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LOW COST VCXO
MDS 2731-01 E
3
Revision 021804
In te gr ated Circuit Systems ● 525 Ra ce Street, San Jose, CA 9512 6 ● tel (4 08) 297-1 201 ● www.icst.com
MK2731-01
External Component Selection
The MK2731-01 requires a minimum number of
external components for proper operation.
Decoupling Capacitors
Decoupling capacitors of 0.01
F should be connected
between VDD and GND, as close to the MK2731-01 as
possible. For optimum device performance, the
decoupling capacitors should be mounted on the
component side of the PCB. Avoid the use of vias in the
decoupling circuit.
Series Termination Resistor
When the PCB traces between the clock outputs and
the loads are over 1 inch, series termination should be
used. To series terminate a 50
trace (a commonly
used trace impedance) place a 33
resistor in series
with the clock line, as close to the clock output pin as
possible. The nominal impedance of the clock output is
20
.
Quartz Crystal
The MK2731-01 VCXO function consists of the
external crystal and the integrated VCXO oscillator
circuit. To assure the best system performance
(frequency pull range) and reliability, a crystal device
meeting ICS’ recommended parameters must be used,
and the layout guidelines discussed in the following
section must be followed.
See Application Note MAN05 for a full list of crystal
parameters.
The frequency of oscillation of a quartz crystal is
determined by its “cut” and by the load capacitors
connected to it. The MK2731-01 incorporates on-chip
variable load capacitors that “pull” (change) the
frequency of the crystal. The crystal specified for use
with the MK2731-01 is designed to have zero
frequency error when the total of on-chip + stray
capacitance is 14 pF.
The external crystal must be connected as close to the
chip as possible and should be on the same side of the
PCB as the MK2731-01. There should be no via’s
between the crystal pins and the X1 and X2 device
pins. There should be no signal traces underneath or
close to the crystal.
Crystal Tuning Load Capacitors
The crystal traces should include pads for small fixed
capacitors, one between X1 and ground, and another
between X2 and ground. Stuffing of these capacitors
on the PCB is optional. The need for these capacitors is
determined at system prototype evaluation, and is
influenced by the particular crystal used (manufacture
and frequency) and by PCB layout. The typical required
capacitor value is 1 to 4 pF.
The procedure for determining the value of these
capacitors can be found in application note MAN05.