参数资料
| 型号： | MIS-019-01-F-D |
| 厂商： | Samtec Inc |
| 文件页数： | 1/1页 |
| 文件大小： | 0K |
| 描述： | CONN SOCKET STRIP 38POS |
| 标准包装： | 1 |
| 系列： | QStrip® MIS |
| 连接器类型： | 插口，中央触点带 |
| 位置数： | 38 |
| 间距： | 0.025"（0.64mm） |
| 行数： | 2 |
| 安装类型： | 表面贴装 |
| 特点： | 板导轨，接地母线（板） |
| 触点表面涂层： | 金 |
| 触点涂层厚度： | 闪光 |
| 包装： | 托盘 |
| 配接层叠高度： | 11mm，16mm，18.75mm，22mm |
| 板上方高度： | 0.143"（3.63mm） |
F-214
MIS–019–01–F–D
?
MIS–057–01–L–D
MIS–038–01–F–D
(0,635 mm) .025"
MIXED TECHNOLOGY SOCKET
Integral metal plane
MIS SERIES
SPECIFICATIONS
For complete speci?cations and
recommended PCB layouts see
www.samtec.com?MIS
Insulator Material:
Liquid Crystal Polymer
Contact Material:
Phosphor Bronze
Plating:
Au or Sn over
50μ" (1,27 μm) Ni
Operating Temp Range:
-55°C to +125°C
Board Mates:
MIT
Cable Mates:
MICD
? Mixed
technology
footprint
for power or ground
Polarized
Type Rated @ 3dB Insertion Loss*
Voltage Rating:
275 VAC
Max Cycles:
100
RoHS Compliant:
Yes
Processing:
Lead–Free Solderable:
Yes
SMT Lead Coplanarity:
(0,10 mm) .004" max (019-057)
MIT/MIS
5 mm Stack Height
Single-Ended Signaling –D 8.5 GHz / 17 Gbps
Differential Pair Signaling –D 8.5 GHz / 17 Gbps
Differential Pair Signaling –DP 9.5 GHz / 19 Gbps
*Performance data includes effects of a non-optimized PCB.
Performance data for other stack heights and complete
test data available at www.samtec.com?MIS or contact
sig@samtec.com
76 signal lines
per linear inch
OTHER SOLUTIONS
? Board Spacing Standoffs.
See SO Series.
Board Stacking:
For applications requiring more
than two connectors per board
contact ipg@samtec.com
RECOGNITIONS
MIS
NO. OF POSITIONS
PER ROW
01
PLATING
OPTION
D
OTHER
OPTION
For complete scope of
recognitions see
www.samtec.com/quality
–K
ALSO AVAILABLE
(MOQ Required)
? 11 mm, 16 mm, 18,75 mm
and 22 mm stack height
–019, –038, –057
(38 total positions per bank)
–F
= Gold Flash on Signal Pins and
Ground Plane, Matte Tin on tails
–L
= 10μ" (0,25 μm)
Gold on Signal Pins and
Ground Plane, Matte Tin on tails
= (7,00 mm)
.275" DIA
Polyimide
?lm Pick &
Place Pad
–TR
= Tape &
Reel
? 30μ" (0,76 μm) Gold
? Differential Pair and
“Partitionable” (combine
differential & single-ended
banks in same connector)
available.
? 76, 95, 114 and 133
positions per row
? Edge Mount
(6,22)
.245
(No. of Positions/19) x (12,70) .500 + (12,70) .500
(12,70) .500
01
–C*
= Electro-Polished Selective
50μ" (1,27 μm) min Au over
150μ" (3,81 μm) Ni on
Signal Pins in contact area,
10μ" (0,25 μm) min Au over
50μ" (1,27 μm) Ni on Ground
Plane in contact area, Matte Tin
over 50μ" (1,27 μm) min Ni
on all solder tails
Contact Samtec.
(0,635)
.025
(0,15)
.006
02
(1,32)
*Note: –C Plating passes
10 year MFG testing
Note: Some lengths, styles
and options are non-standard,
non-returnable.
.052
(0,69) .027
Note: Rugged through-hole ground plane soldered to board
(requires paste-over-hole, not press ?t) for added retention to PCB.
WWW.SAMTEC.COM
(3,43)
.135
(7,49)
.295
(3,63)
.143
(0,18)
.007
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MIS-019-01-F-D-K | 制造商:Samtec Inc 功能描述:Conn Micro High Speed Socket Strip SKT 38 POS 0.64mm Solder ST Thru-Hole/SMD 制造商:Samtec Inc 功能描述:CONN MICRO HS SCKT STRP SKT 38 POS 0.64MM SLDR ST TH/SMD - Bulk |
| MIS-019-01-F-D-K-TR | 制造商:Samtec Inc 功能描述:CONN MICRO HS SCKT STRP SKT 38 POS 0.64MM SLDR ST TH/SMD - Tape and Reel |
| MIS-019-01-F-D-TR | 制造商:Samtec Inc 功能描述:CONN MICRO HS SCKT STRP SKT 38 POS 0.64MM SLDR ST TH/SMD - Tape and Reel |
| MIS-019-01-F-D-TY | 制造商:Samtec Inc 功能描述:CONN MICRO HS SCKT STRP SKT 38 POS 0.64MM SLDR ST TH/SMD - Bulk |
| MIS-019-01-H-D | 制造商:Samtec Inc 功能描述:CONN MICRO HS SCKT STRP SKT 38 POS 0.64MM SLDR ST TH/SMD - Bulk |
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