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参数资料
型号： MP2-H096-43S2-S-RF
厂商： 3M ELECTRONIC PRODUCTS DIVISION
元件分类： 电路板相叠连接器
英文描述： 96 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
封装： ROHS COMPLIANT
文件页数： 3/5页
文件大小： 1074K
代理商： MP2-H096-43S2-S-RF
3
Electronic Solutions Division
Interconnect Solutions
http://www.3M.com/interconnects/
3M is a trademark of 3M Company.
For technical, sales or ordering information call
800-225-5373
3M MetPak 2-FB Header
2 mm 4/5-Row, Vertical, Solder or Press-Fit Tail, Shouldered Pin
MP2 Series
TS-1120-C
Sheet 3 of 4
Table 1 - Connector & Row Lengths
Pin
Count
Dim. “A”
mm [inch]
Dim “C”
mm [inch]
Rows
024
11.95 [0.471]
10.00 [0.394]
4
048
23.95 [0.943]
22.00 [0.866]
4
072
35.95 [1.415]
34.00 [1.339]
4
096
47.95 [1.889]
46.00 [1.811]
4
120
59.95 [2.36]
58.00 [2.283]
4
144
71.95 [2.833]
70.00 [2.756]
4
168
83.95 [3.305]
82.00 [3.228]
4
192
95.95 [3.778]
94.00 [3.701]
4
030
11.95 [0.471]
10.00 [0.394]
5
060
23.95 [0.943]
22.00 [0.866]
5
090
35.95 [1.415]
34.00 [1.339]
5
120
47.95 [1.888]
46.00 [1.811]
5
150
59.95 [2.361]
58.00 [2.283]
5
180
71.95 [2.833]
70.00 [2.756]
5
210
83.95 [3.305]
82.00 [3.228]
5
240
95.95 [3.778]
94.00 [3.701]
5
Table 3 - Tail Length Options
Termination Option No.
Dim. “B”
Solder Tail
Press-Fit* Tail
1
4.60 [0.181]
2
3.53 [0.139]
3
2.72 [0.107]
5 (Contact 3M)
13.60 [0.535]
7 (Contact 3M)
17.00 [0.669]
*Compliant-Pin Tail
Table 4 - Plating Options
Plating
Suffix
Press-Fit
Tails*
Solder
Tails
Plating Composition
TG
(RIA E2 &
C2 apply)
(RIA E3 &
C2 apply)
0.25 μm [10 μ”] Min. Au Contact Area
2.54 μm [100 μ”] Min. SnPb Tail Area
1.27 μm [50 μ”] Min. Ni all over
TG30
(RIA E2 &
C2 apply)
(RIA E3 &
C2 apply)
0.76 μm [30 μ”] Min. Au Contact Area
2.54 μm [100 μ”] Min. SnPb Tail Area
1.27 μm [50 μ”] Min. Ni all over
TR30
(RIA E2 &
C2 apply)
(RIA E3 &
C2 apply)
0.08 μm [3 μ”] Min. Au Contact Area
0.67 μm [27 μ”] Min. PdNi Contact Area
2.54 μm [100 μ”] Min. SnPb Tail Area
1.27 μm [50 μ”] Min. Ni all over
TR40B
(RIA E2 &
C2 apply)
(RIA E3 &
C2 apply)
0.13 μm [5 μ”] Min. Hard Au Contact Area,
Lubricated
1.02 μm [40 μ”] Min. PdNi Contact Area
0.10 μm [4 μ”] Min. Pd Contact Area
2.54 μm [100 μ”] Min. SnPb Tail Area
1.27 μm [50 μ”] Min. Ni all over
FJ
(RIA E1 &
C1 apply)
(RIA E1 &
C1 apply)
0.25 μm [10 μ”] Min. Au Contact Area
5.08 μm [200 μ”] Min. Matt Whisker Mitigating
Sn Tail Area
1.27 μm [50 μ”] Min. Ni all over
KR
(RIA E1 &
C1 apply)
(RIA E1 &
C1 apply)
0.76 μm [30 μ”] Min. Au Contact Area
5.08 μm [200 μ”] Min. Matt Whisker Mitigating
Sn Tail Area
1.27 μm [50 μ”] Min. Ni all over
RF
(RIA E1 &
C1 apply)
(RIA E1 &
C1 apply)
1.27 μm [50 μ”] Min. Au Contact Area, Lubri-
cated
5.08 μm [200 μ”] Min. Matt Whisker Mitigating
Sn Tail Area
1.27 μm [50 μ”] Min. Ni all over
LR
(RIA E1 &
C1 apply)
(RIA E1 &
C1 apply)
0.08 μm [3 μ”] Min. Au Contact Area
0.67 μm [27 μ”] Min. PdNi Contact Area
5.08 μm [200 μ”] Min. Matt Whisker Mitigating
Sn Tail Area
1.27 μm [50 μ”] Min. Ni all over
PD
(RIA E1 &
C1 apply)
(RIA E1 &
C1 apply)
0.13 μm [5 μ”] Min. Hard Au Contact Area,
Lubricated
