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| 型号： | MPC5553EVB |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 66/68页 |
| 文件大小： | 0K |
| 描述： | KIT EVAL MPC5553MZP132 |
| 标准包装： | 1 |
| 类型： | 微控制器 |
| 适用于相关产品： | MPC5553 |
| 所含物品： | 评估板和演示软件 |
| 相关产品： | MPC5553MZQ132-ND - IC MCU MPC5553 REV A 324-PBGA MPC5553MZP132-ND - IC MCU MPC5553 REV A 416-PBGA |
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Electrical Characteristics
MPC5553 Microcontroller Data Sheet, Rev. 4
Freescale Semiconductor
7
Power dissipated by adjacent components
Connect all the ground and power balls to the respective planes with one via per ball. Using fewer vias to
connect the package to the planes reduces the thermal performance. Thinner planes also reduce the thermal
performance. When the clearance between the vias leave the planes virtually disconnected, the thermal
performance is also greatly reduced.
As a general rule, the value obtained on a single-layer board is within the normal range for the tightly
packed printed circuit board. The value obtained on a board with the internal planes is usually within the
normal range if the application board has:
One oz. (35 micron nominal thickness) internal planes
Components are well separated
Overall power dissipation on the board is less than 0.02 W/cm2
The thermal performance of any component depends on the power dissipation of the surrounding
components. In addition, the ambient temperature varies widely within the application. For many natural
convection and especially closed box applications, the board temperature at the perimeter (edge) of the
package is approximately the same as the local air temperature near the device. Specifying the local
ambient conditions explicitly as the board temperature provides a more precise description of the local
ambient conditions that determine the temperature of the device.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MPC5553EVBE | 功能描述:开发板和工具包 - 其他处理器 MPC5553MZP132 EVAL Qorivva RoHS:否 制造商:Freescale Semiconductor 产品:Development Systems 工具用于评估:P3041 核心:e500mc 接口类型:I2C, SPI, USB 工作电源电压: |
| MPC5553EVBE | 制造商:Freescale Semiconductor 功能描述:MPC55xxEVB: MPC55xx Evaluation |
| MPC5553EVBGHS | 功能描述:开发软件 GREEN HILLS SW Qorivva RoHS:否 制造商:Atollic Inc. 产品:Compilers/Debuggers 用于:ARM7, ARM9, Cortex-A, Cortex-M, Cortex-R Processors |
| MPC5553EVBISYS | 功能描述:开发软件 ISYSTEMS CONTENT Qorivva RoHS:否 制造商:Atollic Inc. 产品:Compilers/Debuggers 用于:ARM7, ARM9, Cortex-A, Cortex-M, Cortex-R Processors |
| MPC5553MVF112 | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:Microcontroller |
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