参数资料
型号: MMBF2201NT1G
厂商: ON Semiconductor
文件页数: 1/4页
文件大小: 0K
描述: MOSFET N-CH 20V 300MA SOT-323
产品变化通告: Wire Change for SOT23 Pkg 26/May/2009
产品目录绘图: MOSFET SOT-323, SOT-416
标准包装: 10
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 20V
电流 - 连续漏极(Id) @ 25° C: 300mA
开态Rds(最大)@ Id, Vgs @ 25° C: 1 欧姆 @ 300mA,10V
Id 时的 Vgs(th)(最大): 2.4V @ 250µA
输入电容 (Ciss) @ Vds: 45pF @ 5V
功率 - 最大: 150mW
安装类型: 表面贴装
封装/外壳: SC-70,SOT-323
供应商设备封装: SC-70-3(SOT323)
包装: 标准包装
产品目录页面: 1558 (CN2011-ZH PDF)
其它名称: MMBF2201NT1GOSDKR
MMBF2201N, NVF2201N
Power MOSFET
300 mAmps, 20 Volts
N ? Channel SC ? 70/SOT ? 323
These miniature surface mount MOSFETs low R DS(on) assure
minimal power loss and conserve energy, making these devices ideal
for use in small power management circuitry. Typical applications are
d c ? d c c o n v e r t e r s , p o w e r m a n a g e m e n t i n p o r t a b l e a n d
battery ? powered products such as computers, printers, PCMCIA
cards, cellular and cordless telephones.
http://onsemi.com
300 mAMPS, 20 VOLTS
R DS(on) = 1 W
Features
? Low R DS(on) Provides Higher Efficiency and Extends Battery Life
? Miniature SC ? 70/SOT ? 323 Surface Mount Package Saves
Board Space
? NVF Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC ? Q101
1
N ? Channel
3
?
Qualified and PPAP Capable*
These Devices are Pb ? Free and are RoHS Compliant
2
MAXIMUM RATINGS (T J = 25 ° C unless otherwise noted)
Rating Symbol Value
Unit
MARKING DIAGRAM
AND PIN ASSIGNMENT
Drain ? to ? Source Voltage
Gate ? to ? Source Voltage ? Continuous
Drain Current
? Continuous @ T A = 25 ° C
? Continuous @ T A = 70 ° C
? Pulsed Drain Current (t p ≤ 10 m s)
V DSS
V GS
I D
I D
I DM
20
± 20
300
240
750
Vdc
Vdc
mAdc
1
2
3
SC ? 70/SOT ? 323
CASE 419
STYLE 8
3
Drain
N1 M G
G
Total Power Dissipation @ T A = 25 ° C
(Note 1)
Derate above 25 ° C
Operating and Storage Temperature Range
P D
T J , T stg
150
1.2
? 55 to 150
mW
mW/ ° C
° C
1 2
Gate Source
N1 = Device Code
Thermal Resistance, Junction ? to ? Ambient R q JA 833 ° C/W
Maximum Lead Temperature for Soldering T L 260 ° C
Purposes, for 10 seconds
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Mounted on G10/FR4 glass epoxy board using minimum recommended
footprint.
M = Date Code*
G = Pb ? Free Package
(Note: Microdot may be in either location)
*Date Code orientation may vary depending
upon manufacturing location.
ORDERING INFORMATION
Device Package Shipping ?
MMBF2201NT1G
NVF2201NT1G*
SOT ? 323
(Pb ? Free)
SOT ? 323
(Pb ? Free)
3000 / Tape &
Reel
3000 / Tape &
Reel
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
? Semiconductor Components Industries, LLC, 2013
August, 2013 ? Rev. 7
1
Publication Order Number:
MMBF2201NT1/D
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