参数资料
型号: MPC107APX66L0
厂商: MOTOROLA INC
元件分类: 外设及接口
英文描述: MULTIFUNCTION PERIPHERAL, PPGA503
封装: PLASTIC, BGA-503
文件页数: 37/46页
文件大小: 585K
代理商: MPC107APX66L0
42
MPC107 Hardware Specifications (Rev 0.2)
PRELIMINARYSUBJECT TO CHANGE WITHOUT NOTICE
System Design Information
1.7.6 Thermal Management Information
This section provides thermal management information for the plastic ball grid array (PBGA) package for
air-cooled applications. Proper thermal control design is primarily dependent upon the system-level
designthe heat sink, airow and thermal interface material. Figure 25 depicts the die junction-to-ambient
thermal resistance for two typical cases:
1. A heat sink is not attached to the PBGA package and there exists high board-level thermal loading
of adjacent components. See Typical Upper Limit curve in Figure 25.
2. A heat sink is not attached to the PBGA package and there exists low board-level thermal loading
of adjacent components. See Typical Lower Limit curve in Figure 25.
Figure 25 shows the die junction-to-ambient resistance.
Figure 25. Die Junction-to-Ambient Thermal Resistance
15
20
25
30
35
40
45
50
0
0.5
1
1.5
2
2.5
Typical Upper Limit
Typical Lower Limit
Die
Junction-to-ambient
Thermal
Resistance
(
°C/W)
Airflow Velocity
(m/s)
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