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参数资料
| 型号： | MLF1608E8R2M |
| 厂商： | TDK Corporation |
| 文件页数： | 2/10页 |
| 文件大小： | 0K |
| 描述： | INDUCTOR MULTILAYER 8.2UH 0603 |
| RoHS指令信息： | RoHS Material |
| 产品目录绘图： | MLF1608, MLZ1608 Top |
| 标准包装： | 1 |
| 系列： | MLF |
| 电感： | 8.2µH |
| 电流： | 10mA |
| 类型： | 铁氧体芯体 |
| 容差： | ±20% |
| 屏蔽： | 屏蔽 |
| DC 电阻(DCR)： | 最大 1.5 欧姆 |
| Q因子@频率： | 35 @ 4MHz |
| 频率 - 自谐振： | 55MHz |
| 材料 - 芯体： | 铁氧体 |
| 封装/外壳： | 0603（1608 公制） |
| 安装类型： | 表面贴装 |
| 包装： | 标准包装 |
| 工作温度： | -40°C ~ 85°C |
| 频率 - 测试： | 4MHz |
| 其它名称： | 445-6249-6 |
(1/9)
Inductors for Standard Circuits
Multilayer/STD ? Magnetic Shielded
MLF Series MLF1005L
Conformity to RoHS Directive
Various digital devices are required to be further downsized yet
remain highly functional, and to excel in low power consumption,
PRODUCT IDENTIFICATION
MLF 1005 L R10 K T
and parts mounted on the devices are also required to have lower
resistance.
The MLF1005L type is a new line of inductors that have been
developed to meet such requirements: their resistance has been
lowered by up to 35% in comparison with that of the existing
MLF1005 type.
In addition, the new inductors use similar magnetic shielding,
which enables their high-density mounting.
FEATURES
? The resistance of the MLF1005L type has been lowered by up to
35% in comparison with that of the existing MLF1005 type.
? Magnetically shielded configuration allowing for high-density
mounting.
? Does not contain lead and is compatible with lead-free
soldering.
(1) (2) (3) (4) (5) (6)
(1) Series name
(2) Dimensions L × W
1005
(3) Type name
L
(4) Inductance
R10
1R0
(5) Tolerance
K
(7)
1.0 × 0.5 × 0.5
Low-resistance type
0.1 μ H
1.0 μ H
±10%
? It is a product conforming to RoHS directive.
(6) Packaging style
APPLICATIONS
T
Taping [reel]
Signal processing modules such as cellular phones and tuners
(7) TDK internal code
SPECIFICATIONS
Operating temperature range
–40 to +85°C
PACKAGING STYLE AND QUANTITIES
Storage temperature range
–40 to +85°C(After mount)
Packaging style
Taping
Quantity
10000 pieces/reel
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
10s max.
HANDLING AND PRECAUTIONS
? Before soldering, be sure to preheat components.
The preheating temperature should be set so that the tempera-
ture difference between the solder temperature and product
250 to 260?C
230?C
180?C
150?C
Preheating
60 to 120s
Time(s)
Soldering
30 to 60s
Natural
cooling
temperature does not exceed 150°C.
? After mounting components onto the printed circuit board, do not
apply stress through board bending or mishandling.
? The inductance value may change due to magnetic saturation if
the current exceeds the rated maximum.
? Do not expose the inductors to stray magnetic fields.
? Avoid static electricity discharge during handling.
? When hand soldering, apply the soldering iron to the printed cir-
cuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
? Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
? Please contact our Sales office when your application is considered the following:
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
? All specifications are subject to change without notice.
001-05 / 20111129 / e511_mlf_02
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参数描述 |
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| MLF1608E8R2MTD25 | 功能描述:8.2μH Shielded Multilayer Inductor 10mA 1.5 Ohm Max 0603 (1608 Metric) 制造商:tdk corporation 系列:MLF 包装:剪切带（CT） 零件状态:有效 类型:多层 材料 - 磁芯:铁氧体 电感:8.2μH 容差:±20% 额定电流:10mA 电流 - 饱和值:- 屏蔽:屏蔽 DC 电阻（DCR）:1.5 欧姆最大 不同频率时的 Q 值:- 频率 - 自谐振:35MHz 等级:AEC-Q200 工作温度:-55°C ~ 125°C 频率 - 测试:4MHz 安装类型:表面贴装 封装/外壳:0603（1608 公制） 大小/尺寸:0.063" 长 x 0.031" 宽（1.60mm x 0.80mm） 高度 - 安装（最大值）:0.037"（0.95mm） 标准包装:1 |
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| MLF2012A1R0J | 功能描述:固定电感器 2012 1uH 5% RoHS:否 制造商:AVX 电感:10 uH 容差:20 % 最大直流电流:1 A 最大直流电阻:0.075 Ohms 工作温度范围:- 40 C to + 85 C 自谐振频率:38 MHz Q 最小值:40 尺寸:4.45 mm W x 6.6 mm L x 2.92 mm H 屏蔽:Shielded 端接类型:SMD/SMT 封装 / 箱体:6.6 mm x 4.45 mm |
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