参数资料
型号: MM74HC125SJ
厂商: Fairchild Semiconductor
文件页数: 4/10页
文件大小: 0K
描述: IC BUFF TRI-ST QD N-INV 14SOP
标准包装: 47
系列: 74HC
逻辑类型: 缓冲器/线路驱动器,非反相
元件数: 4
每个元件的位元数: 1
输出电流高,低: 7.8mA,7.8mA
电源电压: 2 V ~ 6 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 14-SOIC(0.209",5.30mm 宽)
供应商设备封装: 14-SOIC
包装: 管件
1983 Fairchild Semiconductor Corporation
www.fairchildsemi.com
MM74HC125, MM74HC126 Rev. 1.3.0
3
MM74HC125,
MM74HC126
3-ST
A
TE
Quad
Buff
er
s
Absolute Maximum Ratings(1)
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only.
Notes:
1. Unless otherwise specified all voltages are referenced to ground.
2. Power Dissipation temperature derating — plastic “N” package: –12mW/°C from 65°C to 85°C.
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to absolute maximum ratings.
Symbol
Parameter
Rating
VCC
Supply Voltage
–0.5 to +7.0V
VIN
DC Input Voltage
–1.5 to VCC+1.5V
VOUT
DC Output Voltage
–0.5 to VCC+0.5V
IIK, IOK
Clamp Diode Current
±20mA
IOUT
DC Output Current, per pin
35mA
ICC
DC VCC or GND Current, per pin
±70mA
TSTG
Storage Temperature Range
–65°C to +150°C
PD
Power Dissipation
Note 2
600mW
S.O. Package only
500mW
TL
Lead Temperature (Soldering 10 seconds)
260°C
Symbol
Parameter
Min.
Max.
Units
VCC
Supply Voltage
2
6
V
VIN, VOUT
DC Input or Output Voltage
0
VCC
V
TA
Operating Temperature Range
–40
+85
°C
t r, tf
Input Rise or Fall Times
VCC = 2.0V
1000
ns
VCC = 4.5V
500
ns
VCC = 6.0V
400
ns
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相关代理商/技术参数
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