参数资料
型号: MPC5554AVR132R2
厂商: FREESCALE SEMICONDUCTOR INC
元件分类: 微控制器/微处理器
英文描述: MICROCONTROLLER, PBGA416
封装: 27 X 27 MM, 1 MM PITCH, LEAD FREE, PLASTIC, MS-034AAL-1, TEPBGA-416
文件页数: 47/58页
文件大小: 1452K
代理商: MPC5554AVR132R2
Revision History for the MPC5554 Data Sheet
MPC5554 Microcontroller Data Sheet, Rev. 2.0
Freescale Semiconductor
51
Table 28 shows a continuation of the MPC5554 Revision History:
Table 28. MPC5554 Revision History (continued)
Revision
Substantive Change(s)
Date
Rev. 2.0
Table 2 Absolute Maximum Ratings:
Increased the maximum operating frequency values by 2 ns in the Max column for the 80 MHz
and 112 MHz.
Reordered rows to group devices by lead-free package types in descending frequency order,
and leaded package types.
Figure 3 Added figure to show interpolated IDDSTBY values listed in Table 9.
Table 12 FMPLL Electrical Characteristics: Grouped (2 x Cl) in Specs 12 and 13.
Table 7 Power Sequence Pin Status for Fast Pads, updated paragraph.
Table 8 Power Sequence Pin Status, updated preceding paragraph.
Table 9 DC Electrical Specifications:
Changed wording of footnote 3.
Spec 28: Corrected conditional text error showing wrong frequency.
Spec 29: Deleted frequency information.
remove redundancy,
Table 16 Flash BIU Settlings: Changed wording of footnote from “Can be changed after Analysis
and Characterization” to “These values may change after characterization.”
Deleted the words ‘not’ from footnote 2.
Changed from ‘This parameter is supplied for reference and is not guaranteed by design and
not tested’ to ‘This parameter is supplied for reference and is guaranteed by design and
tested.’
Table 22 Bus Operation Timing: Specs 5 and 6: corrected format to show the bus timing values
for various frequencies with EBTS bit = 0 and EBTS bit = 1.
Table 26 DSPI Timing: Added to beginning of footnote 1 ‘All DSPI timing specifications use the
fastest slew rate (SRC = 0b11) on pad type M or MH. DSPI signals using pad types of S or SH
have an additional delay based on the slew rate.’
Table 27 EQADC SSI Timing Characteristics:
Combined footnotes 1 and 2.
Moved footnotes 1 and 2 to Spec 2 and deleted Spec 1.
02/06/07
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