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参数资料
| 型号： | MM74HC595N |
| 厂商： | Fairchild Semiconductor |
| 文件页数： | 7/9页 |
| 文件大小： | 0K |
| 描述： | IC REGISTER W/LATCH 8BIT 16-DIP |
| 标准包装： | 25 |
| 系列： | 74HC |
| 逻辑类型： | 移位寄存器 |
| 输出类型： | 三态 |
| 元件数： | 1 |
| 每个元件的位元数： | 8 |
| 功能： | 串行至并行 |
| 电源电压： | 2 V ~ 6 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 通孔 |
| 封装/外壳： | 16-DIP（0.300"，7.62mm） |
| 供应商设备封装： | 16-DIP |
| 包装： | 管件 |
2011 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FMS6404 Rev. 1.0.0
7
FMS6404
—
Precision
Compo
s
ite
Video
Output
with
Sound
T
rap
and
Group
Delay
Compensation
Applications Information
Layout Considerations
General layout and supply bypassing play a major role
in
high-frequency
performance
and
thermal
characteristics. Fairchild offers a four-layer board with
full power and ground planes board to guide layout and
aid device evaluation. Following this layout configuration
provides
optimum
performance
and
thermal
characteristics for the device. For best results, follow the
steps and recommended routing rules below.
Recommended Routing / Layout Rules
Do not run analog and digital signals in parallel.
Use separate analog and digital power planes to
supply power.
Traces must run on top of the ground plane.
No trace should run over ground/power splits.
Avoid routing at 90-degree angles.
Minimize clock and video data trace length
differences.
Include 10μF and 0.1μF ceramic power supply
bypass capacitors.
Place the 0.1μF capacitor within 2.54mm (0.1in)
of the device power pin.
Place the 10μF capacitor within 19.05mm (0.75in)
of the device power pin.
For multi-layer boards, use a large ground plane to
help dissipate heat.
For two-layer boards, use a ground plane that
extends beyond the device body at least 12.7mm
(0.5in) on all sides. Include a metal paddle under
the device on the top layer.
Minimize all trace lengths to reduce series
inductance.
Output Considerations
The outputs are DC offset from the input by 150mV;
therefore, VOUT = 2 VIN DC + 150mV. This offset is
required for optimal performance from the output driver
and is held at the minimum value to decrease the
standing DC current into the load. Since the FMS6404
has a 2 x (6dB) gain, the output is typically connected
via a 75-series back-matching resistor, followed by the
75 video cable. Due to the inherent divide-by-two of
this configuration, the blanking level at the load of the
video signal is always less than 1V. When AC-coupling
the output, ensure that the coupling capacitor passes
the lowest frequency content in the video signal and that
line time distortion (video tilt) is kept as low as possible.
The selection of the coupling capacitor is a function of
the subsequent circuit input impedance and the leakage
current of the input being driven. To obtain the highest
quality output video signal, the series termination
resistor must be placed as close to the device output pin
as
possible.
This
greatly
reduces
the
parasitic
capacitance and inductance effect on the output driver.
The distance from the device pin to the series termination
resistor should be no greater than 2.54mm (0.1in).
Figure 14. Termination Resistor Placement
Thermal Considerations
Since the interior of most systems, such as set-top
boxes,
TVs,
and
DVD
players;
is
at
+70C;
consideration must be given to providing an adequate
heat sink for the device package for maximum heat
dissipation. When designing a system board, determine
how much power each device dissipates. Ensure that
devices of high power are not placed in the same
location, such as directly above (top plane) or below
(bottom plane) each other on the PCB.
PCB Thermal Layout Considerations
Understand the system power requirements and
environmental conditions.
Maximize thermal performance of the PCB.
Consider using 70μm of copper for high-power
designs.
Make the PCB as thin as possible by reducing
FR4 thickness.
Use vias in power pad to tie adjacent layers
together.
Remember that baseline temperature is a function
of board area, not copper thickness.
Modeling techniques provide a first-order
approximation.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MM74HC595N | 制造商:Fairchild Semiconductor Corporation 功能描述:IC REGISTERS LOGIC ROHS COMPLIANT:NO |
| MM74HC595N | 制造商:Fairchild Semiconductor Corporation 功能描述:IC 74HC CMOS 74HC595 DIP16 6V |
| MM74HC595N_Q | 功能描述:计数器移位寄存器 8-Bit Shift Register RoHS:否 制造商:Texas Instruments 计数器类型: 计数顺序:Serial to Serial/Parallel 电路数量:1 封装 / 箱体:SOIC-20 Wide 逻辑系列: 逻辑类型: 输入线路数量:1 输出类型:Open Drain 传播延迟时间:650 ns 最大工作温度:+ 125 C 最小工作温度:- 40 C 封装:Reel |
| MM74HC595SJ | 功能描述:计数器移位寄存器 8-Bit Shift Register RoHS:否 制造商:Texas Instruments 计数器类型: 计数顺序:Serial to Serial/Parallel 电路数量:1 封装 / 箱体:SOIC-20 Wide 逻辑系列: 逻辑类型: 输入线路数量:1 输出类型:Open Drain 传播延迟时间:650 ns 最大工作温度:+ 125 C 最小工作温度:- 40 C 封装:Reel |
| MM74HC595SJX | 功能描述:计数器移位寄存器 8-Bit Shift Register RoHS:否 制造商:Texas Instruments 计数器类型: 计数顺序:Serial to Serial/Parallel 电路数量:1 封装 / 箱体:SOIC-20 Wide 逻辑系列: 逻辑类型: 输入线路数量:1 输出类型:Open Drain 传播延迟时间:650 ns 最大工作温度:+ 125 C 最小工作温度:- 40 C 封装:Reel |
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