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参数资料
| 型号： | MICRF600DEV1 |
| 厂商： | Micrel Inc |
| 文件页数： | 19/21页 |
| 文件大小： | 0K |
| 描述： | KIT DEV RADIOWIRE 902-928MHZ |
| 标准包装： | 1 |
| 系列： | RadioWire® |
| 类型： | 收发器，ISM |
| 频率： | 850MHz ~ 950MHz |
| 适用于相关产品： | MICRF600 |
| 已供物品： | 2 个板，电池，线缆，CD |
| 产品目录页面： | 571 (CN2011-ZH PDF) |
| 其它名称： | 576-1605 |
Micrel, Inc.
Application Circuit Illustration
LDO
MCU
MICRF600
4004
Figure 11. Circuit illustration of MICRF600, LDO and MCU
Figure 11. shows a typical set-up with the MICRF600, a
MICRF600/MICRF600Z
Assembling the MICRF600
Recommended Reflow Temperature Profile
When the MICRF600 module is being automatically
assembled to a PCB, care must be taken not to expose
the module for temperature above the maximum specified.
Figure 13 shows the recommended reflow temperature
profile.
Low-Drop-Out voltage regulator (LDO)
and a mikro-
controller (MCU). When the MICRF600 and the MCU runs
on the same power supply (min 2.0, max. 2.5V), the IO
can be connected directly to the MCU. If the MCU needs a
higher VDD than the max. specified VDD of the MICRF600
(2.5V), voltage dividers need to be added on the IO lines
not to override the max. input voltage.
Figure 12 shows a recommended voltage divider circuit for
a MCU running at 3.0V and the MICRF600 at 2.5V.
MICRF6xx MCU
3k3
Figure 13. Recommended Reflow Temperature Reflow
Shock/Vibration during Reflow
The module has several components inside which are
CS
CS
assembled in a reflow process. These components may
SCLK
18k
18k
3k3
SCLK
reflow again when the module is assembled onto a PCB. It
is therefore important that the module is not subjected to
any mechanical shock or vibration during this process.
Handassembling the MICRF600
It is recommended to use solder paste also during hand
IO
18k
3k3
IO
assembling of the module. Because of the module ground
pad on the bottom side, the module will be assembled
most efficient if the heat is being subjected to the bottom
side of the PCB. The heat will be transferred trough the
PCB due the ground vias under the module (see Layout
DATAIXO
DATACLK
LD
RSSI
15k
DATAIXO
DATACLK
LD
RSSI
Considerations). In addition, it is recommended to use a
solder tip on the signal and power pads, to make sure the
solder points are properly melted.
Figure 12. How to connect MCU600 (2.5V) and MCU (3.0V)
July 2006
19
M9999-082505
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PDF描述 |
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| MK02/0-1A66-500W | SENSOR REED SPST-NO |
| MK02/6-0 | SENSOR REED PCB 24MM T/H |
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MICRF600TR | 制造商:MICREL 制造商全称:Micrel Semiconductor 功能描述:902-928MHz ISM Band Transceiver Module |
| MICRF600Z | 功能描述:TXRX ISM 902-928MHZ 11.5X14.1MM RoHS:是 类别:RF/IF 和 RFID >> RF 收发器 系列:RadioWire® 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:30 系列:- 频率:4.9GHz ~ 5.9GHz 数据传输率 - 最大:54Mbps 调制或协议:* 应用:* 功率 - 输出:-3dBm 灵敏度:- 电源电压:2.7 V ~ 3.6 V 电流 - 接收:* 电流 - 传输:* 数据接口:PCB，表面贴装 存储容量:- 天线连接器:PCB，表面贴装 工作温度:-25°C ~ 85°C 封装/外壳:68-TQFN 裸露焊盘 包装:管件 |
| MICRF600Z TR | 功能描述:TXRX ISM 902-928MHZ 11.5X14.1MM RoHS:是 类别:RF/IF 和 RFID >> RF 收发器 系列:RadioWire® 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:30 系列:- 频率:4.9GHz ~ 5.9GHz 数据传输率 - 最大:54Mbps 调制或协议:* 应用:* 功率 - 输出:-3dBm 灵敏度:- 电源电压:2.7 V ~ 3.6 V 电流 - 接收:* 电流 - 传输:* 数据接口:PCB，表面贴装 存储容量:- 天线连接器:PCB，表面贴装 工作温度:-25°C ~ 85°C 封装/外壳:68-TQFN 裸露焊盘 包装:管件 |
| MICRF610 | 制造商:MICREL 制造商全称:Micrel Semiconductor 功能描述:868-870MHz ISM Band Transceiver Module |
| MICRF610_0608 | 制造商:MICREL 制造商全称:Micrel Semiconductor 功能描述:868-870MHz ISM Band Transceiver Module |
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