1.02 μm [40 μ”] Min. PdNi Contact Area
0.10 μm [4 μ”] Min. Pd Contact Area
5.08 μm [200 μ”] Min. Matt Whisker Mitigating
Sn Tail Area
KV
(RIA E1 &
C1 apply)
(RIA E1 &
C1 apply)
0.76 μm [30 μ”] Min. Au Dual Contact Areas
0.10 μm [4 μ”] Min. Au Needle Eye
1.27 μm [50 μ”] Min. Ni all over
Table 2 - Mate Length vs. Loading Pattern
Loading Pattern
Code
Description
Mate length
Row A
Mate length
Row B
Mate length
Row C
Mate length
Row D
Mate length
Row E
(5-Row Prod. Only)
1
All Positions Filled
5.00 [0.197]
2
All Positions Filled
6.50 [0.256]
5.00 [0.197]
3
All Positions Filled
6.50 [0.256]
5.75 [0.226]
6.50 [0.256]
4
All Positions Filled
6.50 [0.256]
5
All Positions Filled
5.75 [0.226]
7.25 [0.285]
5.75 [0.226]
6
All Positions Filled
7.25 [0.285]
5.75 [0.226]
7
All Positions Filled
6.50 [0.256]
5.75 [0.226]
5.00 [0.197]
8
All Positions Filled
6.50 [0.256]
5.00 [0.197]
6.50 [0.256]
9
All Positions Filled
5.00 [0.197]
6.50 [0.256]
5.00 [0.197]
A
All Positions Filled
5.00 [0.197]
5.75 [0.226]
6.50 [0.256]
5.75 [0.226]
5.00 [0.197]
B
All Positions Filled
5.75 [0.226]
C
All Positions Filled
5.00 [0.197]
6.50 [0.256]
5.00 [0.197]
D
All Positions Filled
5.75 [0.226]
7.25 [0.285]
5.75 [0.226]
E
All Positions Filled
7.25 [0.285]
G
All Positions Filled
7.25 [0.285]
5.75 [0.226]
5.00 [0.197]
H
All Positions Filled
5.00 [0.197]
5.75 [0.226]
7.25 [0.285]
J
All Positions Filled
8.00 [0.315]
K
All Positions Filled
5.00 [0.197]
6.50 [0.256]
7.25 [0.285]
6.50 [0.256]
5.00 [0.197]
相关PDF资料
PDF描述
MP2-H096-43S2-S-TG30 96 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
MP2-H096-43S2-S-TG 96 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
MP2-H096-43S2-S-TR30 96 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
MP2-H096-43S2-S-TR40B 96 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
MP2-H096-43S3-S-FJ 96 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
相关代理商/技术参数
参数描述
MP2-H096-44P1-S-KR 制造商:3M Electronic Products Division 功能描述:CONN HEADER VERT 96POS 4ROW GOLD 制造商:3M Electronic Products Division 功能描述:70010030578 MP2-H096-44P1-S-KR=96P/4R/MP2/HDR/SHLDR/4.60MM PRFT/30AU
MP2-H096-44P1-S-LR 功能描述:高速/模块连接器 96P/4R/MP2/HDR/SHLDR 4.60MM PRFT/30PDNI RoHS:否 制造商:Molex 系列:iPass 产品类型: 排数: 列数: 位置/触点数量:38 安装角:Right 节距:0.8 mm 安装风格:Plug 端接类型:SMD/SMT 外壳材料:Thermoplastic 触点材料:High Performance Alloy (HPA) 触点电镀:Gold
MP2-H096-44P1-S-TR30 功能描述:高速/模块连接器 180P/MP2/5R/HDR/VERT SHDR/2.72MM/ST/30PDN RoHS:否 制造商:Molex 系列:iPass 产品类型: 排数: 列数: 位置/触点数量:38 安装角:Right 节距:0.8 mm 安装风格:Plug 端接类型:SMD/SMT 外壳材料:Thermoplastic 触点材料:High Performance Alloy (HPA) 触点电镀:Gold
MP2-H096-44S1-S-LR 功能描述:硬公制连接器 96P/4R/MP2/HD/4.60MM ST/SHDR/30PDNI RoHS:否 制造商:TE Connectivity / AMP 系列:Z-Pack 产品类型:Receptacles 排数:5 位置/触点数量:110 安装角:Right 端接类型:Pin 外壳材料:Polyester 触点材料:Phosphor Bronze 触点电镀:Gold 类型:
MP2-H096-44S1-S-TR30 功能描述:高速/模块连接器 ST/SHDR/30PDNI/96P 4R/MP2/HD/4.60MM RoHS:否 制造商:Molex 系列:iPass 产品类型: 排数: 列数: 位置/触点数量:38 安装角:Right 节距:0.8 mm 安装风格:Plug 端接类型:SMD/SMT 外壳材料:Thermoplastic 触点材料:High Performance Alloy (HPA) 触点电镀:Gold
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