- 您现在的位置：买卖IC网 > PDF目录15742 > MPC5534EVBGHS (Freescale Semiconductor)KIT EVAL GREEN HILLS SOFTWARE PDF资料下载
参数资料
| 型号： | MPC5534EVBGHS |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 59/60页 |
| 文件大小： | 0K |
| 描述： | KIT EVAL GREEN HILLS SOFTWARE |
| 标准包装： | 1 |
| 类型： | 微控制器 |
| 适用于相关产品： | MPC5534 |
| 所含物品： | 评估板和演示软件 |
| 相关产品： | MPC5554MZP132R2-ND - IC MCU 2M FLASH 132MHZ 416-PBGA MPC5554MZP132-ND - IC MCU 2M FLASH 132MHZ 416-PBGA MPC5554MVR132R2-ND - IC MCU 2M FLASH 132MHZ 416-PBGA MPC5554MVR132-ND - IC MCU 2M FLASH 132MHZ 416-PBGA MPC5554AZP132-ND - IC MPU 2M FLASH 132MHZ 416-PBGA |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页第36页第37页第38页第39页第40页第41页第42页第43页第44页第45页第46页第47页第48页第49页第50页第51页第52页第53页第54页第55页第56页第57页第58页当前第59页第60页
MPC5534 Microcontroller Data Sheet, Rev. 6
Electrical Characteristics
Freescale Semiconductor
8
The thermal characterization parameter is measured in compliance with the JESD51-2 specification using
a 40-gauge type T thermocouple epoxied to the top center of the package case. Position the thermocouple
so that the thermocouple junction rests on the package. Place a small amount of epoxy on the thermocouple
junction and approximately 1 mm of wire extending from the junction. Place the thermocouple wire flat
against the package case to avoid measurement errors caused by the cooling effects of the thermocouple
wire.
References:
Semiconductor Equipment and Materials International
3081 Zanker Rd.
San Jose, CA., 95134
(408) 943-6900
MIL-SPEC and EIA/JESD (JEDEC) specifications are available from Global Engineering Documents at
800-854-7179 or 303-397-7956.
JEDEC specifications are available on the web at http://www.jedec.org.
1. C.E. Triplett and B. Joiner, “An Experimental Characterization of a 272 PBGA Within an Automotive
Engine Controller Module,” Proceedings of SemiTherm, San Diego, 1998, pp. 47–54.
2. G. Kromann, S. Shidore, and S. Addison, “Thermal Modeling of a PBGA for Air-Cooled Applica-
tions,” Electronic Packaging and Production, pp. 53–58, March 1998.
3. B. Joiner and V. Adams, “Measurement and Simulation of Junction to Board Thermal Resistance and
Its Application in Thermal Modeling,” Proceedings of SemiTherm, San Diego, 1999, pp. 212–220.
3.3
Package
The MPC5534 is available in packaged form. Read the package options in Section 2, “Ordering
Information.” Refer to Section 4, “Mechanicals,” for pinouts and package drawings.
3.4
EMI (Electromagnetic Interference) Characteristics
Table 4. EMI Testing Specifications 1
1 EMI testing and I/O port waveforms per SAE J1752/3 issued 1995-03. Qualification testing was performed on the MPC5554
and applied to the MPC5500 family as generic EMI performance data.
Spec
Characteristic
Minimum
Typical
Maximum
Unit
1
Scan range
0.15
—
1000
MHz
2
Operating frequency
—
fMAX
MHz
3VDD operating voltages
—
1.5
—
V
4VDDSYN, VRC33, VDD33, VFLASH, VDDE operating voltages
—
3.3
—
V
5VPP, VDDEH, VDDA operating voltages
—
5.0
—
V
6
Maximum amplitude
—
14 2
32 3
2 Measured with the single-chip EMI program.
3 Measured with the expanded EMI program.
dBuV
7
Operating temperature
—
25
oC
相关PDF资料 |
PDF描述 |
|---|---|
| V300C36E75BL | CONVERTER MOD DC/DC 36V 75W |
| MAX6440UTLSWD3+T | IC BATTERY MON SNGL SOT23-6 |
| MPC5534EVB | KIT EVALUATION MPC5534MZP80 |
| V300C36E75B3 | CONVERTER MOD DC/DC 36V 75W |
| GEC30DRXN-S734 | CONN EDGECARD 60POS DIP .100 SLD |
相关代理商/技术参数 |
参数描述 |
|---|---|
| MPC5534EVBISYS | 功能描述:开发软件 ISYSTEMS CONTENT MPC5534 RoHS:否 制造商:Atollic Inc. 产品:Compilers/Debuggers 用于:ARM7, ARM9, Cortex-A, Cortex-M, Cortex-R Processors |
| MPC5534MVF40 | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:Microcontroller |
| MPC5534MVF40R2 | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:Microcontroller |
| MPC5534MVF66 | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:Microcontroller |
| MPC5534MVF66R2 | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:Microcontroller |
发布紧急采购，3分钟左右您将得到回复。