- 您现在的位置：买卖IC网 > PDF目录80431 > MPC5534MVF80 (FREESCALE SEMICONDUCTOR INC) FLASH, 80 MHz, MICROCONTROLLER, PBGA208 PDF资料下载
参数资料
| 型号： | MPC5534MVF80 |
| 厂商： | FREESCALE SEMICONDUCTOR INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | FLASH, 80 MHz, MICROCONTROLLER, PBGA208 |
| 封装： | 17 X 17 MM, 1 MM PITCH, PLASTIC, MO-151AAF-1, MAPBGA-208 |
| 文件页数： | 45/60页 |
| 文件大小： | 1055K |
| 代理商： | MPC5534MVF80 |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页第36页第37页第38页第39页第40页第41页第42页第43页第44页当前第45页第46页第47页第48页第49页第50页第51页第52页第53页第54页第55页第56页第57页第58页第59页第60页
Electrical Characteristics
MPC5534 Microcontroller Data Sheet, Rev. 5
Freescale Semiconductor
5
3.2
Thermal Characteristics
The shaded rows in the following table indicate information specific to a four-layer board.
28
Maximum solder temperature 11
Lead free (Pb-free)
Leaded (SnPb)
TSDR
—
260.0
245.0
oC
29
Moisture sensitivity level 12
MSL
—
3
1 Functional operating conditions are given in the DC electrical specifications. Absolute maximum ratings are stress ratings only,
and functional operation at the maxima is not guaranteed. Stress beyond any of the listed maxima can affect device reliability
or cause permanent damage to the device.
2 1.5 V ± 10% for proper operation. This parameter is specified at a maximum junction temperature of 150 oC.
3 All functional non-supply I/O pins are clamped to V
SS and VDDE, or VDDEH.
4 AC signal overshoot and undershoot of up to ± 2.0 V of the input voltages is permitted for an accumulative duration of
60 hours over the complete lifetime of the device (injection current not limited for this duration).
5 Internal structures hold the voltage greater than –1.0 V if the injection current limit of 2 mA is met. Keep the negative DC
voltage greater than –0.6 V on SINB during the internal power-on reset (POR) state.
6 Internal structures hold the input voltage less than the maximum voltage on all pads powered by V
DDEH supplies, if the
maximum injection current specification is met (2 mA for all pins) and VDDEH is within the operating voltage specifications.
7 Internal structures hold the input voltage less than the maximum voltage on all pads powered by V
DDE supplies, if the maximum
injection current specification is met (2 mA for all pins) and VDDE is within the operating voltage specifications.
8 Total injection current for all pins (including both digital and analog) must not exceed 25 mA.
9 Total injection current for all analog input pins must not exceed 15 mA.
10 Lifetime operation at these specification limits is not guaranteed.
11 Moisture sensitivity profile per IPC/JEDEC J-STD-020D.
12 Moisture sensitivity per JEDEC test method A112.
Table 3. MPC5534 Thermal Characteristic
Spec
MPC5534 Thermal Characteristic
Symbol
Package
Unit
208
MAPBGA
324
PBGA
1
Junction to ambient 1, 2, natural convection (one-layer board)
1 Junction temperature is a function of: on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other board components, and board thermal resistance.
2 Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board in a horizontal position.
RJA
42
34
°C/W
2
Junction to ambient 1, 3, natural convection (four-layer board 2s2p)
3 Per JEDEC JESD51-6 with the board in a horizontal position.
RJA
26
23
°C/W
3
Junction to ambient (@200 ft./min., one-layer board)
RJMA
34
28
°C/W
4
Junction to ambient (@200 ft./min., four-layer board 2s2p)
RJMA
22
20
°C/W
5
Junction to board 4 (four-layer board 2s2p)
4 Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
RJB
15
°C/W
6
Junction to case 5
5 Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate method
(MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature.
RJC
810
°C/W
7
Junction to package top 6, natural convection
JT
22
°C/W
Table 2. Absolute Maximum Ratings 1 (continued)
Spec
Characteristic
Symbol
Min.
Max.
Unit
相关PDF资料 |
PDF描述 |
|---|---|
| MB9AF312NPMC | RISC MICROCONTROLLER, PQFP100 |
| MCF51AG128VLH | RISC MICROCONTROLLER, PQFP64 |
| MK30DN512ZVMD10 | 32-BIT, FLASH, 100 MHz, RISC MICROCONTROLLER, PBGA144 |
| MK60DN512ZVLL10 | 32-BIT, FLASH, 100 MHz, RISC MICROCONTROLLER, PQFP100 |
| MPC8569ECVTAQLJB | RISC PROCESSOR, PBGA783 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| MPC5534MVF80R2 | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:Microcontroller |
| MPC5534MVM40 | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:Microcontroller |
| MPC5534MVM40R2 | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:Microcontroller |
| MPC5534MVM66 | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:Microcontroller |
| MPC5534MVM66R2 | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:Microcontroller |
发布紧急采购，3分钟左右您将得到回复。