参数资料
型号: MM908E624ACEW
厂商: Freescale Semiconductor
文件页数: 36/39页
文件大小: 0K
描述: IC SWITCH TRIPLE MCU/LIN 54-SOIC
标准包装: 26
应用: 自动镜像控制
核心处理器: HC08
程序存储器类型: 闪存(16 kB)
控制器系列: 908E
RAM 容量: 512 x 8
接口: SCI,SPI
输入/输出数: 16
电源电压: 5.5 V ~ 18 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 54-BSSOP(0.295",7.50mm 宽)
包装: 管件
供应商设备封装: 54-SOIC
配用: KIT908E624DWBEVB-ND - KIT EVAL 908E624 TRPL W/MCU/LIN
Analog Integrated Circuit Device Data
6
Freescale Semiconductor
908E624
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
THERMAL RATINGS
Package Operating Ambient Temperature (4)
MM908E624ACPEW
MM908E624AYPEW
TA
-40 to 85
-40 to 125
°C
Operating Junction Temperature (2)(4)
MM908E624ACPEW
MM908E624AYPEW
TJ
-40 to 125
°C
Storage Temperature
TSTG
-40 to 150
°C
Peak Package Reflow Temperature During Reflow(3)(5)
TPPRT
°C
Notes
2.
The temperature of analog and MCU die is strongly linked via the package, but can differ in dynamic load conditions, usually because
of higher power dissipation of the analog die. The analog die junction temperature must not exceed 150°C under these conditions.
3.
Pin soldering temperature is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
4.
Independent of TA, device parametrics are only guaranteed for -40 < TJ < 125 °C. Please see note 2. TJ is a factor of power dissipation,
package thermal resistance, and available heat sinking.
5.
Table 2. Maximum Ratings (continued)
All voltages are with respect to ground unless otherwise noted. Exceeding limits on any pin may cause permanent damage to
the device.
Rating
Symbol
Value
Unit
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相关代理商/技术参数
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