参数资料
型号: MM74HC126SJX
厂商: Fairchild Semiconductor
文件页数: 1/10页
文件大小: 0K
描述: IC BUFF TRI-ST QD N-INV 14SOP
标准包装: 2,000
系列: 74HC
逻辑类型: 缓冲器/线路驱动器,非反相
元件数: 4
每个元件的位元数: 1
输出电流高,低: 7.8mA,7.8mA
电源电压: 2 V ~ 6 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 14-SOIC(0.209",5.30mm 宽)
供应商设备封装: 14-SOIC
包装: 带卷 (TR)
MM74HC125,
MM74HC126
3-ST
A
TE
Quad
Buff
er
s
1983 Fairchild Semiconductor Corporation
www.fairchildsemi.com
MM74HC125, MM74HC126 Rev. 1.3.0
February 2008
MM74HC125, MM74HC126
3-STATE Quad Buffers
Features
Typical propagation delay: 13ns
Wide operating voltage range: 2V–6V
Low input current: 1A maximum
Low quiescent current: 80A maximum (74HC)
Fanout of 15 LS-TTL loads
General Description
The MM74HC125 and MM74HC126 are general pur-
pose 3-STATE high speed non-inverting buffers utilizing
advanced silicon-gate CMOS technology. They have
high drive current outputs which enable high speed oper-
ation even when driving large bus capacitances. These
circuits possess the low power dissipation of CMOS
circuitry, yet have speeds comparable to low power
Schottky TTL circuits. Both circuits are capable of driving
up to 15 low power Schottky inputs.
The MM74HC125 require the 3-STATE control input C to
be taken high to put the output into the high impedance
condition, whereas the MM74HC126 require the control
input to be low to put the output into high impedance.
All inputs are protected from damage due to static
discharge by diodes to VCC and ground.
Ordering Information
Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering number.
All packages are lead free per JEDEC: J-STD-020B standard.
Order Number
Package
Number
Package Description
MM74HC125M
M14A
14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150"
Narrow
MM74HC125SJ
M14D
14-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
MM74HC125MTC
MTC14
14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153,
4.4mm Wide
MM74HC125N
N14A
14-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide
MM74HC126M
M14A
14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150"
Narrow
MM74HC126SJ
M14D
14-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
MM74HC126MTC
MTC14
14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153,
4.4mm Wide
MM74HC126N
N14A
14-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide
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