参数资料
型号: MK1413SLFTR
厂商: IDT, Integrated Device Technology Inc
文件页数: 3/7页
文件大小: 0K
描述: IC AUDIO CLK SOURCE MPEG 8-SOIC
标准包装: 2,500
类型: 时钟合成器 - 音频
PLL:
输入: 时钟,晶体
输出: CMOS
电路数: 1
比率 - 输入:输出: 1:1
差分 - 输入:输出: 无/无
频率 - 最大: 16.9344MHz
除法器/乘法器: 无/无
电源电压: 3 V ~ 5.5 V
工作温度: 0°C ~ 70°C
安装类型: 表面贴装
封装/外壳: 8-SOIC(0.154",3.90mm 宽)
供应商设备封装: 8-SOIC
包装: 带卷 (TR)
MK1413
MPEG AUDIO CLOCK SOURCE
CLOCK SYNTHESIZER
IDT / ICS MPEG AUDIO CLOCK SOURCE
3
MK1413
REV G 051310
Application Information
Series Termination Resistor
Clock output traces should use series termination. For
series terminating a 50
trace (a commonly used trace
impedance), place a 33
resistor in series with the clock line
and as close to the clock output pin as possible. The
nominal impedance of the clock output is 20
.
Crystal Load Capacitors
The device crystal connections should include pads for
capacitors from X1 to ground and from X2 to ground, and a
parallel rsonant 14.31818 MHz crystal is recommended.
These capacitors are used to adjust the stray capacitance of
the board to match the nominally required crystal load
capacitance. To reduce possible noise pickup, use very
short PCB traces (and no vias) been the crystal and device.
The value (in pF) of each crystal load capacitor should equal
(CL -4) x2, where CL is the crystal’s load (correlation)
capacitance in pF. The frequency tolerance of the crystal
should be 50 ppm or better.For a clock input, connect X1
and leave X2 unconnected. Because these capacitors
adjust the stray capacitance of the PCB, check the output
frequency using your final layout to see if the value of C
should be changed.
PCB Layout Recommendations
Observe the following guidelines for optimum device
performance and lowest output phase noise:
1) Each 0.01F decoupling capacitor should be mounted on
the component side of the board as close to the VDD pin as
possible. No vias should be used between decoupling
capacitor and VDD pin. The PCB trace to VDD pin should
be kept as short as possible, as should the PCB trace to the
ground via. Distance of the ferrite bead and bulk decoupling
from the device is less critical.
2) The external crystal should be mounted next to the device
with short traces. The X1 and X2 traces should not be
routed next to each other with minimum spaces, instead
they should be separated and away from other traces.
3) To minimize EMI, and obtain the best signal integrity, the
33
series termination resistor should be placed close to
the clock output.
4) An optimum layout is one with all components on the
same side of the board, minimizing vias through other signal
layers (the ferrite bead and bulk decoupling capacitor can be
mounted on the back). Other signal traces should be routed
away from the MK1413. This includes signal traces just
underneath the device, or on layers adjacent to the ground
plane layer used by the device.
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