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参数资料
型号： MK30X512VMD100R
厂商： FREESCALE SEMICONDUCTOR INC
元件分类： 微控制器/微处理器
英文描述： RISC MICROCONTROLLER, PBGA144
封装： 13 X 13 MM, MAPBGA-144
文件页数： 23/67页
文件大小： 991K
代理商： MK30X512VMD100R
Table of Contents
1 Ordering parts...........................................................................5
1.1 Determining valid orderable parts......................................5
2 Part identification......................................................................5
2.1 Description.........................................................................5
2.2 Format...............................................................................5
2.3 Fields.................................................................................5
2.4 Example............................................................................6
3 Terminology and guidelines......................................................6
3.1 Definition: Operating requirement......................................6
3.2 Definition: Operating behavior...........................................7
3.3 Definition: Attribute............................................................7
3.4 Definition: Rating...............................................................8
3.5 Result of exceeding a rating..............................................8
3.6 Relationship between ratings and operating
requirements......................................................................8
3.7 Guidelines for ratings and operating requirements............9
3.8 Definition: Typical value.....................................................9
3.9 Typical Value Conditions...................................................10
4 Ratings......................................................................................10
4.1 Thermal handling ratings...................................................10
4.2 Moisture handling ratings..................................................11
4.3 ESD handling ratings.........................................................11
4.4 Voltage and current operating ratings...............................11
5 General.....................................................................................12
5.1 Nonswitching electrical specifications...............................12
5.1.1
Voltage and Current Operating Requirements......12
5.1.2
LVD and POR operating requirements.................13
5.1.3
Voltage and current operating behaviors..............14
5.1.4
Power mode transition operating behaviors..........14
5.1.5
Power consumption operating behaviors..............15
5.1.5.1
Diagram: Typical IDD_RUN operating
behavior...............................................17
5.1.6
EMC radiated emissions operating behaviors.......18
5.1.7
Designing with radiated emissions in mind...........19
5.1.8
Capacitance attributes..........................................19
5.2 Switching electrical specifications.....................................19
5.3 Thermal specifications.......................................................19
5.3.1
Thermal operating requirements...........................20
5.3.2
Thermal attributes.................................................20
6 Peripheral operating requirements and behaviors....................20
6.1 Core modules....................................................................20
6.1.1
Debug trace timing specifications.........................20
6.1.2
JTAG electricals....................................................21
6.2 System modules................................................................24
6.3 Clock modules...................................................................24
6.3.1
MCG Specifications...............................................24
6.3.2
Oscillator Electrical Characteristics.......................26
6.3.2.1
Oscillator DC Electrical Specifications 26
6.3.2.2
Oscillator frequency specifications......27
6.3.3
32kHz Oscillator Electrical Characteristics............28
6.3.3.1
32kHz Oscillator DC Electrical
Specifications......................................28
6.3.3.2
32kHz Oscillator Frequency
Specifications......................................28
6.4 Memories and memory interfaces.....................................29
6.4.1
Flash (FTFL) Electrical Characteristics.................29
6.4.1.1
Flash Timing Parameters — Program
and Erase............................................29
6.4.1.2
Flash Timing Parameters —
Commands..........................................29
6.4.1.3
Flash (FTFL) Current and Power
Parameters..........................................31
6.4.1.4
Reliability Characteristics....................31
6.4.1.5
Write Endurance to FlexRAM for
EEPROM.............................................32
6.4.2
EzPort Switching Specifications............................33
6.4.3
Flexbus Switching Specifications..........................34
6.5 Security and integrity modules..........................................36
6.6 Analog...............................................................................36
6.6.1
ADC electrical specifications.................................36
6.6.1.1
16-bit ADC operating conditions..........37
6.6.1.2
16-bit ADC electrical characteristics....39
6.6.1.3
16-bit ADC with PGA operating
conditions............................................42
6.6.1.4
16-bit ADC with PGA characteristics...43
6.6.2
CMP and 6-bit DAC electrical specifications.........44
6.6.3
12-bit DAC electrical characteristics.....................45
6.6.3.1
12-bit DAC operating requirements.....45
6.6.3.2
12-bit DAC operating behaviors..........46
6.6.4
Voltage Reference Electrical Specifications..........48
K30 Sub-Family Data Sheet Data Sheet, Rev. 1, 11/2010.
Freescale Semiconductor, Inc.
Preliminary
3
Preliminary
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