参数资料
型号: MPC755BRX350TE
厂商: Freescale Semiconductor
文件页数: 2/56页
文件大小: 0K
描述: MCU HIP4DP 350MHZ 360-CBGA
标准包装: 44
系列: MPC7xx
处理器类型: 32-位 MPC7xx PowerPC
速度: 350MHz
电压: 2V
安装类型: 表面贴装
封装/外壳: 360-BBGA,FCCBGA
供应商设备封装: 360-FCCBGA(25x25)
包装: 托盘
MPC755 RISC Microprocessor Hardware Specifications, Rev. 8
10
Freescale Semiconductor
Electrical and Thermal Characteristics
Table 6 provides the DC electrical characteristics for the MPC755.
Table 5. Thermal Sensor Specifications
At recommended operating conditions (see Table 3)
Characteristic
Min
Max
Unit
Notes
Temperature range
0
127
°C
1
Comparator settling time
20
s
2, 3
Resolution
4
°C
3
Accuracy
–12
+12
°C
3
Notes:
1. The temperature is the junction temperature of the die. The thermal assist unit’s raw output does not indicate an absolute
temperature, but must be interpreted by software to derive the absolute junction temperature. For information about the use
and calibration of the TAU, see Freescale Application Note AN1800/D, Programming the Thermal Assist Unit in the MPC750
Microprocessor.
2. The comparator settling time value must be converted into the number of CPU clocks that need to be written into the THRM3
SPR.
3. Guaranteed by design and characterization.
Table 6. DC Electrical Specifications
At recommended operating conditions (see Table 3)
Characteristic
Nominal
Bus
Voltage 1
Symbol
Min
Max
Unit
Notes
Input high voltage (all inputs except SYSCLK)
2.5
VIH
1.6
(L2)OVDD + 0.3
V
2, 3
3.3
VIH
2.0
(L2)OVDD + 0.3
V
2, 3
Input low voltage (all inputs except SYSCLK)
2.5
VIL
–0.3
0.6
V
2
3.3
VIL
–0.3
0.8
V
SYSCLK input high voltage
2.5
KVIH
1.8
OVDD + 0.3
V
3.3
KVIH
2.4
OVDD + 0.3
V
SYSCLK input low voltage
2.5
KVIL
–0.3
0.4
V
3.3
KVIL
–0.3
0.4
V
Input leakage current,
Vin = L2OVDD/OVDD
Iin
—10
A
2, 3
High-Z (off-state) leakage current,
Vin = L2OVDD/OVDD
ITSI
10
A
2, 3, 5
Output high voltage, IOH = –6 mA
2.5
VOH
1.7
V
3.3
VOH
2.4
V
Output low voltage, IOL = 6 mA
2.5
VOL
—0.45
V
3.3
VOL
—0.4
V
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