参数资料
| 型号： | MLE-113-01-G-DV-A-P |
| 厂商： | Samtec Inc |
| 文件页数： | 1/1页 |
| 文件大小： | 0K |
| 描述： | CONN SOCK STRIP 26POS SMD |
| 标准包装： | 1 |
| 系列： | MLE |
| 连接器类型： | 插座 |
| 位置数： | 26 |
| 加载位置的数目： | 全部 |
| 间距： | 0.039"（1.00mm） |
| 行数： | 2 |
| 行间距： | 0.039"（1.00mm） |
| 板上方高度： | 0.130"（3.30mm） |
| 安装类型： | 表面贴装 |
| 端子： | 焊接 |
| 触点表面涂层： | 金 |
| 触点涂层厚度： | 10µin（0.25µm） |
| 特点： | 板导轨 |
| 颜色： | 黑 |
| 包装： | 管件 |
| 配套产品： | SAM1131-13-ND - CONN HEADER 26POS DUAL 1MM SMD SAM1130-13-ND - CONN HEADER 26POS DL 1MM R/A SMD |
F-214 (Rev 05FEB14)
MLE –150 –01–G –DV
MLE –120 –01–G –DV
CLM –126 –02 –F –D
CLM –111–02 –L–D
(1,00 mm) .0394"
CLM, MLE SERIES
RUGGED RELIABLE MICRO SOCKETS
SPECIFICATIONS
For complete speci?cations and
CLM
1
NO. PINS
PER ROW
02
PLATING
OPTION
D
OPTIONS
recommended PCB layouts
see www.samtec.com?CLM
or www.samtec.com?MLE
Insulator Material:
Black LCP
Contact Material:
CLM: Phosphor Bronze
MLE: BeCu
Mates with:
FTM, FTMH, MW
02 thru 50
–F
= Gold ?ash on
contact,
Matte Tin on tail
–BE
= Bottom Entry
(Required for bottom entry)
integral Alignment Pin
Plating:
CLM: Au, Sn or SnPb
over 50μ" (1,27 μm) Ni
MLE: Au over 10μ"
(0,25 μm) Ni
Current Rating (CLM/FTM):
2.8 A per pin
(1 pin powered per row)
Current Rating (MLE/FTM):
2.9 A per pin
(1 pin powered per row)
Operating Temp Range:
-55°C to +125°C
Contact Resistance:
MLE: 15 m Ω
Max Cycles:
MLE: 100 with 10μ" (0,25 μm) Au
Voltage Rating:
MLE: 310 VAC
Insertion Depth:
CLM: Top Entry = (1,40 mm)
.055" min., Bottom Entry =
(2,41 mm) .095" min.
(Add board thickness for
correct post OAL)
MLE: (1,63 mm) .064" to
(3,18 mm) .125" with
(1,00)
.03937
(2,12)
.084
100
No. of positions x (1,00) .03937
+ (0,318) .0125
(1,00) (0,28)
.03937 .011
APPLICATION
02
01
(2,54)
.100
(3,81)
.150
PIN/ROW
04-15
16-50
(5,72)
.225
x
(3,57)
.140
–P
(2,26)
.089
A
(3,56)
.140
(7,11)
.280
(2,41)
.095
(1,36)
.054
–L
= 10μ" (0,25 μm)
Gold on contact,
Matte Tin on tail
(8,26) .325
by A
(0,89) .035
DIA
(7,00)
.275
–PA
–K
= (3,50 mm) .138" DIA
Polyimide ?lm Pick & Place Pad
(7 positions minimum)
–P
= Pick & Place Pad
(7 positions minimum)
–PA
= Pick & Place Pad with
(3,00)
.118
–TR
= Tape & Reel Packaging
ALSO AVAILABLE
(MOQ Required)
? Alignment pin
(0,38 mm) .015" wipe,
pass-through, or
? Other Gold plating options
(2,44 mm) .096" minimum
for bottom entry
Insertion Force:
Pass-Thru
Contact Samtec.
CLM: 1.5 oz (0,42 N) average
MLE: 2.70 oz (0,75 N) average
Normal Force:
CLM: 40 grams (0,39 N) average
MLE
1
NO. PINS
PER ROW
01
PLATING
OPTION
DV
OPTIONS
Withdrawal Force:
CLM: .75 oz (0,21 N) average
MLE: 0.50 oz (0,14 N) average
RoHS Compliant: Yes
Lead-Free Solderable: Yes
SMT Lead Coplanarity:
(0,10 mm) .004" max (02-25)
(0,15 mm) .006" max (26-50)
Mates with:
FTM, FTMH, MW
02 thru 50
–G
= 10μ"
(0,25 μm)
Gold
–A
= Alignment Pin
(3 positions minimum)
RECOGNITIONS
For complete scope of
recognitions see
www.samtec.com/quality
(1,00)
100
No. of positions
x (1,00) .03937 + (0,20) .008
02
(3,07)
.121
(0,64)
.025
DIA
–A
(0,71)
.028
Metal or plastic at Samtec
discretion.
–K
= (4,00 mm) .1575" DIA
Polyimide ?lm Pick & Place Pad
(5 positions minimum)
Note: Some lengths, styles
and options are non-standard,
.03937
(3,12)
.123
(1,00)
.03937
(0,30)
.012
01
(3,30)
.130
(4,32)
.170
(6,35)
.250
x
(3,18)
.125
–P
(3,50)
.138
–P
= Metal Pick & Place Pad
(5 positions minimum)
–TR
= Tape & Reel Packaging
non-returnable.
WWW.SAMTEC.COM
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MLE-113-01-G-DV-A-P-TR | 制造商:Samtec Inc 功能描述:CONN SCKT STRP SKT 26 POS 1MM SLDR ST SMD - Tape and Reel |
| MLE-113-01-G-DV-K | 制造商:Samtec Inc 功能描述:CONN SCKT STRP SKT 26 POS 1MM SLDR ST SMD - Bulk |
| MLE-113-01-G-DV-K-TR | 制造商:Samtec Inc 功能描述:CONN SCKT STRP SKT 26 POS 1MM SLDR ST SMD - Tape and Reel |
| MLE-113-01-G-DV-P | 制造商:Samtec Inc 功能描述:CONN SCKT STRP SKT 26 POS 1MM SLDR ST SMD - Bulk |
| MLE-113-01-G-DV-TR | 制造商:Samtec Inc 功能描述:1MM MICRO STRIPS - Tape and Reel |
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