别:集成电路 (IC) >> PMIC - 稳压器 - 线性 系列:- 标准包装:500 系列:- 稳压器拓扑结构:正，固定式 输出电压:12V 输入电压:14.5 V ~ 35 V 电压 - 压降（标准）:- 稳压器数量:1 电流 - 输出:500mA 电流 - 限制（最小）:- 工作温度:-40°C ~ 125°C 安装类型:通孔 封装/外壳:TO-205AD，TO-39-3 金属罐 供应商设备封装:TO-39 包装:散装 其它名称:*LM78M12CH*LM78M12CH/NOPBLM78M12CH |
发布紧急采购，3分钟左右您将得到回复。