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参数资料
型号： MK10DX256ZVMD10R
厂商： FREESCALE SEMICONDUCTOR INC
元件分类： 微控制器/微处理器
英文描述： FLASH, 100 MHz, RISC MICROCONTROLLER, PBGA144
封装： 13 X 13 MM, MAPBGA-144
文件页数： 14/70页
文件大小： 1001K
代理商： MK10DX256ZVMD10R
5.3.2 Thermal attributes
Board type
Symbol
Description
144 LQFP
144
MAPBGA
Unit
Notes
Single-layer
(1s)
RθJA
Thermal
resistance,
junction to
ambient (natural
convection)
52
50
°C/W
1
Four-layer
(2s2p)
RθJA
Thermal
resistance,
junction to
ambient (natural
convection)
44
30
°C/W
1
Single-layer
(1s)
RθJMA
Thermal
resistance,
junction to
ambient (200 ft./
min. air speed)
43
41
°C/W
1
Four-layer
(2s2p)
RθJMA
Thermal
resistance,
junction to
ambient (200 ft./
min. air speed)
38
27
°C/W
1
—
RθJB
Thermal
resistance,
junction to
board
33
17
°C/W
2
—
RθJC
Thermal
resistance,
junction to case
11
10
°C/W
3
—
ΨJT
Thermal
characterization
parameter,
junction to
package top
outside center
(natural
convection)
2
°C/W
4
1.
Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental
Conditions—Natural Convection (Still Air), or EIA/JEDEC Standard JESD51-6, Integrated Circuit Thermal Test Method
Environmental Conditions—Forced Convection (Moving Air).
2.
Determined according to JEDEC Standard JESD51-8, Integrated Circuit Thermal Test Method Environmental
Conditions—Junction-to-Board.
3.
Determined according to Method 1012.1 of MIL-STD 883, Test Method Standard, Microcircuits, with the cold plate
temperature used for the case temperature. The value includes the thermal resistance of the interface material
between the top of the package and the cold plate.
4.
Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental
Conditions—Natural Convection (Still Air).
6 Peripheral operating requirements and behaviors
All digital I/O switching characteristics assume:
Peripheral operating requirements and behaviors
K10 Sub-Family Data Sheet Data Sheet, Rev. 5, 5/2011.
Freescale Semiconductor, Inc.
Preliminary
21
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