参数资料
型号: MK2727SLF
厂商: INTEGRATED DEVICE TECHNOLOGY INC
元件分类: 时钟产生/分配
英文描述: 27 MHz, OTHER CLOCK GENERATOR, PDSO8
封装: 0.150 INCH, LEAD FREE, SOIC-8
文件页数: 3/7页
文件大小: 168K
代理商: MK2727SLF
MK2727
LOW COST 27 MHZ VCXO
VCXO
IDT LOW COST 27 MHZ VCXO
3
MK2727
REV E 051310
External Component Selection
The MK2727 requires a minimum number of external
components for proper operation.
Decoupling Capacitor
A decoupling capacitor of 0.01F must be connected
between VDD (pin 2) and GND (pin 4), as close to these
pins as possible. For optimum device performance, the
decoupling capacitor should be mounted on the component
side of the PCB. Avoid the use of vias in the decoupling
circuit.
Series Termination Resistor
When the PCB trace between the clock output (CLK, pin 5)
and the load is over 1 inch, series termination should be
used. To series terminate a 50
trace (a commonly used
trace impedance), place a 33
resistor in series with the
clock line, as close to the clock output pin as possible. The
nominal impedance of the clock output is 20
.
Quartz Crystal
The MK2727 VCXO function consists of the external crystal
and the integrated VCXO oscillator circuit. To assure the
best system performance (frequency pull range) and
reliability, a crystal device with the recommended
parameters (shown below) must be used, and the layout
guidelines discussed in the following section shown must be
followed.
The frequency of oscillation of a quartz crystal is determined
by its “cut” and by the load capacitors connected to it. The
MK2727 incorporates on-chip variable load capacitors that
“pull” (change) the frequency of the crystal. The crystal
specified for use with the MK2727 is designed to have zero
frequency error when the total of on-chip + stray
capacitance is
14 pF.
Recommended Crystal Parameters:
Initial Accuracy at 25
° C±20 ppm
Temperature Stability
±30 ppm
Aging
±20 ppm
Load Capacitance
14 pf
Shunt Capacitance, C0
7 pF Max
C0/C1 Ratio
250 Max
Equivalent Series Resistance
35
Max
The external crystal must be connected as close to the chip
as possible and should be on the same side of the PCB as
the MK2727. There should be no vias between the crystal
pins and the X1 and X2 device pins. There should be no
signal traces underneath or close to the crystal.
Crystal Tuning Load Capacitors
The crystal traces should include pads for small fixed
capacitors, one between X1 and ground, and another
between X2 and ground. The need for these capacitors is
determined at system prototype evaluation, and is
influenced by the particular crystal used (manufacture and
frequency) and by PCB layout. The typical required
capacitor value is 1 to 4 pF.
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