参数资料
| 型号： | MICROSMD010-2 |
| 厂商： | TE Connectivity |
| 文件页数： | 18/20页 |
| 文件大小： | 0K |
| 描述： | POLYSWITCH 0.10A RESET FUSE SMD |
| 标准包装： | 1 |
| 系列： | PolySwitch® |
| 电流 - 维持(Ih)： | 100mA |
| 电流 - 跳闸(It)： | 250mA |
| 电流 - 最大： | 10A |
| 电压 - 最大： | 30V |
| R最小/最大： | 2.100 ~ 15.00 欧姆 |
| 跳闸时间： | 1s |
| 封装/外壳： | 1210（3225 公制），凹陷 |
| 包装： | 剪切带 (CT) |
| 其它名称： | MICROSMD010CT |
Solder Reflow and Rework Recommendation for Surface-mount Devices
Classification Reflow Profiles
Profile Feature
Pb-Free Assembly
Figure S14
Average ramp up rate (Ts MAX to Tp)
Preheat
? Temperature min. (Ts MIN )
? Temperature max. (Ts MAX )
? Time (ts MIN to ts MAX )
3°C/second max.
150°C
200°C
60-120 seconds
Tp
T L
Ts MAX
Ramp up
tp
t L
Critical Zone
T L to Tp
Time maintained above:
? Temperature (T L )
? Time (t L )
217°C
60-150 seconds
Ts MIN
ts
Peak/Classification temperature (Tp)
260°C
Preheat
Ramp down
Time within 5°C of actual peak temperature
Time (tp)
Ramp down rate
Time 25°C to peak temperature
30 seconds max.
3°C/second max.
8 minutes max.
25
Reflow Profile
t 25?C to Peak
Time
Note: All temperatures refer to topside of the package, measured on the package
body surface.
Solder Reflow
? Recommended reflow methods:
- IR
- Hot air
- Nitrogen
? Recommended maximum paste thickness: 0.25mm (0.010 inch)
? Devices can be cleaned using standard methods and aqueous solvents.
? We believe the optimum conditions for forming acceptable solder fillets occur when a reasonable amount of solder paste is placed
underneath each device’s termination. As such, we request that customers comply with our recommended solder pad layouts.
? Customer should validate that the solder paste amount and reflow recommendations meet its application.
? We request that customer board layouts refrain from placing raised features (e.g. vias, nomenclature, traces, etc.) underneath PolySwitch
devices. It is possible that raised features could negatively impact solderability performance of our devices.
Rework
? femtoSMD, picoSMD, nanoSMD, microSMD and miniSMD series: standard industry practices.
Please also avoid direct contact to the device.
? SMD series: rework should be confined to removal of the installed product and replacement with a fresh device.
Table S7 Tape and Reel Specifications for Surface-mount Devices (in Millimeters)
miniSMDC
and
midSMD
except
femtoSMDC
picoSMDC
nanoSMDC
microSMD decaSMDC050F/60 miniSMDE190 decaSMDC050F/60
SMD
SMD2
Description
W
P 0
P 1
EIA 481-1
8.0 ± 0.30
4.0 ± 0.10
4.0 ± 0.10
EIA 481-1
8.0 ± 0.30
4.0 ± 0.10
4.0 ± 0.10
EIA 481-1
8.0 ± 0.30
4.0 ± 0.10
4.0 ± 0.10
EIA 481-1
8.0 ± 0.30
4.0 ± 0.10
4.0 ± 0.10
EIA 481-1
12.0 ± 0.30
4.0 ± 0.10
8.0 ± 0.10
EIA 481-2
24.0 ± 0.30
4.0 ± 0.10
8.0 ± 0.10
EIA 481-2
16.0 ± 0.30
4.0 ± 0.10
8.0 ± 0.10
EIA 481-2
16.0 ± 0.30
4.0 ± 0.10
8.0 ± 0.10
EIA 481-2
16.0 ± 0.30
4.0 ± 0.10
12.0 ± 0.10
12
P 2
A 0
B 0
B 1 max.
D 0
F
E 1
E 2 min.
T max.
T 1 max.
K 0
Leader min.
Trailer min.
