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参数资料
| 型号： | MLP113M050EB0D |
| 厂商： | Cornell Dubilier Electronics (CDE) |
| 文件页数： | 2/6页 |
| 文件大小： | 0K |
| 描述： | CAP ALUM 11000UF 50V 20% RADIAL |
| 标准包装： | 1 |
| 系列： | MLP |
| 电容： | 11000µF |
| 额定电压： | 50V |
| 容差： | ±20% |
| 寿命@温度： | 85°C 时为 2000 小时 |
| 工作温度： | -55°C ~ 85°C |
| 特点： | 通用 |
| 纹波电流： | 8.3A |
| ESR（等效串联电阻）： | 36 毫欧 |
| 安装类型： | 通孔 |
| 封装/外壳： | 扁平封装 |
| 尺寸/尺寸： | 3.000" L x 1.750" W（76.20mm x 44.45mm） |
| 高度 - 座高（最大）： | 0.500"（12.70mm） |
| 引线间隔： | 1.000"（25.40mm） |
| 包装： | 散装 |
Type MLP 85 °C Flatpack, Ultra Long Life, Aluminum Electrolytic
Very Low Profile
Thermal Resistance
Large Sides
Heatsinked
one
both
Case Length
Insulation
None
Polyester
None
Polyester
1.5"
oC/W
3.0
4.3
2.8
4.0
2.0"
oC/W
1.8
2.6
1.7
2.4
3.0"
oC/W
1.2
1.7
1.1
1.6
ESL
Weight
Terminals
Double the Ripple Current
Ripple Current Capability
Air Cooled
Heatsink Cooled
Example
Part Numbering System
<30 nH measured 1/4” from case at 1 MHz
Case EK 30 g typical
Case EA 42 g typical
Case EB 66 g typical
18 AWG copper wire with 60/40 tin-lead electroplate, 20 amps max
Attach the MLP to an external heatsink and you can easily double the ripple
current capability and assure long life through cooler operation. The broad,
flat top and bottom on the MLP are ideal for cooling the capacitor and
removing the heat caused by ripple current.
The ripple current capability is set by the maximum permissible internal
core temperature, 88 oC. This assures that the case does not inflate beyond
0.5 inch height.
The ripple currents in the ratings tables are for 85 oC case temperatures.
For air temperatures without a heatsink use the multipliers Ambient
Temperature, No Heatsink.
Temperature rise from the internal hottest spot, the core, to ambient air is
?T = I 2 (ESR)(θcc + θca)
where θcc is the thermal resistance from core to case and θca from case to
ambient. To calculate maximum ripple capability with the MLP attached to
a heatsink use the maximum core temperature and the values for θcc.
As an illustration, suppose you operate an insulated MLP332M080EB1C
in 65 oC air and attach it to a commercial heatsink with a free-air thermal
resistance of 2.7 oC/W. Use a good thermal grease between the MLP and
the heatsink, and the total thermal resistance is 2.7 +1.7 or 4.4 oC/W. The
power which would heat the core to 88 °C is (88-65)/4.4 or 4.75 W. For an
ESR of 31 mΩ, 4.7 W equates to a ripple current of 12.3 A.
MLP
102
M
200
EB
0
A
Type
Capacitance
Tolerance Rated Voltage
Case Code
Insulation
Mounting Style
MLP
821 =820 μF
102 = 1000 μF
M= ±20%
Vdc
EK, L=1.5 in.
EA , L=2.0 in
EB , L=3.0 in.
0 = bare can
1 = polyester
A = mounting tabs
B = four leads
C = two leads/no tabs
D = hook leads/tabs
E = hook leads/no tabs
CDM Cornell Dubilier ? 140 Technology Place ? Liberty, SC 29657 ? Phone: (864)843-2277 ? Fax: (864)843-3800
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MLP113M050EB1A | 功能描述:铝质电解电容器 - 带引线 11000uF 50V 20% FLATPACK RoHS:否 制造商:Kemet 引线类型: 电容:220 uF 容差:20 % 电压额定值:25 V 工作温度范围: 端接类型:Radial 外壳直径:8 mm 外壳长度:11 mm 引线间隔:5 mm 产品:General Purpose Electrolytic Capacitors 封装:Bulk |
| MLP113M050EB1A | 制造商:Cornell Dubilier Electronics 功能描述:CAPACITOR ALUM ELEC 11000UF 50V 20% R 制造商:Cornell Dubilier Electronics 功能描述:CAPACITOR ALUM ELEC 11000UF, 50V, 20%, R |
| MLP113M050EB1C | 功能描述:铝质电解电容器 - 带引线 11000uF 50V 20% FLATPACK RoHS:否 制造商:Kemet 引线类型: 电容:220 uF 容差:20 % 电压额定值:25 V 工作温度范围: 端接类型:Radial 外壳直径:8 mm 外壳长度:11 mm 引线间隔:5 mm 产品:General Purpose Electrolytic Capacitors 封装:Bulk |
| MLP113M050EB1D | 功能描述:铝质电解电容器 - 带引线 11000uF 50V 20% FLATPACK RoHS:否 制造商:Kemet 引线类型: 电容:220 uF 容差:20 % 电压额定值:25 V 工作温度范围: 端接类型:Radial 外壳直径:8 mm 外壳长度:11 mm 引线间隔:5 mm 产品:General Purpose Electrolytic Capacitors 封装:Bulk |
| MLP113M050EB1E | 功能描述:铝质电解电容器 - 带引线 11KUF 50V RoHS:否 制造商:Kemet 引线类型: 电容:220 uF 容差:20 % 电压额定值:25 V 工作温度范围: 端接类型:Radial 外壳直径:8 mm 外壳长度:11 mm 引线间隔:5 mm 产品:General Purpose Electrolytic Capacitors 封装:Bulk |
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