参数资料
型号: MKP1V240RLG
厂商: ON Semiconductor
文件页数: 1/5页
文件大小: 0K
描述: SIDAC BIDIR 0.9A 240V DO-41
标准包装: 1
电流 - 峰值输出: 900mA
电压 - 击穿: 220 ~ 250V
电流 - 维持(Ih): 100mA
电流 - 击穿: 35µA
封装/外壳: DO-204AL,DO-41,轴向
供应商设备封装: 轴向
包装: 剪切带 (CT)
其它名称: MKP1V240RLGOSCT
MKP1V120 Series
Sidac High Voltage
Bidirectional Triggers
Bidirectional devices designed for direct interface with the ac power
line. Upon reaching the breakover voltage in each direction, the device
switches from a blocking state to a low voltage on ? state. Conduction
will continue like a Triac until the main terminal current drops below
the holding current. The plastic axial lead package provides high pulse
current capability at low cost. Glass passivation insures reliable
operation.
Features
http://onsemi.com
SIDACS ( )
0.9 AMPERES RMS
120 ? 240 VOLTS
?
?
?
?
?
?
?
?
High Pressure Sodium Vapor Lighting
Strobes and Flashers
Ignitors
High Voltage Regulators
Pulse Generators
Used to Trigger Gates of SCR’s and Triacs
Indicates UL Registered ? File #E210057
These are Pb ? Free Devices*
MT1
MT2
MAXIMUM RATINGS (T J = 25 ° C unless otherwise noted)
Rating
Peak Repetitive Off ? State Voltage
(Sine Wave, 50 to 60 Hz, T J = ? 40 to 125 ° C)
MKP1V120, MKP1V130, MKP1V160
MKP1V240
On-State Current RMS (T L = 80 ° C,
Lead Length = 3/8 ″ , All Conduction Angles)
Peak Non ? repetitive Surge Current
(60 Hz One Cycle Sine Wave, T J = 125 ° C)
Operating Junction Temperature Range
Storage Temperature Range
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction ? to ? Lead
Lead Length = 3/8 ″
Symbol
V DRM ,
V RRM
I T(RMS)
I TSM
T J
T stg
Symbol
R q JL
Value
" 90
" 180
" 0.9
" 4.0
? 40 to +125
? 40 to +150
Max
40
Unit
V
A
A
° C
° C
Unit
° C/W
AXIAL LEAD
CASE 59
STYLE 2
MARKING DIAGRAM
A
MKP
1Vxx0
YYWW G
G
Lead Solder Temperature T L 260 ° C
(Lead Length w 1/16 ″ from Case, 10 s Max)
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
*For additional information on our Pb ? Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
A = Assembly Location
MKP1Vxx0 = Device Number
x= 12, 13, 16 or 24
YY = Year
WW = Work Week
G = Pb ? Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information on page 2 of
this data sheet.
? Semiconductor Components Industries, LLC, 2012
August, 2012 ? Rev. 12
1
Publication Order Number:
MKP1V120/D
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