2.0 ± 0.05
Table S8
Table S8
4.35
1.55 ± .05
3.50 ± 0.05
1.75 ± 0.10
6.25
0.6
0.1
Table S8
390
160
2.0 ± 0.05
Table S8
Table S8
4.35
1.55 ± .05
3.50 ± 0.05
1.75 ± 0.10
6.25
0.6
0.1
Table S8
390
160
2.0 ± 0.05
1.95 ± 0.10
Table S8
4.35
1.55 ± .05
3.50 ± 0.05
1.75 ± 0.10
6.25
0.6
0.1
Table S8
390
160
2.0 ± 0.05
2.9 ± 0.10
3.50 ± 0.10
4.35
1.55 ± .05
3.50 ± 0.05
1.75 ± 0.10
6.25
0.6
0.1
Table S8
390
160
2.0 ± 0.05
Table S8
Table S8
8.2
1.5 + 0.10/ -.00
5.50 ± 0.05
1.75 ± 0.10
10.25
0.6
0.1
Table S8
390
160
2.0 ± 0.10
5.70 ± 0.10
11.90 ± 0.10
20.1
1.55 ± .05
11.50 ± 0.10
1.75 ± 0.10
22.25
0.6
0.1
0.95 ± 0.10
400
160
2.0 ± 0.10
5.11 ± 0.15
5.6 ± 0.23
12.1
1.5 + 0.10/ -.00
7.50 ± 0.10
1.75 ± 0.10
14.25
0.6
0.1
1.8 ± 0.15
400
160
2.0 ± 0.10
5.6 ± 0.23
8.1 ± 0.15
12.1
1.5 + 0.10/ -.00
7.50 ± 0.10
1.75 ± 0.10
14.25
0.6
0.1
3.2 ± 0.15
400
160
2.0 ± 0.10
6.9 ± 0.23
9.6 ± 0.15
12.1
1.5 + 0.10/ -.00
7.50 ± 0.10
1.75 ± 0.10
14.25
0.6
0.1
3.4 ± 0.15
400
160
132
RoHS Compliant, ELV Compliant
HF Halogen Free
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MICROSMD010F | 制造商:TE Connectivity 功能描述:POLYSWITCH SMD 1210 0.1A 制造商:TE Connectivity 功能描述:POLYSWITCH, SMD, 1210, 0.1A 制造商:TE Connectivity / Raychem 功能描述:POLYSWITCH, SMD, 1210, 0.1A; Tripping Current:250mA; Initial Resistance Max:15ohm; Operating Voltage:30V; Series:MicroSMD; Approval Bodies:CSA / TUV; Approval Category:ELV Compliant, UL Recognised; External Depth:2.8mm; External ;RoHS Compliant: Yes |
| microSMD010F-02 | 制造商:Tyco Electronics (CPD) 功能描述:0.1A@20 0.25A@20 12V 100A 3.2~2.5mm PolySwitch/|XCb`/T[~X^ Cut Tape |
| MICROSMD010F-2 | 功能描述:可复位保险丝 .10A 30V 10A Imax RoHS:否 制造商:Bourns 电流额定值: 电阻:7.5 Ohms 最大直流电压: 保持电流:0.1 A 安装风格:SMD/SMT 端接类型:SMD/SMT 跳闸电流:0.6 A 引线间隔: 系列:MF-PSHT 工作温度范围:- 40 C to + 125 C |
| MICROSMD035-02 | 功能描述:可复位保险丝 - RoHS:否 制造商:Bourns 电流额定值: 电阻:7.5 Ohms 最大直流电压: 保持电流:0.1 A 安装风格:SMD/SMT 端接类型:SMD/SMT 跳闸电流:0.6 A 引线间隔: 系列:MF-PSHT 工作温度范围:- 40 C to + 125 C |
| MICROSMD035-2 | 功能描述:可复位保险丝 .35A 6V 40A Imax RoHS:否 制造商:Bourns 电流额定值: 电阻:7.5 Ohms 最大直流电压: 保持电流:0.1 A 安装风格:SMD/SMT 端接类型:SMD/SMT 跳闸电流:0.6 A 引线间隔: 系列:MF-PSHT 工作温度范围:- 40 C to + 125 C |
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