参数资料
型号: MLZ2012M1R0H
厂商: TDK Corporation
文件页数: 2/4页
文件大小: 0K
描述: INDUCTOR MULTILAYER 1UH 0805
标准包装: 1
系列: MLZ
电感: 1µH
电流: 800mA
电流 - 饱和: 700mA
电流 - 温升: 800mA
类型: 铁氧体芯体
容差: ±20%
屏蔽: 屏蔽
DC 电阻(DCR): 100 毫欧
频率 - 自谐振: 150MHz
材料 - 芯体: 铁氧体
封装/外壳: 0805(2012 公制)
安装类型: 表面贴装
包装: 标准包装
工作温度: -55°C ~ 125°C
频率 - 测试: 2MHz
其它名称: 445-8657-6
(1/3)
Inductors for Decoupling Circuits
Multilayer/For Current ? Magnetic Shielded
MLZ Series MLZ2012H
Conformity to RoHS Directive
The MLZ-H Series includes multilayer choke coils for decoupling
PRODUCT IDENTIFICATION
power circuits.
MLZ
2012
M 100 H T
TDK developed ferrite material, which has improved DC superim-
(1)
(2)
(3) (4) (5) (6)
(7)
position characteristics, allowing for the rated current to be equiva-
lent to the wound coil. The DC superimposition characteristics of
this series have been improved by up to 250% over the MLZ-W
(1) Series name
Series, which previously was in the top class in the industry.
In addition, low ohmic electrodes are used making it possible to be
compatible with large currents equivalent to the wound coil.
FEATURES
? Improved by up to 250% for large currents over the MLZ-W
Series, which was previously in the top class in the industry.
? Magnetically sealed configuration allowing for high-density
mounting.
? Does not contain lead and is compatible with lead-free
soldering.
? It is a product conforming to RoHS directive.
APPLICATIONS
Decoupling coil for power lines of DSCs, DVCs, PCs, TVs, etc.
SPECIFICATIONS
(2) Dimensions L × W
2012
(3) Management symbol
(4) Inductance
1R0
100
(5) Characteristic type
H
(6) Packaging style
T
(7) TDK internal code
2.0 × 1.25 × 1.25mm
1.0 μ H
10.0 μ H
Super High-current
Taping [reel]
Operating temperature range
–55 to +125°C
[Including self-temperature rise]
PACKAGING STYLE AND QUANTITIES
Storage temperature range
–55 to +125°C(After mount)
Packaging style
Taping
Quantity
2000 pieces/reel
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
250 to 260?C
10s max.
Natural
HANDLING AND PRECAUTIONS
? Before soldering, be sure to preheat components.
The preheating temperature should be set so that the tempera-
ture difference between the solder temperature and product
temperature does not exceed 150°C.
230?C
180?C
150?C
Preheating
60 to 120s
Time(s)
Soldering
30 to 60s
cooling
? After mounting components onto the printed circuit board, do not
apply stress through board bending or mishandling.
? The inductance value may change due to magnetic saturation if
the current exceeds the rated maximum.
? Do not expose the inductors to stray magnetic fields.
? Avoid static electricity discharge during handling.
? When hand soldering, apply the soldering iron to the printed cir-
cuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
? Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
? Please contact our Sales office when your application is considered the following:
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
? All specifications are subject to change without notice.
002-05 / 20111129 / e533_mlz_h
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