- 您现在的位置：买卖IC网 > PDF目录69036 > MPC603EFE133LX (MOTOROLA INC) 32-BIT, 133 MHz, RISC PROCESSOR, CQFP240 PDF资料下载
参数资料
| 型号： | MPC603EFE133LX |
| 厂商： | MOTOROLA INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 133 MHz, RISC PROCESSOR, CQFP240 |
| 封装： | 32 X 32 MM, 0.50 MM PITCH, WIRE BOND, CERAMIC, QFP-240 |
| 文件页数： | 28/32页 |
| 文件大小： | 149K |
| 代理商： | MPC603EFE133LX |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页当前第28页第29页第30页第31页第32页
PID6-603e Hardware Specifications, Rev 2
5
Table 2 provides the recommended operating conditions for the 603e.
Table 3 provides the packages thermal characteristics for the 603e.
Table 4 provides the DC electrical characteristics for the 603e.
Table 2. Recommended Operating Conditions
Characteristic
Symbol
Value
Unit
Notes
Core supply voltage
Vdd
3.3 ± 165mv
V
PLL supply voltage
AVdd
3.3 ± 165mv
V
I/O supply voltage
OVdd
3.3 ± 165mv
V
Input voltage
Vin
-0.3 to 5.5
V
Die-junction temperature
Tj
0 to 105
°C
2
Notes:
1. These are the recommended and tested operating conditions. Proper device operation outside of these
conditions is not guaranteed.
2. The extended temperature parts have die-junction temperature of -40 to 105 °C.
Table 3. Package Thermal Characteristics
Characteristic
Symbol
Value
Rating
Wire-bond CQFP package die junction-to-case thermal resistance
(typical)
θ
JC
2.2
°C/W
Wire-bond CQFP package die junction-to-lead thermal resistance
(typical)
θ
JB
18.0
°C/W
CBGA package die junction-to-case thermal resistance (typical)
θ
JC
0.08
°C/W
CBGA package die junction-to-ball thermal resistance (typical)
θ
JB
2.8
°C/W
Note: Refer to Section 1.8, “System Design Information,” for more details about thermal management.
Table 4. DC Electrical Specifications
At recommended operating conditions. See Table 2.
Characteristic
Symbol
Min
Max
Unit
Notes
Input high voltage (all inputs except SYSCLK)
VIH
2.0
5.5
V
Input low voltage (all inputs except SYSCLK)
VIL
-0.3
0.8
V
SYSCLK input high voltage
CVIH
2.4
5.5
V
SYSCLK input low voltage
CVIL
-0.3
0.4
V
Input leakage current, Vin = 3.465 V
Vin = 5.5 V
Iin
—10
A
1
Iin
—
245
A
1
Hi-Z (off-state) leakage current, Vin = 3.465 V
Vin = 5.5 V
ITSI
—10
A
1
ITSI
—
245
A
1
Output high voltage, IOH = –9 mA
VOH
2.4
—
V
1
Output low voltage, IOL = 14 mA
VOL
—
0.4
V
相关PDF资料 |
PDF描述 |
|---|---|
| MPC603EFE100LX | 32-BIT, 100 MHz, RISC PROCESSOR, CQFP240 |
| MPC604AFX120 | 32-BIT, 120 MHz, RISC PROCESSOR, CQFP304 |
| MPC7410RX500LX | 32-BIT, 500 MHz, RISC PROCESSOR, CBGA360 |
| MPC7410RX450LX | 32-BIT, 450 MHz, RISC PROCESSOR, CBGA360 |
| MPC8241LZP200X | 32-BIT, 200 MHz, RISC PROCESSOR, PBGA357 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| MPC603EFE133TN | 制造商:未知厂家 制造商全称:未知厂家 功能描述:PowerPC 603e RISC Microprocessor Family: PID6-603e (Stretch) Part Number Specifications |
| MPC603ERX100LN | 制造商:未知厂家 制造商全称:未知厂家 功能描述:PowerPC 603e RISC Microprocessor Family: PID6-603e (Stretch) Part Number Specifications |
| MPC603ERX100TN | 制造商:未知厂家 制造商全称:未知厂家 功能描述:PowerPC 603e RISC Microprocessor Family: PID6-603e (Stretch) Part Number Specifications |
| MPC603ERX133LN | 制造商:未知厂家 制造商全称:未知厂家 功能描述:PowerPC 603e RISC Microprocessor Family: PID6-603e (Stretch) Part Number Specifications |
| MPC603ERX133TN | 制造商:未知厂家 制造商全称:未知厂家 功能描述:PowerPC 603e RISC Microprocessor Family: PID6-603e (Stretch) Part Number Specifications |
发布紧急采购，3分钟左右您将得到回复。