参数资料
型号: MLG0603P5N1S
厂商: TDK Corporation
文件页数: 2/6页
文件大小: 0K
描述: INDUCTOR MULTILAYER 5.1NH 0201
标准包装: 1
系列: MLG
电感: 5.1nH
电流: 350mA
类型: 陶瓷
容差: ±0.3nH
屏蔽: 无屏蔽
DC 电阻(DCR): 最大 400 毫欧
Q因子@频率: 14 @ 500MHz
频率 - 自谐振: 6.6GHz
封装/外壳: 0201(0603 公制)
安装类型: 表面贴装
包装: 标准包装
工作温度: -55°C ~ 125°C
频率 - 测试: 500MHz
其它名称: 445-7819-6
(1/5)
Inductors for High-frequency Circuits
Multilayer/High-Q
MLG Series MLG0603P
Conformity to RoHS Directive
FEATURES
PRODUCT IDENTIFICATION
? It serializes a product of inductance 0.6 to120nH.
MLG 0603 P
2N2
S T
? By the most suitable design, Q is higher than competing in a
(1) (2) (3)
(4)
(5) (6)
(7)
conventional product MLG0603S type. In particular, Q in more
than 800MHz largely improved.
? Advanced monolithic structure is formed using a multilayering
(1) Series name
and sintering process with ceramic and conductive materials for
high-frequency.
? The products contain no lead and also support lead-free
soldering.
? It is a product conforming to RoHS directive.
APPLICATIONS
For high-frequency applications including mobile phones, high
frequency modules (PA, VCO, FEM etc.), Bluetooth, W-LAN, UWB
and tuners.
SHAPES AND DIMENSIONS
0.6±0.03
0.09±0.04
(2) Dimensions L ? W
0603
(3 Type name
(4) Inductance
2N2
12N
(5) Tolerance
B
C
S
H
J
(6) Packaging style
T
0.6 ? 0.3mm (L ? W)
2.2nH
12nH
±0.1nH
±0.2nH
±0.3nH
±3%
±5%
Taping (reel)
(7) TDK internal code
Weight: 0.2mg
0.15±0.05
Dimensions in mm
SPECIFICATIONS
Operating temperature range
–55 to +125°C
RECOMMENDED PC BOARD PATTERN
Storage temperature range
–55 to +125°C(After mount)
0.25
0.3
0.25
PACKAGING STYLE AND QUANTITIES
Packaging style
Quantity
Taping
15000 pieces/reel
Dimensions in mm
HANDLING AND PRECAUTIONS
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
? Before soldering, be sure to preheat components.
The preheating temperature should be set so that the
temperature difference between the solder temperature and
250 to 260?C
230?C
10s max.
Natural
cooling
product temperature does not exceed 150°C.
? After mounting components onto the printed circuit board, do not
apply stress through board bending or mishandling.
? When hand soldering, apply the soldering iron to the printed
circuit board only. Temperature of the iron tip should not exceed
180?C
150?C
Preheating
60 to 120s
Soldering
30 to 60s
350°C. Soldering time should not exceed 3 seconds.
Time(s)
? Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
? Please contact our Sales office when your application is considered the following:
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
? All specifications are subject to change without notice.
001-08 / 20120822 / e521_mlg_03
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