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参数资料
型号： MPC7410RX500LE
厂商： Freescale Semiconductor
文件页数： 41/56页
文件大小： 0K
描述： IC MPU 32BIT 500MHZ PPC 360-CBGA
标准包装： 44
系列： MPC74xx
处理器类型： 32-位 MPC74xx PowerPC
速度： 500MHz
电压： 1.8V
安装类型： 表面贴装
封装/外壳： 360-BBGA，FCCBGA
供应商设备封装： 360-FCCBGA（25x25）
包装： 托盘
MPC7410 RISC Microprocessor Hardware Specifications, Rev. 6.1
46
Freescale Semiconductor
System Design Information
Thermagon Inc.
888-246-9050
4707 Detroit Ave.
Cleveland, OH 44102
Internet: www.thermagon.com
8.8.3 Heat Sink Selection Example
For preliminary heat sink sizing, the die-junction temperature can be expressed as follows:
Tj = Ta + Tr + (θjc + θint + θsa) × Pd
where:
Tj is the die-junction temperature
Ta is the inlet cabinet ambient temperature
Tr is the air temperature rise within the computer cabinet
θjc is the junction-to-case thermal resistance
θint is the adhesive or interface material thermal resistance
θ
sa is the heat sink base-to-ambient thermal resistance
Pd is the power dissipated by the device
During operation the die-junction temperatures (Tj) should be maintained less than the value specified in Table 3.
The temperature of the air cooling the component greatly depends upon the ambient inlet air temperature and the air
temperature rise within the electronic cabinet. An electronic cabinet inlet-air temperature (Ta) may range from 30°
to 40°C. The air temperature rise within a cabinet (Tr) may be in the range of 5° to 10°C. The thermal resistance of
the thermal interface material (
θint) is typically about 1°C/W. Assuming a Ta of 30°C, a Tr of 5°C, a CBGA package
θ
jc = 0.03, and a power consumption (Pd) of 5.0 W, the following expression for Tj is obtained:
Die-junction temperature:
Tj = 30°C + 5°C + (0.03°C/W + 1.0°C/W + θsa) × 5.0 W
For a Thermalloy heat sink #2328B, the heat sink-to-ambient thermal resistance (
θ
sa) versus airflow velocity is
shown in Figure 30.
Assuming an air velocity of 0.5 m/s, we have an effective Rsa of 7°C/W, thus
Tj = 30°C + 5°C + (0.03°C/W + 1.0°C/W + 7°C/W) × 5.0 W,
resulting in a die-junction temperature of approximately 75°C which is well within the maximum operating
temperature of the component.
Other heat sinks offered by Aavid Thermalloy, Alpha Novatech, The Bergquist Company, IERC, and Wakefield
Engineering offer different heat sink-to-ambient thermal resistances, and may or may not need airflow.
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MPC7410THX400NE 制造商:Freescale Semiconductor 功能描述:MPU MPC74XX RISC 64BIT 0.18UM 400MHZ 1.8V/2.5V/3.3V 360FCCBG - Bulk
MPC7410THX450NE 功能描述:微处理器 - MPU NT NITCE RV1.4,1.8V -40C RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
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