- 您现在的位置：买卖IC网 > PDF目录16852 > MLF2012K560M (TDK Corporation)INDUCTOR MULTILAYER 56UH 0805 PDF资料下载
参数资料
| 型号： | MLF2012K560M |
| 厂商： | TDK Corporation |
| 文件页数： | 8/10页 |
| 文件大小： | 0K |
| 描述： | INDUCTOR MULTILAYER 56UH 0805 |
| RoHS指令信息： | RoHS Material |
| 标准包装： | 4,000 |
| 系列： | MLF |
| 电感： | 56µH |
| 电流： | 4mA |
| 类型： | 铁氧体芯体 |
| 容差： | ±20% |
| 屏蔽： | 屏蔽 |
| DC 电阻(DCR)： | 最大 2.8 欧姆 |
| Q因子@频率： | 35 @ 2MHz |
| 频率 - 自谐振： | 18MHz |
| 材料 - 芯体： | 铁氧体 |
| 封装/外壳： | 0805（2012 公制） |
| 安装类型： | 表面贴装 |
| 包装： | 带卷 (TR) |
| 工作温度： | -40°C ~ 85°C |
| 频率 - 测试： | 2MHz |
(7/9)
Inductors for Standard Circuits
Multilayer/STD ? Magnetic Shielded
MLF Series MLF2012
Conformity to RoHS Directive
FEATURES
? High-reliability monolithic structure.
PRODUCT IDENTIFICATION
MLF 2012 A 1R0 K T
? Ferrite core and magnetic shielding enables the design of com-
pact circuits with high density mounting.
? Excellent solderability and high heat resistance permits either
flow or reflow soldering.
? The products contain no lead and also support lead-free
soldering.
(1) (2) (3) (4) (5) (6)
(1) Series name
(2) Dimensions L × W
2012
(7)
2.0 × 1.25mm
? It is a product conforming to RoHS directive.
(3) Type name
APPLICATIONS
Digital cellular phone, car audio, TV, personal computers, or vari-
(4) Inductance
ous electronic appliances
47N
R15
47nH[0.047 μ H]
0.15 μ H
SPECIFICATIONS
Operating temperature range
Storage temperature range
–40 to +85°C
–40 to +85°C(After mount)
1R0
100
1 μ H
10 μ H
(5) Tolerance
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
10s max.
250 to 260?C
K
M
(6) Packaging style
T
±10%
±20%
Taping [reel]
230?C
Natural
cooling
(7) TDK internal code
180?C
PACKAGING STYLE AND QUANTITIES
Packaging style Product’s thickness
Quantity
150?C
Preheating
Soldering
Taping
0.85mm
1.25mm
4000 pieces/reel
2000 pieces/reel
60 to 120s
Time(s)
30 to 60s
HANDLING AND PRECAUTIONS
? Before soldering, be sure to preheat components.
The preheating temperature should be set so that the tempera-
ture difference between the solder temperature and product
temperature does not exceed 150°C.
? After mounting components onto the printed circuit board, do not
apply stress through board bending or mishandling.
? The inductance value may change due to magnetic saturation if
the current exceeds the rated maximum.
? Do not expose the inductors to stray magnetic fields.
? Avoid static electricity discharge during handling.
? When hand soldering, apply the soldering iron to the printed cir-
cuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
? Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
? Please contact our Sales office when your application is considered the following:
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
? All specifications are subject to change without notice.
001-05 / 20111129 / e511_mlf_02
相关PDF资料 |
PDF描述 |
|---|---|
| EGM10DTBN-S189 | CONN EDGECARD 20POS R/A .156 SLD |
| V110C36C100BF | CONVERTER MOD DC/DC 36V 100W |
| VERSAFIT-MINI-SPL-3/4-BK | HEATSHRINK LOW TEMP 3/4" 25' BLK |
| ESM10DTBH-S189 | CONN EDGECARD 20POS R/A .156 SLD |
| VERSAFIT-MINI-SPL-3/32-BK | HEATSHRNK LOW TEMP 3/32" 65' BLK |
相关代理商/技术参数 |
参数描述 |
|---|---|
| MLF2012K560XT | 制造商:TDK 制造商全称:TDK Electronics 功能描述:SMD |
| MLF2012-KIT | 制造商:TDK 功能描述: |
| M-L-F21C153J | 制造商:BISHOP 功能描述: |
| MLF2B62P-J1K | 制造商:FCI 功能描述:MLF2B62P-J1K-LAST BUY 31TH DEC 2003 - Bulk |
| MLF2B62R-J7 | 制造商:FCI 功能描述:MLF2B62R-J7-LAST BUY 31TH DEC 2003 - Bulk |
发布紧急采购，3分钟左右您将得到回复。