参数资料
型号: MK1725GLF
厂商: INTEGRATED DEVICE TECHNOLOGY INC
元件分类: 时钟产生/分配
英文描述: 136 MHz, OTHER CLOCK GENERATOR, PDSO16
封装: 0.173 INCH, ROHS COMPLIANT, TSSOP-16
文件页数: 3/8页
文件大小: 210K
代理商: MK1725GLF
MK1725
QUAD OUTPUT SPREAD SPECTRUM CLOCK GENERATOR
SSCG
IDT QUAD OUTPUT SPREAD SPECTRUM CLOCK GENERATOR
3
MK1725
REV G 033109
MK1725
QUAD OUTPUT SPREAD SPECTRUM CLOCK GENERATOR
SSCG
External Components
Decoupling Capacitor
As with any high performance mixed-signal IC, the MK1725
must be isolated from system power supply noise to perform
optimally.
A decoupling capacitor of 0.01F must be connected
between each VDD and the PCB ground plane.
Series Termination Resistor
Clock output traces over one inch should use series
termination. To series terminate a 50
trace (a commonly
used trace impedance), place a 33
resistor in series with
the clock line, as close to the clock output pin as possible.
The nominal impedance of the clock output is 20
.
Crystal Load Capacitors
The device crystal connections should include pads for
small capacitors from X1 to ground and from X2 to ground.
These capacitors are used to adjust the stray capacitance of
the board to match the nominally required crystal load
capacitance. Because load capacitance can only be
increased in this trimming process, it is important to keep
stray capacitance to a minimum by using very short PCB
traces (and no vias) between the crystal and device. Crystal
capacitors must be connected from each of the pins X1 and
X2 to ground.
The value (in pF) of these crystal caps should equal (CL
-6)*2. In this equation, CL= crystal load capacitance in pF.
Example: For a crystal with an 18 pF load capacitance, each
crystal capacitor would be 24 pF [(18-6) x 2 = 24].
PCB Layout Recommendations
For optimum device performance and lowest output phase
noise, the following guidelines should be observed.
1) The 0.01F decoupling capacitors should be mounted on
the component side of the board as close to the VDD pin as
possible. No vias should be used between the decoupling
capacitors and VDD pins. The PCB trace to VDD pins
should be kept as short as possible, as should the PCB
trace to the ground via.
2) The external crystal should be mounted just next to the
device with short traces. The X1 and X2 traces should not
be routed next to each other with minimum spaces, instead
they should be separated and away from other traces.
3) To minimize EMI the 33
series termination resistor (if
needed) should be placed close to the clock outputs.
4) An optimum layout is one with all components on the
same side of the board, minimizing vias through other signal
layers. Other signal traces should be routed away from the
MK1725. This includes signal traces just underneath the
device, or on layers adjacent to the ground plane layer used
by the device.
10
CLK4
Output
Clock 4 output. Frequency and spread amount are determined
by table above. Weak internal pull-down when tri-state.
11
GND
Power
Connect to ground.
12
VDD
Power
Connect to +3.3 V.
13
S2
Input
Select pin 2. Determines frequency and spread amount on
output clocks as per table above. Internal pull-down.
14
PDTS
Input
Power Down Tri-state. Powers down entire chip and tri-states
outputs when low. Internal pull-up resistor.
15
VDD
Power
Connect to +3.3V.
16
X2
Input
20 MHz to 34 MHz crystal input. Float for clock input.
Pin
Number
Pin
Name
Pin
Type
Pin Description
相关PDF资料
PDF描述
MK1726-01AS 32 MHz, OTHER CLOCK GENERATOR, PDSO8
MK1726-01ASTRLF 32 MHz, OTHER CLOCK GENERATOR, PDSO8
MK1726-01ASLF 32 MHz, OTHER CLOCK GENERATOR, PDSO8
MK1728AM-01LF 36 MHz, OTHER CLOCK GENERATOR, PDSO8
MK1728AG-01LF 36 MHz, OTHER CLOCK GENERATOR, PDSO8
相关代理商/技术参数
参数描述
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