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参数资料
型号： MK20DX256ZVLQ10
厂商： FREESCALE SEMICONDUCTOR INC
元件分类： 微控制器/微处理器
英文描述： 32-BIT, FLASH, 100 MHz, RISC MICROCONTROLLER, PQFP144
封装： 20 X 20 MM, LQFP-144
文件页数： 23/74页
文件大小： 1023K
代理商： MK20DX256ZVLQ10
Table of Contents
1 Ordering parts...........................................................................5
1.1 Determining valid orderable parts......................................5
2 Part identification......................................................................5
2.1 Description.........................................................................5
2.2 Format...............................................................................5
2.3 Fields.................................................................................5
2.4 Example............................................................................6
3 Terminology and guidelines......................................................6
3.1 Definition: Operating requirement......................................6
3.2 Definition: Operating behavior...........................................7
3.3 Definition: Attribute............................................................7
3.4 Definition: Rating...............................................................8
3.5 Result of exceeding a rating..............................................8
3.6 Relationship between ratings and operating
requirements......................................................................8
3.7 Guidelines for ratings and operating requirements............9
3.8 Definition: Typical value.....................................................9
3.9 Typical value conditions....................................................10
4 Ratings......................................................................................10
4.1 Thermal handling ratings...................................................11
4.2 Moisture handling ratings..................................................11
4.3 ESD handling ratings.........................................................11
4.4 Voltage and current operating ratings...............................11
5 General.....................................................................................12
5.1 Nonswitching electrical specifications...............................12
5.1.1
Voltage and current operating requirements......12
5.1.2
LVD and POR operating requirements...............13
5.1.3
Voltage and current operating behaviors............14
5.1.4
Power mode transition operating behaviors.......15
5.1.5
Power consumption operating behaviors............16
5.1.6
EMC radiated emissions operating behaviors....20
5.1.7
Designing with radiated emissions in mind.........21
5.1.8
Capacitance attributes........................................21
5.2 Switching specifications.....................................................21
5.2.1
Device clock specifications.................................21
5.2.2
General switching specifications.........................22
5.3 Thermal specifications.......................................................23
5.3.1
Thermal operating requirements.........................23
5.3.2
Thermal attributes...............................................23
6 Peripheral operating requirements and behaviors....................24
6.1 Core modules....................................................................24
6.1.1
Debug trace timing specifications.......................24
6.1.2
JTAG electricals..................................................25
6.2 System modules................................................................28
6.3 Clock modules...................................................................28
6.3.1
MCG specifications.............................................28
6.3.2
Oscillator electrical specifications.......................31
6.3.3
32kHz Oscillator Electrical Characteristics.........33
6.4 Memories and memory interfaces.....................................34
6.4.1
Flash (FTFL) electrical specifications.................34
6.4.2
EzPort Switching Specifications.........................36
6.4.3
Flexbus Switching Specifications........................37
6.5 Security and integrity modules..........................................39
6.6 Analog...............................................................................39
6.6.1
ADC electrical specifications..............................39
6.6.2
CMP and 6-bit DAC electrical specifications......47
6.6.3
12-bit DAC electrical characteristics...................49
6.6.4
Voltage reference electrical specifications..........52
6.7 Timers................................................................................53
6.8 Communication interfaces.................................................54
6.8.1
USB electrical specifications...............................54
6.8.2
USB DCD electrical specifications......................54
6.8.3
USB VREG electrical specifications...................54
6.8.4
CAN switching specifications..............................55
6.8.5
DSPI switching specifications (low-speed
mode)..................................................................55
6.8.6
DSPI switching specifications (high-speed
mode)..................................................................57
6.8.7
I2C switching specifications................................58
6.8.8
UART switching specifications............................59
6.8.9
SDHC specifications...........................................59
6.8.10
I2S switching specifications................................60
6.9 Human-machine interfaces (HMI)......................................62
6.9.1
TSI electrical specifications................................62
7 Dimensions...............................................................................63
7.1 Obtaining package dimensions.........................................63
8 Pinout........................................................................................63
8.1 K20 Signal Multiplexing and Pin Assignments..................63
K20 Sub-Family Data Sheet Data Sheet, Rev. 5, 5/2011.
Freescale Semiconductor, Inc.
Preliminary
3
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相关代理商/技术参数
参数描述
MK20DX256ZVLQ10R 功能描述:ARM微控制器 - MCU Kinetis 256Kflex USB RoHS:否 制造商:STMicroelectronics 核心:ARM Cortex M4F 处理器系列:STM32F373xx 数据总线宽度:32 bit 最大时钟频率:72 MHz 程序存储器大小:256 KB 数据 RAM 大小:32 KB 片上 ADC:Yes 工作电源电压:1.65 V to 3.6 V, 2 V to 3.6 V, 2.2 V to 3.6 V 工作温度范围:- 40 C to + 85 C 封装 / 箱体:LQFP-48 安装风格:SMD/SMT
MK20DX256ZVMB10 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:K20 Sub-Family Data Sheet
MK20DX256ZVMC10 制造商:Freescale Semiconductor 功能描述:MCU 32-bit K20 ARM Cortex M4 RISC 256KB Flash 1.8V/2.5V/3.3V 121-Pin MAP-BGA Tray 制造商:Freescale Semiconductor 功能描述:MK20DX256ZVMC10 - Bulk 制造商:Freescale Semiconductor 功能描述:IC ARM CORTEX MCU 256KB 121BGA 制造商:Freescale Semiconductor 功能描述:MCU KINETIS K20 CORTEX M4 制造商:Freescale Semiconductor 功能描述:MCU, KINETIS, K20, CORTEX M4, 121MAP 制造商:Freescale Semiconductor 功能描述:KINETIS 256K USB 制造商:Freescale Semiconductor 功能描述:IC 32BIT MCU KINETIS K20 100MHZ 121-MAPBGA; Controller Family/Series:(ARM Cortex - M4) Kinetis K20; Core Size:32bit; No. of I/O's:86; Supply Voltage Min:1.71V; Supply Voltage Max:3.6V; Digital IC Case Style:MAPBGA; No. of Pins:121 ;RoHS Compliant: Yes
MK20DX256ZVMD10 功能描述:ARM微控制器 - MCU KINETIS CORTEX M4 256KFLEX USB RoHS:否 制造商:STMicroelectronics 核心:ARM Cortex M4F 处理器系列:STM32F373xx 数据总线宽度:32 bit 最大时钟频率:72 MHz 程序存储器大小:256 KB 数据 RAM 大小:32 KB 片上 ADC:Yes 工作电源电压:1.65 V to 3.6 V, 2 V to 3.6 V, 2.2 V to 3.6 V 工作温度范围:- 40 C to + 85 C 封装 / 箱体:LQFP-48 安装风格:SMD/SMT
MK20DX32VFM5 功能描述:ARM微控制器 - MCU Kinetis 32K Flex RoHS:否 制造商:STMicroelectronics 核心:ARM Cortex M4F 处理器系列:STM32F373xx 数据总线宽度:32 bit 最大时钟频率:72 MHz 程序存储器大小:256 KB 数据 RAM 大小:32 KB 片上 ADC:Yes 工作电源电压:1.65 V to 3.6 V, 2 V to 3.6 V, 2.2 V to 3.6 V 工作温度范围:- 40 C to + 85 C 封装 / 箱体:LQFP-48 安装风格:SMD/SMT
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