参数资料
型号: MM74HC74AMTC
厂商: Fairchild Semiconductor
文件页数: 11/11页
文件大小: 0K
描述: IC FLIP FLOP DUAL D 14-TSSOP
标准包装: 94
系列: 74HC
功能: 设置(预设)和复位
类型: D 型
输出类型: 差分
元件数: 2
每个元件的位元数: 1
频率 - 时钟: 72MHz
延迟时间 - 传输: 12ns
触发器类型: 正边沿
输出电流高,低: 5.2mA,5.2mA
电源电压: 2 V ~ 6 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 14-TSSOP(0.173",4.40mm 宽)
包装: 管件
1983 Fairchild Semiconductor Corporation
www.fairchildsemi.com
MM74HC74A Rev. 1.3.0
9
MM74HC74A
Dual
D-T
ype
Flip-Flop
with
Preset
and
Clear
Physical Dimensions (Continued)
Figure 3. 14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specications do not expand the terms of Fairchild’s worldwide terms and conditions,
specically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
C. DIMENSIONS ARE EXCLUSIVE OF BURRS, MOLD FLASH,
AND TIE BAR EXTRUSIONS
F. DRAWING FILE NAME: MTC14REV6
R0.09 min
12.00°
TOP & BOTTOM
0.43 TYP
1.00
D. DIMENSIONING AND TOLERANCES PER ANSI
Y14.5M, 1982
R0.09min
E. LANDPATTERN STANDARD: SOP65P640X110-14M
0.65
6.10
1.65
0.45
A. CONFORMS TO JEDEC REGISTRATION MO-153,
VARIATION AB, REF NOTE 6
B. DIMENSIONS ARE IN MILLIMETERS
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