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参数资料
| 型号： | MPC5534EVBE |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 9/60页 |
| 文件大小： | 0K |
| 描述： | BOARD EVAL FOR MPC5534 |
| 产品培训模块： | MPC55xx PitchPak Family |
| 标准包装： | 1 |
| 类型： | MCU |
| 适用于相关产品： | MPC5534 |
| 所含物品： | 评估板和演示软件 |
| 相关产品： | MPC5554MZP132R2-ND - IC MCU 2M FLASH 132MHZ 416-PBGA MPC5554MZP132-ND - IC MCU 2M FLASH 132MHZ 416-PBGA MPC5554MVR132R2-ND - IC MCU 2M FLASH 132MHZ 416-PBGA MPC5554MVR132-ND - IC MCU 2M FLASH 132MHZ 416-PBGA MPC5554AZP132-ND - IC MPU 2M FLASH 132MHZ 416-PBGA |
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Electrical Characteristics
MPC5534 Microcontroller Data Sheet, Rev. 6
Freescale Semiconductor
17
11 Power requirements for the V
DD33 supply depend on the frequency of operation, load of all I/O pins, and the voltages on the I/O
segments. Refer to Table 11 for values to calculate power dissipation for specific operation.
12 Power requirements for each I/O segment are dependent on the frequency of operation and load of the I/O pins on a particular I/O
segment, and the voltage of the I/O segment. Refer to Table 10 for values to calculate power dissipation for specific operation. The
total power consumption of an I/O segment is the sum of the individual power consumptions for each pin on the segment.
13 Maximum average RMS DC current.
14 Figure 2 shows an illustration of the IDD_STBY values interpolated for these temperature values.
15 Average current measured on automotive benchmark.
16 Peak currents can be higher on specialized code.
17 High use current measured while running optimized SPE assembly code with all channels of the eMIOS and eTPU running
autonomously, plus the eDMA transferring data continuously from SRAM to SRAM.
18 Figure 2 shows that the current specification relates to average standby operation after SRAM has been loaded with data. For power
up current see Section 3.7, “Power-Up/Down Sequencing.
19 Power requirements for the V
DD33 supply depend on the frequency of operation, load of all I/O pins, and the voltages on the I/O
segments. Refer to Table 11 for values to calculate the power dissipation for a specific operation.
20 Power requirements for each I/O segment are dependent on the frequency of operation and load of the I/O pins on a particular I/O
segment, and the voltage of the I/O segment. Refer to Table 10 for values to calculate power dissipation for specific operation. The
total power consumption of an I/O segment is the sum of the individual power consumptions for each pin on the segment.
21 Absolute value of current, measured at V
IL and VIH.
22 Weak pullup/down inactive. Measured at V
DDE = 3.6 V and VDDEH = 5.25 V. Applies to pad types: pad_fc, pad_sh, and pad_mh.
23 Maximum leakage occurs at maximum operating temperature. Leakage current decreases by approximately one-half for each 8 oC
to 12 oC, in the ambient temperature range of 50 oC to 125 oC. Applies to pad types: pad_a and pad_ae.
24 V
SSA refers to both VSSA0 and VSSA1. | VSSA0 – VSSA1 | must be < 0.1 V.
25 Up to 0.6 V during power up and power down.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MPC5534EVBE | 制造商:Freescale Semiconductor 功能描述:MPC55xx Evaluation Board |
| MPC5534EVBGHS | 功能描述:开发软件 GREEN HILLS SW CONTENT M RoHS:否 制造商:Atollic Inc. 产品:Compilers/Debuggers 用于:ARM7, ARM9, Cortex-A, Cortex-M, Cortex-R Processors |
| MPC5534EVBISYS | 功能描述:开发软件 ISYSTEMS CONTENT MPC5534 RoHS:否 制造商:Atollic Inc. 产品:Compilers/Debuggers 用于:ARM7, ARM9, Cortex-A, Cortex-M, Cortex-R Processors |
| MPC5534MVF40 | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:Microcontroller |
| MPC5534MVF40R2 | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:Microcontroller |
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